Shen; Yu-Nung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shen; Yu-Nung.The latest application filed is for "illumination apparatuses".

Company Profile

0.57.66

Shen; Yu-Nung - Taipei TW
SHEN; YU-NUNG - Taipei City TW
Shen; Yu-Nung - Nei-Hu District Taipei City TW
Shen; Yu-Nung - