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Patent applications and USPTO patent grants for Sherwood; Michael T..The latest application filed is for "fluid-pressure regulated wafer polishing head".
Patent | Date |
---|---|
Chemical mechanical polishing retaining ring Grant RE44,491 - Shendon , et al. September 10, 2 | 2013-09-10 |
Fluid-pressure regulated wafer polishing head App 20040087254 - Shendon, Norman ;   et al. | 2004-05-06 |
Chemical mechanical polishing retaining ring App 20020173255 - Shendon, Norman ;   et al. | 2002-11-21 |
Method and apparatus for using a retaining ring to control the edge effect Grant 5,795,215 - Guthrie , et al. August 18, 1 | 1998-08-18 |
Carrier head design for a chemical mechanical polishing apparatus Grant 5,681,215 - Sherwood , et al. October 28, 1 | 1997-10-28 |
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