Sheyon; Gregory M.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Sheyon; Gregory M..The latest application filed is for "method of bonding a semiconductor chip to a substrate".
- Sheyon; Gregory M. - Anderson SC
| Patent | Date |
|---|---|
| Method of bonding a semiconductor chip to a substrate Grant 5,030,308 - Sheyon , et al. July 9, 1 | 1991-07-09 |
| Method of bonding a semiconductor chip to a substrate Grant 4,793,883 - Sheyon , et al. December 27, 1 | 1988-12-27 |
| Adhesively mountable die attach film Grant 4,687,693 - Sheyon , et al. August 18, 1 | 1987-08-18 |
| Pressure sensitive composite article Grant 4,230,753 - Sheyon October 28, 1 | 1980-10-28 |
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