Shibayama; Koichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shibayama; Koichi.The latest application filed is for "roughed cured material and laminated".

Company Profile

0.10.19

Shibayama; Koichi - Tsukuba JP
Shibayama; Koichi - Tsukuba-shi JP
Shibayama; Koichi - Ibaraki JP
Shibayama; Koichi - Kawanishi JP
Shibayama; Koichi - Osaka JP
Shibayama, Koichi - Mishima-gun Osaka
Shibayama, Koichi - Hyogo JP
Shibayama, Koichi - Otsu-shi JP
Shibayama; Koichi - Kawasaki-shi Kanagawa-Pref. JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Preliminary-cured material, roughened preliminary-cured material, and laminated body Grant 9,120,293 - Yokota , et al. September 1, 2	2015-09-01
Roughed Cured Material And Laminated App 20130337229 - Kobayashi; Takayuki ; et al.	2013-12-19
Preliminary-cured Material, Roughened Preliminary-cured Material, And Laminated Body App 20130108861 - Yokota; Reona ; et al.	2013-05-02
Resin Composition And Multilayer Resin Film Employing The Same App 20110003914 - Yokota; Reona ; et al.	2011-01-06
Resin composition Grant 7,754,803 - Fujiwara , et al. July 13, 2	2010-07-13
Thermosetting resin composition, resin sheet and resin sheet for insulated substrate Grant 7,709,085 - Shibayama , et al. May 4, 2	2010-05-04
Resin composition of layered silicate Grant 7,682,691 - Akaho , et al. March 23, 2	2010-03-23
Thermosetting Resin Composition, Material For Substrate And Film For Substrate App 20090267263 - Shibayama; Koichi ; et al.	2009-10-29
Thermoplastic Resin Composition, Material For Substrate And Film For Substrate App 20090256283 - Shibayama; Koichi ; et al.	2009-10-15
Material For Insulating Substrate, Printed Board, Laminate, Copper Foil With Resin, Copper-clad Laminate, Polymide Film, Film For Tab, And Prepreg App 20080268257 - Yonezawa; Koji ; et al.	2008-10-30
Material For Insulating Substrate, Printed Board, Laminate, Copper Foil With Resin, Copper-clad Laminate, Polyimide Film For Tab, And Prepreg App 20080268237 - Yonezawa; Koji ; et al.	2008-10-30
Thermosetting Resin Composition, Resin Sheet and Resin Sheet for Insulated Substrate App 20080233386 - Shibayama; Koichi ; et al.	2008-09-25
Thermosetting resin composition and its article App 20070191555 - Ishida; Hatsuo ; et al.	2007-08-16
Thermosetting resin composition, material for substrate and film for substrate App 20070148442 - Shibayama; Koichi ; et al.	2007-06-28
Thermoplastic resin composition, material for substrate and film for substrate App 20070072963 - Shibayama; Koichi ; et al.	2007-03-29
Thermoplastic foam and method for production thereof Grant 7,173,068 - Iwasa , et al. February 6, 2	2007-02-06
Sheet-form molding App 20050260404 - Iwade, Tetsunari ; et al.	2005-11-24
Polyolefin resin composition Grant 6,924,334 - Fukatani , et al. August 2, 2	2005-08-02
Resin composition App 20050165151 - Fujiwara, Akihiko ; et al.	2005-07-28
Thermoplastic foam and method for production thereof Grant 6,906,119 - Iwasa , et al. June 14, 2	2005-06-14
Resin composition App 20050107497 - Akaho, Kazunori ; et al.	2005-05-19
Thermoplastic foam and method for production thereof App 20050020704 - Iwasa, Koichiro ; et al.	2005-01-27
Material for insulating substrate, printed board, laminate, copper foil with resin, copper-clad laminate, polymidefilm, film for tab, and prepreg App 20040053061 - Yonezawa, Koji ; et al.	2004-03-18
Process for preparing polymer by using copper compound App 20020026031 - Shibayama, Koichi	2002-02-28
Control system for storing data in accordance with predefined characteristics thereof Grant 6,256,644 - Shibayama July 3, 2	2001-07-03
Expandable polyolefin resin compositions Grant 5,304,580 - Shibayama , et al. April 19, 1	1994-04-19

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