loadpatents
name:-0.014558792114258
name:-0.01609992980957
name:-0.014252185821533
SHI; Wenguang Patent Filings

SHI; Wenguang

Patent Applications and Registrations

Patent applications and USPTO patent grants for SHI; Wenguang.The latest application filed is for "hybrid bonding contact structure of three-dimensional memory device".

Company Profile
12.13.12
  • SHI; Wenguang - Wuhan CN
  • Shi; Wenguang - Hubei CN
  • Shi; Wenguang - Milpitas CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Hybrid Bonding Contact Structure Of Three-dimensional Memory Device
App 20210134826 - LU; Zhenyu ;   et al.
2021-05-06
Through Array Contact Structure Of Three-dimensional Memory Device
App 20210126005 - LU; Zhenyu ;   et al.
2021-04-29
Joint Opening Structures Of Three-dimensional Memory Devices And Methods For Forming The Same
App 20210074718 - LU; Zhenyu ;   et al.
2021-03-11
Interconnect structure of three-dimensional memory device
Grant 10,930,663 - Lu , et al. February 23, 2
2021-02-23
Hybrid bonding contact structure of three-dimensional memory device
Grant 10,923,491 - Lu , et al. February 16, 2
2021-02-16
Interconnect Structure Of Three-dimensional Memory Device
App 20210043643 - LU; Zhenyu ;   et al.
2021-02-11
Through array contact structure of three- dimensional memory device
Grant 10,910,397 - Lu , et al. February 2, 2
2021-02-02
Joint opening structures of three-dimensional memory devices and methods for forming the same
Grant 10,886,291 - Lu , et al. January 5, 2
2021-01-05
Joint opening structures of three-dimensional memory devices and methods for forming the same
Grant 10,847,532 - Lu , et al. November 24, 2
2020-11-24
Interconnect structure of three-dimensional memory device
Grant 10,847,531 - Lu , et al. November 24, 2
2020-11-24
Hybrid Bonding Contact Structure Of Three-dimensional Memory Device
App 20200295025 - LU; Zhenyu ;   et al.
2020-09-17
Through Array Contact Structure Of Three-dimensional Memory Device
App 20200152653 - LU; Zhenyu ;   et al.
2020-05-14
Hybrid bonding contact structure of three-dimensional memory device
Grant 10,593,690 - Lu , et al.
2020-03-17
Through array contact structure of three-dimensional memory device
Grant 10,553,604 - Lu , et al. Fe
2020-02-04
Joint Openning Structures Of Three-dimensional Memory Devices And Methods For Forming The Same
App 20190081060 - LU; Zhenyu ;   et al.
2019-03-14
Interconnect Structure Of Three-dimensional Memory Device
App 20190067314 - Lu; Zhenyu ;   et al.
2019-02-28
Hybrid Bonding Contact Structure Of Three-dimensional Memory Device
App 20190057974 - LU; Zhenyu ;   et al.
2019-02-21
Through Array Contact Structure Of Three-dimensional Memory Device
App 20190043879 - LU; Zhenyu ;   et al.
2019-02-07
Method of making a multilevel memory stack structure using a cavity containing a sacrificial fill material
Grant 9,853,043 - Lu , et al. December 26, 2
2017-12-26
Forming 3D memory cells after word line replacement
Grant 9,716,101 - Lu , et al. July 25, 2
2017-07-25
Three-dimensional memory devices containing memory block bridges
Grant 9,679,906 - Lu , et al. June 13, 2
2017-06-13
Method Of Making A Multilevel Memory Stack Structure Using A Cavity Containing A Sacrificial Fill Material
App 20170062454 - LU; Zhenyu ;   et al.
2017-03-02
Three dimensional memory device with epitaxial semiconductor pedestal for peripheral transistors
Grant 9,543,318 - Lu , et al. January 10, 2
2017-01-10
Memory Hole Last Boxim
App 20160343718 - Lu; Zhenyu ;   et al.
2016-11-24
Multi tier three-dimensional memory devices including vertically shared bit lines
Grant 9,502,471 - Lu , et al. November 22, 2
2016-11-22

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