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Patent applications and USPTO patent grants for Shibuya; Yohsuke.The latest application filed is for "sputtering apparatus".
Patent | Date |
---|---|
Sputtering apparatus Grant 9,928,998 - Shibuya March 27, 2 | 2018-03-27 |
Electronic component manufacturing method and electrode structure Grant 9,437,702 - Matsuo , et al. September 6, 2 | 2016-09-06 |
Sputtering Apparatus App 20160247667 - Shibuya; Yohsuke | 2016-08-25 |
Electronic Component Manufacturing Method And Electrode Structure App 20140319676 - MATSUO; Akira ;   et al. | 2014-10-30 |
Electronic component manufacturing method including step of embedding metal film Grant 8,835,296 - Wakayanagi , et al. September 16, 2 | 2014-09-16 |
Sputtering Apparatus App 20130277213 - SHIBUYA; Yohsuke | 2013-10-24 |
Substrate support device and plasma processing apparatus Grant 8,252,118 - Shibuya , et al. August 28, 2 | 2012-08-28 |
Electronic Component Manufacturing Method Including Step Of Embedding Metal Film App 20120161322 - Wakayanagi; Shunichi ;   et al. | 2012-06-28 |
Magnetron Sputtering Apparatus And Electronic Component Manufacturing Method App 20120073960 - SHIBUYA; Yohsuke ;   et al. | 2012-03-29 |
Substrate Support Device And Plasma Processing Apparatus App 20090308537 - Shibuya; Yohsuke ;   et al. | 2009-12-17 |
Substrate Holding Apparatus App 20090283976 - Kaneko; Kazuaki ;   et al. | 2009-11-19 |
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