Shibata; Kazutaka

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shibata; Kazutaka.The latest application filed is for "semiconductor device with lead terminals having portions thereof extending obliquely".

Company Profile

0.65.54

Shibata; Kazutaka - Kyoto JP
SHIBATA; Kazutaka - Odawara-shi Kanagawa
Shibata, Kazutaka - Kyoto-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device with lead terminals having portions thereof extending obliquely Grant 10,886,204 - Shibata January 5, 2	2021-01-05
Semiconductor Device With Lead Terminals Having Portions Thereof Extending Obliquely App 20190348348 - SHIBATA; Kazutaka	2019-11-14
Semiconductor device with lead terminals having portions thereof extending obliquely Grant 10,388,595 - Shibata A	2019-08-20
Semiconductor Device With Lead Terminals Having Portions Thereof Extending Obliquely App 20180047658 - SHIBATA; Kazutaka	2018-02-15
Semiconductor device with lead terminals having portions thereof extending obliquely Grant 9,812,382 - Shibata November 7, 2	2017-11-07
Semiconductor Device With Lead Terminals Having Portions Thereof Extending Obliquely App 20170011990 - SHIBATA; Kazutaka	2017-01-12
Semiconductor device with lead terminals having portions thereof extending obliquely Grant 9,472,492 - Shibata October 18, 2	2016-10-18
Valve And Fuel Cell System Using The Valve App 20150303498 - NAKAMURA; Kenji ; et al.	2015-10-22
Semiconductor Device With Lead Terminals Having Portions Thereof Extending Obliquely App 20150255379 - SHIBATA; Kazutaka	2015-09-10
Semiconductor device with lead terminals having portions thereof extending obliquely Grant 9,064,855 - Shibata June 23, 2	2015-06-23
Semiconductor Device With Lead Terminals Having Portions Thereof Extending Obliquely App 20140103513 - SHIBATA; Kazutaka	2014-04-17
Semiconductor device with lead terminals having portions thereof extending obliquely Grant 8,637,976 - Shibata January 28, 2	2014-01-28
Semiconductor Device With Lead Terminals Having Portions Thereof Extending Obliquely App 20130207251 - SHIBATA; Kazutaka	2013-08-15
Semiconductor device with lead terminals having portions thereof extending obliquely Grant 8,421,209 - Shibata April 16, 2	2013-04-16
Semiconductor Device With Lead Terminals Having Portions Thereof Extending Obliquely App 20110316136 - Shibata; Kazutaka	2011-12-29
Semiconductor device with lead terminals having portions thereof extending obliquely Grant 8,026,591 - Shibata September 27, 2	2011-09-27
Semiconductor device with lead frame having lead terminals with wide portions of trapezoidal cross section App 20100176499 - Shibata; Kazutaka	2010-07-15
Semiconductor device having a stacked chip structure App 20100164087 - Shibata; Kazutaka	2010-07-01
Semiconductor device with lead frame having lead terminals with wide portions of trapezoidal cross section Grant 7,705,444 - Shibata April 27, 2	2010-04-27
Semiconductor device having a stacked chip structure Grant 7,687,896 - Shibata March 30, 2	2010-03-30
Semiconductor chip and semiconductor device using the same, and method of fabricating semiconductor chip Grant 7,589,415 - Hikita , et al. September 15, 2	2009-09-15
Semiconductor device and method for manufacturing the same Grant 7,384,863 - Shibata June 10, 2	2008-06-10
Semiconductor device and manufacturing method thereof App 20080128906 - Shibata; Kazutaka	2008-06-05
Semiconductor device and manufacturing method thereof Grant 7,358,618 - Shibata April 15, 2	2008-04-15
Semiconductor device and the manufacturing method for the same Grant 7,345,368 - Shibata March 18, 2	2008-03-18
Semiconductor chip with external connecting terminal Grant 7,339,264 - Shibata March 4, 2	2008-03-04
Semiconductor device and manufacturing method thereof Grant 7,329,603 - Shibata February 12, 2	2008-02-12
Semiconductor device and manufacturing method for the same App 20080014719 - SHIBATA; Kazutaka	2008-01-17
Mounting structure of semiconductor chip, semiconductor device and method of making the semiconductor device Grant 7,285,446 - Shibata October 23, 2	2007-10-23
Semiconductor chip with external connecting terminal Grant 7,262,490 - Shibata August 28, 2	2007-08-28
Semiconductor device and method for manufacturing same Grant 7,247,518 - Shibata July 24, 2	2007-07-24
Semiconductor device and fabrication process therefor Grant 7,192,870 - Shibata , et al. March 20, 2	2007-03-20
