Patent | Date |
---|
Dummy structure for multiple gate dielectric interface and methods Grant 9,356,108 - Liou , et al. May 31, 2 | 2016-05-31 |
Dummy Structure for Multiple Gate Dielectric Interface and Methods App 20140342541 - Liou; Huei-Ru ;   et al. | 2014-11-20 |
Dummy structure for multiple gate dielectric interface and methods Grant 8,847,319 - Liu , et al. September 30, 2 | 2014-09-30 |
Embedded bonding pad for image sensors Grant 8,710,560 - Hsieh , et al. April 29, 2 | 2014-04-29 |
Dummy Structure for Multiple Gate Dielectric Interface and Methods App 20130234244 - Liu; Huei-Ru ;   et al. | 2013-09-12 |
Silicon substrate with reduced surface roughness Grant RE44,376 - Shiau , et al. July 16, 2 | 2013-07-16 |
Method of fabricating backside illuminated image sensor Grant 8,357,561 - Fu , et al. January 22, 2 | 2013-01-22 |
Color filter-embedded MSM image sensor Grant 8,053,853 - Chyan , et al. November 8, 2 | 2011-11-08 |
Method and apparatus for thinning a substrate Grant 8,048,807 - Liu , et al. November 1, 2 | 2011-11-01 |
Method Of Fabricating Backside Illuminated Image Sensor App 20110159631 - Fu; Shih-Chu ;   et al. | 2011-06-30 |
Method of fabricating backside illuminated image sensor Grant 7,923,344 - Fu , et al. April 12, 2 | 2011-04-12 |
Methods for fabricating image sensor devices Grant 7,883,926 - Shiau , et al. February 8, 2 | 2011-02-08 |
Semiconductor device with bonding pad Grant 7,883,917 - Liu , et al. February 8, 2 | 2011-02-08 |
Silicon substrate with reduced surface roughness Grant 7,863,067 - Shiau , et al. January 4, 2 | 2011-01-04 |
Method of forming planarized coatings on contact hole patterns of various duty ratios Grant RE41,697 - Ho , et al. September 14, 2 | 2010-09-14 |
Methods For Fabricating Image Sensor Devices App 20100151615 - Shiau; Gwo-Yuh ;   et al. | 2010-06-17 |
Process for wafer bonding Grant 7,732,299 - Chang , et al. June 8, 2 | 2010-06-08 |
Methods for fabricating image sensor devices Grant 7,709,872 - Shiau , et al. May 4, 2 | 2010-05-04 |
Method Of Fabricating Backside Illuminated Image Sensor App 20100087029 - Fu; Shih-Chi ;   et al. | 2010-04-08 |
Method and Apparatus for Thinning a Substrate App 20100062611 - Liu; Ming Chyi ;   et al. | 2010-03-11 |
Embedded bonding pad for backside illuminated image sensor Grant 7,659,595 - Shiau , et al. February 9, 2 | 2010-02-09 |
Method of fabricating backside illuminated image sensor Grant 7,648,851 - Fu , et al. January 19, 2 | 2010-01-19 |
Semiconductor Device With Bonding Pad App 20090124073 - Liu; Ming-Chyi ;   et al. | 2009-05-14 |
Embedded Bonding Pad For Image Sensors App 20090039452 - Hsieh; Yuan-Chih ;   et al. | 2009-02-12 |
Embedded Bonding Pad For Backside Illuminated Image Sensor App 20090020842 - Shiau; Gwo-Yuh ;   et al. | 2009-01-22 |
Lens structures suitable for use in image sensors and method for making the same Grant 7,443,005 - Kuo , et al. October 28, 2 | 2008-10-28 |
Semiconductor Device With Bonding Pad App 20080246152 - Liu; Ming-Chyi ;   et al. | 2008-10-09 |
System And Method For Enhancing Light Sensitivity For Backside Illumination Image Sensor App 20080237761 - Fu; Shih-Chi ;   et al. | 2008-10-02 |
Silicon Substrate With Reduced Surface Roughness App 20080227276 - Shiau; Gwo-Yuh ;   et al. | 2008-09-18 |
Process For Wafer Bonding App 20080194076 - Chang; Fa-Yuan ;   et al. | 2008-08-14 |
Methods For Fabricating Image Sensor Devices App 20080061330 - Shiau; Gwo-Yuh ;   et al. | 2008-03-13 |
Methods Of Avoiding Wafer Breakage During Manufacture Of Backside Illuminated Image Sensors App 20080044984 - Hsieh; Yuan-Chih ;   et al. | 2008-02-21 |
Color filter-embedded MSM image sensor App 20070257283 - Chyan; Jiunn-Yih ;   et al. | 2007-11-08 |
Method of fabricating backside illuminated image sensor App 20070207566 - Fu; Shih-Chi ;   et al. | 2007-09-06 |
Split Gate Flash Devices App 20070069328 - Liu; Shih-Chang ;   et al. | 2007-03-29 |
Method For Preventing Trenching In Fabricating Split Gate Flash Devices App 20060275984 - Liu; Shih-Chang ;   et al. | 2006-12-07 |
Method for preventing trenching in fabricating split gate flash devices Grant 7,144,773 - Liu , et al. December 5, 2 | 2006-12-05 |
Lens structures suitable for use in image sensors and method for making the same App 20050274968 - Kuo, Ching-Sen ;   et al. | 2005-12-15 |
Method to preserve alignment mark optical integrity Grant 6,803,291 - Fu , et al. October 12, 2 | 2004-10-12 |
Method To Preserve Alignment Mark Optical Integrity App 20040185637 - Fu, Shih-Chi ;   et al. | 2004-09-23 |
Method of forming planarized coatings on contact hole patterns of various duty ratios Grant 6,645,851 - Ho , et al. November 11, 2 | 2003-11-11 |
Enhance the process window of memory cell line/space dense pattern in sub-wavelength process Grant 6,632,590 - Tzu , et al. October 14, 2 | 2003-10-14 |
Overlay target pattern and algorithm for layer-to-layer overlay metrology for semiconductor processing Grant 6,077,756 - Lin , et al. June 20, 2 | 2000-06-20 |
Method of providing uniform photoresist coatings for tight control of image dimensions Grant 5,985,363 - Shiau , et al. November 16, 1 | 1999-11-16 |
Alignment pattern and algorithm for photolithographic alignment marks on semiconductor substrates Grant 5,982,044 - Lin , et al. November 9, 1 | 1999-11-09 |