Shi; Steven Z.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shi; Steven Z..The latest application filed is for "methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards".

Company Profile

1.10.18

Shi; Steven Z. - Santa Clara CA
Shi; Steven Z. - Highlands Ranch CO
Shi; Steven Z - Santa Clara CA
Shi; Steven Z. - Latham NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods of treating metal surfaces and devices formed thereby Grant 10,375,835 - Wei , et al.	2019-08-06
Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards Grant 9,795,040 - Wei , et al. October 17, 2	2017-10-17
Methods of treating metal surfaces and devices formed thereby Grant 9,763,336 - Wei , et al. September 12, 2	2017-09-12
Methods Of Treating Copper Surfaces For Enhancing Adhesion To Organic Substrates For Use In Printed Circuit Boards App 20170027065 - Wei; Jen-Chieh ; et al.	2017-01-26
Methods Of Treating Metal Surfaces And Devices Formed Thereby App 20160360623 - WEI; Jen-Chieh ; et al.	2016-12-08
Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards Grant 9,345,149 - Wei , et al. May 17, 2	2016-05-17
Methods Of Enhancing Electrochemical Double Layer Capacitor (EDLC) Performance And EDLC Devices Formed Therefrom App 20150263543 - Gellett; Wayne L. ; et al.	2015-09-17
Phosphonium ionic liquids, salts, compositions, methods of making and devices formed there from Grant 8,927,775 - Rupert , et al. January 6, 2	2015-01-06
Electrolyte compositions and electrochemical double layer capacitors formed there from Grant 8,907,133 - Gellett , et al. December 9, 2	2014-12-09
Methods of Treating Metal Surfaces and Devices Formed Thereby App 20140261897 - Wei; Jen-Chieh ; et al.	2014-09-18
Methods Of Enhancing Electrochemical Double Layer Capacitor (EDLC) Performance And EDLC Devices Formed Therefrom App 20140266075 - Gellett; Wayne L. ; et al.	2014-09-18
Methods of Treating Metal Surfaces and Devices Formed Thereby App 20140251502 - Wei; Jen-Chieh ; et al.	2014-09-11
Electrolyte Compositions, Methods Of Making And Battery Devices Formed There From App 20130095392 - Shin; Joon Ho ; et al.	2013-04-18
Phosphonium Ionic Liquids, Salts, Compositions, Methods Of Making And Devices Formed There From App 20130092866 - Rupert; Benjamin L. ; et al.	2013-04-18
Electrolyte Compositions And Electrochemical Double Layer Capacitors Formed There From App 20130095351 - Gellett; Wayne L. ; et al.	2013-04-18
Methods of treating a surface to promote metal plating and devices formed Grant 8,323,769 - Kuhr , et al. December 4, 2	2012-12-04
Methods Of Treating Copper Surfaces For Enhancing Adhesion To Organic Substrates For Use In Printed Circuit Boards App 20120125514 - Wei; Jen-Chieh ; et al.	2012-05-24
Methods Of Treating A Surface To Promote Metal Plating And Devices Formed App 20100071938 - Kuhr; Werner G. ; et al.	2010-03-25
Methods Of Treating A Surface To Promote Metal Plating And Devices Formed App 20100075427 - Kuhr; Werner G. ; et al.	2010-03-25
Methods of Treating a Surface to Promote Binding of Molecule(s) of Interest, Coatings and Devices Formed Therefrom App 20090056991 - Kuhr; Werner G. ; et al.	2009-03-05
Methods of Treating a Surface to Promote Metal Plating and Devices Formed App 20090056994 - Kuhr; Werner G. ; et al.	2009-03-05
Conducting polymer for high power ultracapacitor Grant 6,383,640 - Shi , et al. May 7, 2	2002-05-07

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