Patent | Date |
---|
Chemical mechanical planarization (CMP) composition and methods therefore for copper and through silica via (TSV) applications Grant 11,401,441 - Shi , et al. August 2, 2 | 2022-08-02 |
Selective Chemical Mechanical Planarization Polishing App 20220195245 - Shi; Xiaobo ;   et al. | 2022-06-23 |
Shallow trench isolation (STI) chemical mechanical planarization (CMP) polishing with low abrasive concentration and a combination of chemical additives Grant 11,326,076 - Shi , et al. May 10, 2 | 2022-05-10 |
Low oxide trench dishing shallow trench isolation chemical mechanical planarization polishing Grant 11,254,839 - Shi , et al. February 22, 2 | 2022-02-22 |
Suppressing SiN removal rates and reducing oxide trench dishing for Shallow Trench Isolation (STI) process Grant 11,180,678 - Shi , et al. November 23, 2 | 2021-11-23 |
Low Oxide Trench Dishing Chemical Mechanical Polishing App 20210324270 - Shi; Xiaobo ;   et al. | 2021-10-21 |
Low Oxide Trench Dishing Chemical Mechanical Polishing App 20210309885 - Shi; Xiaobo ;   et al. | 2021-10-07 |
Barrier Chemical Mechanical Planarization Slurries For Cobalt Films App 20210301405 - Shi; Xiaobo ;   et al. | 2021-09-30 |
Metal compound chemically anchored colloidal particles and methods of production and use thereof Grant 11,104,825 - Zhou , et al. August 31, 2 | 2021-08-31 |
Low oxide trench dishing chemical mechanical polishing Grant 11,078,417 - Shi , et al. August 3, 2 | 2021-08-03 |
Low oxide trench dishing chemical mechanical polishing Grant 11,072,726 - Shi , et al. July 27, 2 | 2021-07-27 |
Chemical mechanical planarization for tungsten-containing substrates Grant 11,066,575 - Shi , et al. July 20, 2 | 2021-07-20 |
Low Oxide Trench Dishing Shallow Trench Isolation Chemical Mechanical Planarization Polishing App 20210179890 - Shi; Xiaobo ;   et al. | 2021-06-17 |
Metal chemical mechanical planarization (CMP) composition and methods therefore Grant 10,920,106 - Shi , et al. February 16, 2 | 2021-02-16 |
Chemical Mechanical Polishing For Copper And Through Silicon Via Applications App 20200277514 - Shi; Xiaobo ;   et al. | 2020-09-03 |
Chemical mechanical polishing (CMP) of cobalt-containing substrate Grant 10,745,589 - Shi , et al. A | 2020-08-18 |
Shallow Trench Isolation (STI) Chemical Mechanical Planarization (CMP) Polishing With Tunable Silicon Oxide And Silicon Nitride App 20200239736 - Shi; Xiaobo ;   et al. | 2020-07-30 |
Shallow Trench Isolation (STI) Chemical Mechanical Planarization (CMP) Polishing With Low Abrasive Concentration And A Combinati App 20200239735 - Shi; Xiaobo ;   et al. | 2020-07-30 |
Composite abrasive particles for chemical mechanical planarization composition and method of use thereof Grant 10,669,449 - Zhou , et al. | 2020-06-02 |
Suppressing SiN Removal Rates And Reducing Oxide Trench Dishing For Shallow Trench Isolation (STI) Process App 20200131404 - Shi; Xiaobo ;   et al. | 2020-04-30 |
Composite Abrasive Particles for Chemical Mechanical Planarization Composition and Method of Use Thereof App 20200115590 - Zhou; Hongjun ;   et al. | 2020-04-16 |
High Oxide VS Nitride Selectivity, Low And Uniform Oxide Trench Dishing In Shallow Trench Isolation(STI) Chemical Mechanical Pla App 20200095502 - Shi; Xiaobo ;   et al. | 2020-03-26 |
Chemical Mechanical Planarization For Tungsten-Containing Substrates App 20200079976 - Shi; Xiaobo ;   et al. | 2020-03-12 |
Dishing reducing in tungsten chemical mechanical polishing Grant 10,570,313 - Stender , et al. Feb | 2020-02-25 |
Oxide Chemical Mechanical Planarization (CMP) Polishing Compositions App 20200048496 - Shi; Xiaobo ;   et al. | 2020-02-13 |
Chemical Mechanical Planarization Composition For Polishing Oxide Materials And Method Of Use Thereof App 20200048551 - Tsai; Ming-Shih ;   et al. | 2020-02-13 |
Metal Chemical Mechanical Planarization (CMP) Composition And Methods Therefore App 20200032107 - Shi; Xiaobo ;   et al. | 2020-01-30 |
Tungsten Chemical Mechanical Polishing For Reduced Oxide Erosion App 20200024515 - Lu; Chun ;   et al. | 2020-01-23 |
