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Patent applications and USPTO patent grants for Shi; Xiangke.The latest application filed is for "package for indicating heat-seal condition".
Patent | Date |
---|---|
Package for indicating heat-seal condition Grant 11,247,410 - Liu , et al. February 15, 2 | 2022-02-15 |
Heat-seal lid with non-heat sealing layer and hydrophobic overcoat Grant 11,203,189 - Shi , et al. December 21, 2 | 2021-12-21 |
Package for indicating heat-seal condition Grant 10,822,150 - Shi , et al. November 3, 2 | 2020-11-03 |
Multilayer pouch with heat-shrinkable layer Grant 10,759,578 - Chen , et al. Sep | 2020-09-01 |
Package For Indicating Heat-seal Condition App 20190375167 - Liu; Yuan ;   et al. | 2019-12-12 |
Multilayer Pouch With Heat-shrinkable Layer App 20190352069 - Chen; Peter M. ;   et al. | 2019-11-21 |
Heat-seal Lid With Non-heat Sealing Layer And Hydrophobic Overcoat App 20190240960 - Shi; Xiangke ;   et al. | 2019-08-08 |
Package For Indicating Heat-seal Condition App 20180099802 - Shi; Xiangke ;   et al. | 2018-04-12 |
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