Shiau; Simon
Patent Applications and Registrations
Patent applications and USPTO patent grants for Shiau; Simon.The latest application filed is for "method for forming flip-chip bumps of a semiconductor chip".
- Shiau; Simon - Hsinchu Hsien TW
| Patent | Date |
|---|---|
| Miniaturized image sensor module Grant 6,939,456 - Shiau September 6, 2 | 2005-09-06 |
| Injection molded image sensor module Grant 6,940,058 - Shiau September 6, 2 | 2005-09-06 |
| Miniaturized image sensor module App 20040149884 - Shiau, Simon | 2004-08-05 |
| Method for forming flip-chip bumps of a semiconductor chip App 20040152237 - Shiau, Simon | 2004-08-05 |
| Injection molded image sensor module App 20040149885 - Shiau, Simon | 2004-08-05 |
| Method for cutting a wafer App 20040139601 - Shiau, Simon | 2004-07-22 |
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