Low Oxide Trench Dishing Chemical Mechanical Polishing App 20200002574 - Shi; Xiaobo ;   et al. | 2020-01-02 |
Low Oxide Trench Dishing Chemical Mechanical Polishing App 20200002608 - Shi; Xiaobo ;   et al. | 2020-01-02 |
Low Oxide Trench Dishing Chemical Mechanical Polishing App 20200002607 - Shi; Xiaobo ;   et al. | 2020-01-02 |
Tungsten Chemical Mechanical Polishing Compositions App 20190382619 - Shi; Xiaobo ;   et al. | 2019-12-19 |
Chemical Mechanical Polishing Tungsten Buffing Slurries App 20190352535 - Shi; Xiaobo ;   et al. | 2019-11-21 |
Metal chemical mechanical planarization (CMP) composition and methods therefore Grant 10,465,096 - Shi , et al. No | 2019-11-05 |
Chemical Mechanical Polishing (CMP) of Cobalt-Containing Substrate App 20190172720 - Shi; Xiaobo ;   et al. | 2019-06-06 |
Additives for barrier chemical mechanical planarization Grant 10,253,216 - Stender , et al. | 2019-04-09 |
Metal Compound Chemically Anchored Colloidal Particles and Methods of Production and Use Thereof App 20190100678 - Zhou; Hongjun ;   et al. | 2019-04-04 |
Metal Chemical Mechanical Planarization (CMP) Composition and Methods Therefore App 20190062597 - Shi; Xiaobo ;   et al. | 2019-02-28 |
Chemical mechanical polishing (CMP) of cobalt-containing substrate Grant 10,217,645 - Shi , et al. Feb | 2019-02-26 |
Chemical Mechanical Planarization (CMP) Composition and Methods Therefore for Copper and Through Silica Via (TSV) Applications App 20190055430 - Shi; Xiaobo ;   et al. | 2019-02-21 |
Metal compound chemically anchored colloidal particles and methods of production and use thereof Grant 10,160,884 - Zhou , et al. Dec | 2018-12-25 |
Composite abrasive particles for chemical mechanical planarization composition and method of use thereof Grant 10,109,493 - Zhou , et al. October 23, 2 | 2018-10-23 |
Barrier chemical mechanical planarization slurries using ceria-coated silica abrasives Grant 10,032,644 - Shi , et al. July 24, 2 | 2018-07-24 |
Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof Grant 10,011,741 - Shi , et al. July 3, 2 | 2018-07-03 |
Low dishing copper chemical mechanical planarization Grant 9,978,609 - Shi , et al. May 22, 2 | 2018-05-22 |
Additives for Barrier Chemical Mechanical Planarization App 20180002571 - Stender; Matthias ;   et al. | 2018-01-04 |
Chemical Mechanical Polishing (CMP) of Cobalt-Containing substrate App 20170362466 - Shi; Xiaobo ;   et al. | 2017-12-21 |
Barrier chemical mechanical planarization composition and method thereof Grant 9,574,110 - Graham , et al. February 21, 2 | 2017-02-21 |
Barrier Chemical Mechanical Planarization Slurries Using Ceria-Coated Silica Abrasives App 20160358790 - Shi; Xiaobo ;   et al. | 2016-12-08 |
Low Dishing Copper Chemical Mechanical Planarization App 20160314989 - Shi; Xiaobo ;   et al. | 2016-10-27 |
Metal Compound Chemically Anchored Colloidal Particles and Methods of Production and Use Thereof App 20160280962 - Zhou; Hongjun ;   et al. | 2016-09-29 |
Dishing Reducing In Tungsten Chemical Mechanical Polishing App 20160237315 - Stender; Matthias ;   et al. | 2016-08-18 |
Composite Abrasive Particles For Chemical Mechanical Planarization Composition and Method of Use Thereof App 20160200944 - Zhou; Hongjun ;   et al. | 2016-07-14 |
Chemical Mechanical Polishing (CMP) Composition for Shallow Trench Isolation (STI) Applications and Methods of Making Thereof App 20160177134 - Shi; Xiaobo ;   et al. | 2016-06-23 |
Chemical Mechanical Polishing Slurry for Reducing Corrosion and Method of Use Therefor App 20160122590 - Lew; Blake J. ;   et al. | 2016-05-05 |
Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof Grant 9,305,476 - Shi , et al. April 5, 2 | 2016-04-05 |
Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applications Grant 9,305,806 - Shi , et al. April 5, 2 | 2016-04-05 |
Chemical Mechanical Polishing (CMP) of Colbalt-Containing Substrate App 20160027657 - Shi; Xiaobo ;   et al. | 2016-01-28 |
