Sherif; Raed A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sherif; Raed A..The latest application filed is for "solar cell having front grid metallization that does not contact the active layers".

Company Profile

0.20.3

Sherif; Raed A. - Valencia CA US
Sherif; Raed A. - Woodland Hills CA
Sherif; Raed A. - Croton-on Hudson NY
Sherif; Raed A. - Croton NY
Sherif; Raed A. - Hopewell Junction NY
Sherif; Raed A. - Pleasant Valley NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Solar cell having front grid metallization that does not contact the active layers Grant 8,697,987 - Cotal , et al. April 15, 2	2014-04-15
Solar cell having front grid metallization that does not contact the active layers App 20060076049 - Cotal; Hector L. ; et al.	2006-04-13
Solar cell with an electrically insulating layer under the busbar App 20040261838 - Cotal, Hector ; et al.	2004-12-30
Package with low stress hermetic seal Grant 6,459,160 - Goldmann , et al. October 1, 2	2002-10-01
Package with low stress hermetic seal App 20020090761 - Goldmann, Lewis Sigmund ; et al.	2002-07-11
Multi-chip module and heat-sink cap combination Grant 6,373,133 - DiGiacomo , et al. April 16, 2	2002-04-16
Solar module array with reconfigurable tile Grant 6,350,944 - Sherif , et al. February 26, 2	2002-02-26
Structural support for direct lid attach Grant 6,333,460 - Toy , et al. December 25, 2	2001-12-25
Variable thermal exchanger and method thereof Grant 6,330,157 - Bezama , et al. December 11, 2	2001-12-11
Method for controlling thermal interface gap distance Grant 6,294,408 - Edwards , et al. September 25, 2	2001-09-25
Method for providing a thermal path through particles embedded in a thermal cap Grant 6,255,139 - Edwards , et al. July 3, 2	2001-07-03
Apparatus for controlling thermal interface gap distance Grant 6,218,730 - Toy , et al. April 17, 2	2001-04-17
Thermal cap with embedded particles Grant 6,111,314 - Edwards , et al. August 29, 2	2000-08-29
Hermetic CBGA/CCGA structure with thermal paste cooling Grant 5,990,418 - Bivona , et al. November 23, 1	1999-11-23
Multi-layer solder seal band for semiconductor substrates and process Grant 5,881,945 - Edwards , et al. March 16, 1	1999-03-16
Method for cooling of chips using blind holes with customized depth Grant 5,819,402 - Edwards , et al. October 13, 1	1998-10-13
Apparatus for cooling of chips using blind holes with customized depth Grant 5,757,620 - Edwards , et al. May 26, 1	1998-05-26
Method and apparatus for cooling of chips using a plurality of customized thermally conductive materials Grant 5,724,729 - Sherif , et al. March 10, 1	1998-03-10
Flat plate cooling using a thermal paste retainer Grant 5,706,171 - Edwards , et al. January 6, 1	1998-01-06
Apparatus for cooling of chips using a plurality of customized thermally conductive materials Grant 5,623,394 - Sherif , et al. April 22, 1	1997-04-22
Method for cooling of chips using a plurality of materials Grant 5,604,978 - Sherif , et al. February 25, 1	1997-02-25
Blind hole cold plate cooling system Grant 5,239,443 - Fahey , et al. August 24, 1	1993-08-24

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