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Patent applications and USPTO patent grants for Shi; Songhua.The latest application filed is for "feedthrough header assembly and device including same".
Patent | Date |
---|---|
Feedthrough Header Assembly And Device Including Same App 20220241598 - Henschel; Mark E. ;   et al. | 2022-08-04 |
Electronic Package And Implantable Medical Device Including Same App 20220077085 - Henschel; Mark E. ;   et al. | 2022-03-10 |
Medical devices Grant 10,721,826 - Shi , et al. | 2020-07-21 |
Electrical Component And Method Of Forming Same App 20200154567 - KIM; Chunho ;   et al. | 2020-05-14 |
Medical Devices App 20190343011 - Shi; Songhua ;   et al. | 2019-11-07 |
Systems for encapsulating a hybrid assembly of electronic components and associated methods Grant 10,201,094 - Kim , et al. Fe | 2019-02-05 |
Medical device with surface mounted lead connector Grant 9,579,511 - Henschel , et al. February 28, 2 | 2017-02-28 |
Medical Device With Surface Mounted Lead Connector App 20160166825 - Henschel; Mark E. ;   et al. | 2016-06-16 |
Systems For Encapsulating A Hybrid Assembly Of Electronic Components And Associated Methods App 20150342060 - KIM; Chunho ;   et al. | 2015-11-26 |
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