CMP slurry/method for polishing ruthenium and other films Grant 9,224,614 - Shi December 29, 2 | 2015-12-29 |
Chemical Mechanical Polishing (CMP) Composition for Shallow Trench Isolation (STI) Applications and Methods of Making Thereof App 20150247063 - Shi; Xiaobo ;   et al. | 2015-09-03 |
Photovoltaic cell with thiazole-containing polymer Grant 9,123,895 - Gaudiana , et al. September 1, 2 | 2015-09-01 |
Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof Grant 9,062,230 - Shi , et al. June 23, 2 | 2015-06-23 |
Chemical Mechanical Polishing Slurry Compositions and Method Using the Same for Copper and Through-Silicon Via Applications App 20150132956 - Shi; Xiaobo ;   et al. | 2015-05-14 |
Barrier Chemical Mechanical Planarization Composition And Method Thereof App 20150104940 - Graham; Maitland Gary ;   et al. | 2015-04-16 |
Barrier Chemical Mechanical Planarization Composition And Method Thereof App 20150104941 - Graham; Maitland Gary ;   et al. | 2015-04-16 |
Chemical mechanical polishing composition having chemical additives and methods for using same Grant 8,999,193 - Shi , et al. April 7, 2 | 2015-04-07 |
Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applications Grant 8,974,692 - Shi , et al. March 10, 2 | 2015-03-10 |
Photovoltaic cell with silole-containing polymer Grant 8,962,783 - Gaudiana , et al. February 24, 2 | 2015-02-24 |
CMP Slurry/Method for Polishing Ruthenium and Other Films App 20150050809 - Shi; Xiaobo | 2015-02-19 |
Chemical Mechanical Polishing Slurry Compositions and Method Using the Same for Copper and Through-Silicon Via Applications App 20150004788 - SHI; Xiaobo ;   et al. | 2015-01-01 |
Chemical Mechanical Polishing (CMP) Composition for Shallow Trench Isolation (STI) Applications and Methods of Making Thereof App 20140374378 - Shi; Xiaobo ;   et al. | 2014-12-25 |
CMP slurry/method for polishing ruthenium and other films Grant 8,906,123 - Shi December 9, 2 | 2014-12-09 |
Metal Compound Coated Colloidal Particles Process for Making and Use Therefor App 20140315386 - Zhou; Hongjun ;   et al. | 2014-10-23 |
Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof Grant 8,859,428 - Shi , et al. October 14, 2 | 2014-10-14 |
Method for chemical mechanical planarization of a tungsten-containing substrate Grant 8,858,819 - McConnell , et al. October 14, 2 | 2014-10-14 |
Method and composition for chemical mechanical planarization of a metal Grant 8,841,216 - Shi , et al. September 23, 2 | 2014-09-23 |
Chemical Mechanical Planarization for Tungsten-Containing Substrates App 20140273458 - Shi; Xiaobo ;   et al. | 2014-09-18 |
Chemical mechanical planarization composition and method with low corrosiveness Grant 8,821,751 - Shi , et al. September 2, 2 | 2014-09-02 |
Polymers with Low Band Gaps and High Charge Mobility App 20140224331 - Gaudiana; Russell ;   et al. | 2014-08-14 |
Chemical Mechanical Polishing (cmp) Composition For Shallow Trench Isolation (sti) Applications And Methods Of Making Thereof App 20140110626 - Shi; Xiaobo ;   et al. | 2014-04-24 |
Method and composition for chemical mechanical planarization of a metal or a metal alloy Grant 8,697,577 - Shi , et al. April 15, 2 | 2014-04-15 |
Chemical Mechanical Polishing Composition Having Chemical Additives and Methods for Using Same App 20140099790 - Shi; Xiaobo ;   et al. | 2014-04-10 |
Photovoltaic Cell With Thiazole-Containing Polymer App 20140034129 - Gaudiana; Russell ;   et al. | 2014-02-06 |
Photovoltaic cell with thiazole-containing polymer Grant 8,563,678 - Gaudiana , et al. October 22, 2 | 2013-10-22 |
Method for chemical mechanical planarization of a copper-containing substrate Grant 8,551,887 - Shi October 8, 2 | 2013-10-08 |
Method and Composition for Chemical Mechanical Planarization of a Metal App 20130178065 - Shi; Xiaobo ;   et al. | 2013-07-11 |
Method and Composition for Chemical Mechanical Planarization of a Metal-Containing Substrate App 20130153820 - Shi; Xiaobo | 2013-06-20 |
Method And Composition For Chemical Mechanical Planarization Of A Metal Or A Metal Alloy App 20130102153 - Shi; Xiaobo ;   et al. | 2013-04-25 |
