Shephard; Nick

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shephard; Nick.The latest application filed is for "dual cure adhesive composition and methods for its preparation and use".

Company Profile

6.7.9

Shephard; Nick - Auburn MI
Shephard; Nick - Midland MI
- Midland MI US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Dual cure adhesive composition and methods for its preparation and use Grant 11,028,297 - Lu , et al. June 8, 2	2021-06-08
Dual Cure Adhesive Composition And Methods For Its Preparation And Use App 20210002532 - Lu; Gang ; et al.	2021-01-07
Dual Cure Adhesive Composition And Methods For Its Preparation And Use App 20200208033 - Lu; Gang ; et al.	2020-07-02
Method of forming an electronic article Grant 9,312,416 - Fisher , et al. April 12, 2	2016-04-12
Method of Forming an Electronic Article App 20150263208 - Fisher; Mark ; et al.	2015-09-17
Silver-Loaded Microparticles and Loading of Same Into Silicones App 20150189867 - Kroupa; Laurie ; et al.	2015-07-09
Bonding an adherent to a substrate via a primer Grant 8,859,056 - O'Neill , et al. October 14, 2	2014-10-14
Dual curing polymers and methods for their preparation and use Grant 8,618,233 - Alvarez , et al. December 31, 2	2013-12-31
Dual curing polymers and methods for their preparation and use Grant 08618233 -	2013-12-31
Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and use Grant 8,334,592 - Bhagwagar , et al. December 18, 2	2012-12-18
Composite, Thermal Interface Material Containing the Composite, and Methods for Their Preparation and Use App 20100328895 - Bhagwagar; Dorab ; et al.	2010-12-30
Thermal Interface Material, Electronic Device Containing the Thermal Interface Material, and Methods for Their Preparation and Use App 20100208432 - Bhagwagar; Dorab ; et al.	2010-08-19
Dual Curing Polymers and Methods for Their Preparation and Use App 20100092690 - Alvarez; Khristopher ; et al.	2010-04-15
Bonding An Adherent To A Substrate Via A Primer App 20090220794 - O'Neill; Liam ; et al.	2009-09-03

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