Shidner; David
Patent Applications and Registrations
Patent applications and USPTO patent grants for Shidner; David.The latest application filed is for "methods of making chemical mechanical polishing layers having improved uniformity".
- Shidner; David - Wilmington DE
- Shidner; David - Newark DE
| Patent | Date |
|---|---|
| Methods Of Making Chemical Mechanical Polishing Layers Having Improved Uniformity App 20180311792 - Qian; Bainian ; et al. | 2018-11-01 |
| Polishing pads for chemical mechanical planarization Grant 6,860,802 - Vishwanathan , et al. March 1, 2 | 2005-03-01 |
| Polishing pads for chemical mechanical planarization App 20050020082 - Vishwanathan, Arun ; et al. | 2005-01-27 |
| Hydrolytically stable grooved polishing pads for chemical mechanical planarization Grant 6,749,485 - James , et al. June 15, 2 | 2004-06-15 |
| Grooved polishing pads for chemical mechanical planarization Grant 6,736,709 - James , et al. May 18, 2 | 2004-05-18 |
| Polishing pads for chemical mechanical planarization Grant 6,582,283 - James , et al. June 24, 2 | 2003-06-24 |
| Polishing pads for chemical mechanical planarization App 20030027500 - James, David B. ; et al. | 2003-02-06 |
| Polishing pads for chemical mechanical planarization Grant 6,454,634 - James , et al. September 24, 2 | 2002-09-24 |
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