Method and composition for chemical mechanical planarization of a metal Grant 8,414,789 - Shi , et al. April 9, 2 | 2013-04-09 |
CMP Slurry/Method for Polishing Ruthenium and Other Films App 20120329279 - Shi; Xiaobo | 2012-12-27 |
Method and composition for chemical mechanical planarization of a metal or a metal alloy Grant 8,252,688 - Shi , et al. August 28, 2 | 2012-08-28 |
Method and composition for chemical mechanical planarization of a metal-containing substrate Grant 8,222,145 - Shi July 17, 2 | 2012-07-17 |
Chemical Mechanical Planarization Composition And Method With Low Corrosiveness App 20120142191 - Shi; Xiaobo ;   et al. | 2012-06-07 |
Method for Chemical Mechanical Planarization of a Tungsten-Containing Substrate App 20120028466 - McConnell; Rachel Dianne ;   et al. | 2012-02-02 |
Method For Chemical Mechanical Planarization Of A Copper-containing Substrate App 20110312181 - Shi; Xiaobo | 2011-12-22 |
Photovoltaic Cell With Thiazole-Containing Polymer App 20110290324 - Gaudiana; Russell ;   et al. | 2011-12-01 |
Photovoltaic Cell With Silole-Containing Polymer App 20110284080 - Gaudiana; Russell ;   et al. | 2011-11-24 |
Polymers with low band gaps and high charge mobility Grant 8,058,550 - Gaudiana , et al. November 15, 2 | 2011-11-15 |
Photovoltaic cell with silole-containing polymer Grant 8,008,421 - Gaudiana , et al. August 30, 2 | 2011-08-30 |
Photovoltaic cell with thiazole-containing polymer Grant 8,008,424 - Gaudiana , et al. August 30, 2 | 2011-08-30 |
Method and Composition for Chemical Mechanical Planarization of a Metal-Containing Substrate App 20110070735 - Shi; Xiaobo | 2011-03-24 |
Polymers with low band gaps and high charge mobility App 20100180944 - Gaudiana; Russell ;   et al. | 2010-07-22 |
Method and Composition for Chemical Mechanical Planarization of A Metal or A Metal Alloy App 20100167546 - Shi; Xiaobo ;   et al. | 2010-07-01 |
Method and Composition for Chemical Mechanical Planarization of A Metal App 20100167545 - Shi; Xiaobo ;   et al. | 2010-07-01 |
Memory devices with active and passive layers having multiple self-assembled sublayers Grant 7,633,129 - Shi , et al. December 15, 2 | 2009-12-15 |
Memory device with active layer of dendrimeric material Grant 7,449,742 - Sokolik , et al. November 11, 2 | 2008-11-11 |
Memory device with improved data retention App 20080152934 - Sokolik; Igor ;   et al. | 2008-06-26 |
Photovoltaic Cell With Thiazole-Containing Polymer App 20080121281 - Gaudiana; Russell ;   et al. | 2008-05-29 |
Photovoltaic Cell With Silole-Containing Polymer App 20080087324 - Gaudiana; Russell ;   et al. | 2008-04-17 |
Memory devices with active and passive doped sol-gel layers Grant 7,307,280 - Shi , et al. December 11, 2 | 2007-12-11 |
Tandem Photovoltaic Cells App 20070267055 - Gaudiana; Russell ;   et al. | 2007-11-22 |
Metal ion mediated fluorescence superquenching assays, kits and reagents App 20070238143 - Xia; Wensheng ;   et al. | 2007-10-11 |
Window with photovoltaic cell App 20070131270 - Gaudiana; Russell ;   et al. | 2007-06-14 |
Memory element with nitrogen-containing active layer Grant 7,208,757 - Kingsborough , et al. April 24, 2 | 2007-04-24 |
Polymers with low band gaps and high charge mobility App 20070020526 - Gaudiana; Russell ;   et al. | 2007-01-25 |
Polymers with low band gaps and high charge mobility App 20070017571 - Gaudiana; Russell ;   et al. | 2007-01-25 |
Assays for protease enzyme activity App 20050014160 - Kumaraswamy, Sriram ;   et al. | 2005-01-20 |
Organic light emitting diode devices using thermostable hole-injection and hole-transport compounds Grant 6,657,224 - Shi , et al. December 2, 2 | 2003-12-02 |
Organic light emitting diode devices using thermostable hole-injection and hole-transport compounds App 20030030059 - Shi, Xiaobo ;   et al. | 2003-02-13 |
Organic light emitting diode devices using aromatic amine compounds with high and tunable glass transition temperatures App 20020057050 - Shi, Xiaobo | 2002-05-16 |