Semiconductor device with multi-staged cut side surfaces Grant 7,180,194 - Shibata February 20, 2	2007-02-20
Semiconductor device and the manufacturing method for the same App 20060273434 - Shibata; Kazutaka	2006-12-07
Semiconductor device App 20060275957 - Shibata; Kazutaka	2006-12-07
Semiconductor chip with external connecting terminal Grant 7,138,298 - Shibata November 21, 2	2006-11-21
Semiconductor device and method for manufacturing the same Grant 7,129,110 - Shibata October 31, 2	2006-10-31
Semiconductor device Grant 7,091,591 - Shibata August 15, 2	2006-08-15
Semiconductor device Grant 7,057,294 - Shibata June 6, 2	2006-06-06
Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device Grant 7,045,900 - Hikita , et al. May 16, 2	2006-05-16
Production process for semiconductor device Grant 7,009,294 - Hikita , et al. March 7, 2	2006-03-07
Semiconductor device Grant 6,967,396 - Shibata November 22, 2	2005-11-22
Semiconductor device and fabrication process therefor App 20050242445 - Shibata, Kazutaka ; et al.	2005-11-03
Semiconductor device and fabrication process therefor Grant 6,936,499 - Shibata , et al. August 30, 2	2005-08-30
Semiconductor device and method of producing the same App 20050146055 - Shibata, Kazutaka	2005-07-07
Semiconductor chip external connecting terminal App 20050146056 - Shibata, Kazutaka	2005-07-07
Semiconductor chip with external connecting terminal App 20050146032 - Shibata, Kazutaka	2005-07-07
Mounting structure of semiconductor chip, semiconductor device and method of making the semiconductor device App 20050142691 - Shibata, Kazutaka	2005-06-30
Semiconductor chip with external connecting terminal Grant 6,870,248 - Shibata March 22, 2	2005-03-22
Semiconductor device and method for manufacturing same Grant 6,867,501 - Shibata March 15, 2	2005-03-15
Semiconductor device and method for manufacturing the same App 20050032334 - Shibata, Kazutaka	2005-02-10
Semiconductor device and manufacturing method thereof App 20040266139 - Shibata, Kazutaka	2004-12-30
Method for manufacturing semiconductor device Grant 6,835,593 - Shibata December 28, 2	2004-12-28
Method of cutting a wafer into individual chips Grant 6,818,550 - Shibata November 16, 2	2004-11-16
Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device App 20040222521 - Hikita, Junichi ; et al.	2004-11-11
Semiconductor device with compact package Grant 6,815,829 - Shibata November 9, 2	2004-11-09
Semiconductor device having opposed and connected semiconductor chips with lateral deviation confirming electrodes Grant 6,815,832 - Shibata November 9, 2	2004-11-09
Semiconductor device and lead frame used therefor App 20040169270 - Shibata, Kazutaka	2004-09-02
Semiconductor device and method for manufacturing the same App 20040169286 - Shibata, Kazutaka	2004-09-02
Method of surface-mounting electronic components Grant 6,782,615 - Shibata , et al. August 31, 2	2004-08-31
Semiconductor device Grant 6,781,247 - Shibata August 24, 2	2004-08-24
Semiconductor device with warp preventing board joined thereto Grant 6,777,787 - Shibata August 17, 2	2004-08-17
Production process for semiconductor device App 20040152236 - Hikita, Junichi ; et al.	2004-08-05
Semiconductor device App 20040140555 - Shibata, Kazutaka	2004-07-22
Method for manufacturing semiconductor device App 20040137708 - Shibata, Kazutaka	2004-07-15
Semiconductor device and method for manufacturing same App 20040115867 - Shibata, Kazutaka	2004-06-17
Semiconductor device with chip-on-chip construction joined via a low-melting point metal layer Grant 6,734,556 - Shibata May 11, 2	2004-05-11
Semiconductor device Grant 6,727,582 - Shibata April 27, 2	2004-04-27
Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device Grant 6,724,084 - Hikita , et al. April 20, 2	2004-04-20
Semiconductor device having a warp preventing sheet Grant 6,717,274 - Shibata April 6, 2	2004-04-06
Semiconductor device and lead frame used therefor Grant 6,710,431 - Shibata March 23, 2	2004-03-23
Resin sealed semiconductor device Grant 6,700,189 - Shibata March 2, 2	2004-03-02
Production process for semiconductor device Grant 6,696,347 - Hikita , et al. February 24, 2	2004-02-24
Semiconductor device and manufacturing method thereof App 20040021234 - Shibata, Kazutaka	2004-02-05
Semiconductor device and fabrication process therefor App 20030199120 - Shibata, Kazutaka ; et al.	2003-10-23
Chip on chip semiconductor device Grant 6,635,962 - Shibata , et al. October 21, 2	2003-10-21
