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name:-0.030120849609375
name:-0.013245105743408
name:-0.00041103363037109
Shida; Hirotaka Patent Filings

Shida; Hirotaka

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shida; Hirotaka.The latest application filed is for "chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method for semiconductor device".

Company Profile
0.15.25
  • Shida; Hirotaka - Yokkaichi-shi JP
  • Shida; Hirotaka - Sumida-ku JP
  • Shida; Hirotaka - Yokkaichi N/A JP
  • Shida; Hirotaka - Tokyo JP
  • Shida; Hirotaka - Mie-ken JP
  • Shida; Hirotaka - Mie JP
  • Shida; Hirotaka - Chuo-ku JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Chemical Mechanical Polishing Aqueous Dispersion And Chemical Mechanical Polishing Method For Semiconductor Device
App 20140011360 - NAMIE; Yuuji ;   et al.
2014-01-09
Chemical Mechanical Polishing Pad And Chemical Mechanical Polishing Method Using Same
App 20130316621 - Maekawa; Ayako ;   et al.
2013-11-28
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method for semiconductor device
Grant 8,574,330 - Namie , et al. November 5, 2
2013-11-05
Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method
Grant 8,506,359 - Shida , et al. August 13, 2
2013-08-13
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
Grant 8,492,276 - Abe , et al. July 23, 2
2013-07-23
Chemical mechanical polishing aqueous dispersion, method of preparing the same, chemical mechanical polishing aqueous dispersion preparation kit, and chemical mechanical polishing method
Grant 8,480,920 - Shida , et al. July 9, 2
2013-07-09
Chemical mechanical polishing aqueous dispersion preparation set, method of preparing chemical mechanical polishing aqueous dispersion, chemical mechanical polishing aqueous dispersion, and chemical mechanical polishing method
Grant 8,470,195 - Kunitani , et al. June 25, 2
2013-06-25
Pad For Chemical Mechanical Polishing And Method Of Chemical Mechanical Polishing Using Same
App 20120322348 - Yokoi; Katsutaka ;   et al.
2012-12-20
Surface treatment composition, surface treatment method, and method for manufacturing semiconductor device
Grant 8,257,504 - Mori , et al. September 4, 2
2012-09-04
Chemical mechanical polishing method and method of manufacturing semiconductor device
Grant 8,119,517 - Shida , et al. February 21, 2
2012-02-21
Aqueous Dispersion For Chemical Mechanical Polishing, Chemical Mechanical Polishing Method, Kit For Chemical Mechanical Polishing, And Kit For Preparing Aqueous Dispersion For Chemical Mechanical Polishing
App 20110250756 - UCHIKURA; Kazuhito ;   et al.
2011-10-13
Aqueous Dispersion For Chemical Mechanical Polishing And Chemical Mechanical Polishing Method
App 20110081780 - Shida; Hirotaka ;   et al.
2011-04-07
Aqueous Dispersion For Chemical Mechanical Polishing And Chemical Mechanical Polishing Method
App 20110053462 - Shida; Hirotaka ;   et al.
2011-03-03
Surface Treatment Composition, Surface Treatment Method, And Method For Manufacturing Semiconductor Device
App 20100311630 - MORI; Yasumasa ;   et al.
2010-12-09
Chemical Mechanical Polishing Aqueous Dispersion, Method Of Preparing The Same, Chemical Mechanical Polishing Aqueous Dispersion Preparation Kit, And Chemical Mechanical Polishing Method
App 20100252774 - SHIDA; Hirotaka ;   et al.
2010-10-07
Aqueous Dispersion For Chemical Mechanical Polishing And Method For Preparing The Same, Kit For Preparing Aqueous Dispersion For Chemical Mechanical Polishing, And Chemical Mechanical Polishing Method For Semiconductor Device
App 20100221918 - Takemura; Akihiro ;   et al.
2010-09-02
Chemical Mechanical Polishing Aqueous Dispersion And Chemical Mechanical Polishing Method
App 20100075501 - ABE; Taichi ;   et al.
2010-03-25
Aqueous Dispersion For Chemical Mechanical Polishing, Chemical Mechanical Polishing Method, And Kit For Preparing Aqueous Dispersion For Chemical Mechanical Polishing
App 20090302266 - Takemura; Akihiro ;   et al.
2009-12-10
Chemical Mechanical Polishing Method And Method Of Manufacturing Semiconductor Device
App 20090239373 - Shida; Hirotaka ;   et al.
2009-09-24
Aqueous Dispersion For Chemical Mechanical Polishing And Chemical Mechanical Polishing Method For Semiconductor Device
App 20090221213 - Namie; Yuuji ;   et al.
2009-09-03
Chemical Mechanical Polishing Method
App 20090181540 - Shida; Hirotaka ;   et al.
2009-07-16
Chemical mechanical polishing method
Grant 7,560,384 - Shida , et al. July 14, 2
2009-07-14
Aqueous Dispersion For Chemical Mechanical Polishing, Chemical Mechanical Polishing Method, Kit For Chemical Mechanical Polishing, And Kit For Preparing Aqueous Dispersion For Chemical Mechanical Polishing
App 20090124172 - Uchikura; Kazuhito ;   et al.
2009-05-14
Chemical Mechanical Polishing Aqueous Dispersion Preparation Set, Method Of Preparing Chemical Mechanical Polishing Aqueous Dispersion, Chemical Mechanical Polishing Aqueous Dispersion, And Chemical Mechanical Polishing Method
App 20080318427 - KUNITANI; Eiichirou ;   et al.
2008-12-25
Chemical Mechanical Polishing Agent Kit And Chemical Mechanical Polishing Method Using The Same
App 20080274620 - SHIDA; Hirotaka ;   et al.
2008-11-06
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
Grant 7,378,349 - Konno , et al. May 27, 2
2008-05-27
Cleaning Composition, Cleaning Method, And Manufacturing Method Of Semiconductor Device
App 20080045016 - Andou; Michiaki ;   et al.
2008-02-21
Chemical Mechanical Polishing Method And Method Of Manufacturing Semiconductor Device
App 20070128874 - SHIDA; Hirotaka ;   et al.
2007-06-07
Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing process, and process for producing semiconductor devices
App 20070049180 - Shida; Hirotaka ;   et al.
2007-03-01
Chemical mechanical polishing method
App 20060186089 - Shida; Hirotaka ;   et al.
2006-08-24
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
App 20050227451 - Konno, Tomohisa ;   et al.
2005-10-13
Chemical mechanical polishing agent kit and chemical mechanical polishing method using the same
App 20040237413 - Shida, Hirotaka ;   et al.
2004-12-02
Aqueous dispersion and coated product
Grant 6,726,997 - Tamori , et al. April 27, 2
2004-04-27
Aqueous dispersion and coated product
App 20030073779 - Tamori, Kouji ;   et al.
2003-04-17

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