Resin-packaged semiconductor device Grant 6,627,981 - Shibata September 30, 2	2003-09-30
Semiconductor device and method of making the same Grant 6,620,652 - Shibata September 16, 2	2003-09-16
Semiconductor device having a warp preventing sheet App 20030168723 - Shibata, Kazutaka	2003-09-11
Semiconductor device and production process thereof Grant 6,605,490 - Shibata August 12, 2	2003-08-12
Semiconductor device reinforced by a highly elastic member made of a synthetic resin Grant 6,593,652 - Shibata July 15, 2	2003-07-15
Semiconductor device and method for manufacturing same App 20030080410 - Shibata, Kazutaka	2003-05-01
Semiconductor device App 20030075791 - Shibata, Kazutaka	2003-04-24
Semiconductor device App 20030062611 - Shibata, Kazutaka	2003-04-03
Semiconductor device App 20030062620 - Shibata, Kazutaka	2003-04-03
Semiconductor device and method for manufacturing the same App 20030013233 - Shibata, Kazutaka	2003-01-16
Semiconductor device App 20030011069 - Shibata, Kazutaka	2003-01-16
Semiconductor device and production process thereof App 20020180059 - Shibata, Kazutaka	2002-12-05
Mounting structure of semiconductor chip, semiconductor device and method of making the semiconductor device App 20020173069 - Shibata, Kazutaka	2002-11-21
Semiconductor device App 20020158319 - Shibata, Kazutaka	2002-10-31
Semiconductor device and its manufacturing method App 20020149117 - Shibata, Kazutaka	2002-10-17
Semiconductor chip and semiconductor device having a chip-on-chip structure Grant 6,462,420 - Hikita , et al. October 8, 2	2002-10-08
Structure of semiconductor chip suitable for chip-on-board system and methods of fabricating and mounting the same Grant 6,461,890 - Shibata October 8, 2	2002-10-08
Semiconductor device and method for manufacturing thereof Grant 6,458,609 - Hikita , et al. October 1, 2	2002-10-01
Semiconductor device reinforced by a highly elastic member made of a synthetic resin App 20020125564 - Shibata, Kazutaka	2002-09-12
Production of semiconductor device App 20020127773 - Shibata, Kazutaka ; et al.	2002-09-12
Semiconductor chip and semiconductor device using the same, and method of fabricating semiconductor chip App 20020109133 - Hikita, Junichi ; et al.	2002-08-15
Semiconductor device and fabrication process therefor App 20020093085 - Shibata, Kazutaka ; et al.	2002-07-18
Method of forming through-holes in a wafer and then dicing to form stacked semiconductor devices Grant 6,391,685 - Hikita , et al. May 21, 2	2002-05-21
Semiconductor chip and semiconductor device having a chip-on-chip structure App 20020056899 - Hikita, Junichi ; et al.	2002-05-16
Semiconductor device App 20020041011 - Shibata, Kazutaka	2002-04-11
Semiconductor device and lead frame used therefor App 20020041010 - Shibata, Kazutaka	2002-04-11
Semiconductor device Grant 6,369,407 - Hikita , et al. April 9, 2	2002-04-09
Semiconductor device and method for manufacturing the same App 20020031904 - Shibata, Kazutaka ; et al.	2002-03-14
Semiconductor device and method for assembling the same App 20020024125 - Shibata, Kazutaka	2002-02-28
Semiconductor device App 20020008318 - Shibata, Kazutaka	2002-01-24
Resin-packaged semiconductor device App 20010035569 - Shibata, Kazutaka	2001-11-01
Semiconductor device and production process thereof App 20010033031 - Shibata, Kazutaka	2001-10-25
Method Of Surface- Mounting Electronic Components App 20010015286 - SHIBATA, KAZUTAKA ; et al.	2001-08-23
Semiconductor device and method for making the same Grant 6,204,564 - Miyata , et al. March 20, 2	2001-03-20
Semiconductor device having a plurality of semiconductor chips Grant 6,133,637 - Hikita , et al. October 17, 2	2000-10-17
Semiconductor device with package Grant 6,046,506 - Hikita , et al. April 4, 2	2000-04-04
Method of producing a semiconductor device using an expand tape Grant 5,762,744 - Shibata , et al. June 9, 1	1998-06-09
Surface mounting type electronic component Grant 5,723,902 - Shibata , et al. March 3, 1	1998-03-03
Packaged semiconductor device incorporating heat sink plate Grant 5,666,003 - Shibata , et al. September 9, 1	1997-09-09
Method of manufacturing semiconductor device having straight wall bump Grant 5,436,198 - Shibata July 25, 1	1995-07-25
Expand tape Grant 5,316,853 - Shibata , et al. May 31, 1	1994-05-31
Lead frame having deformable supports Grant 5,309,018 - Shibata May 3, 1	1994-05-03

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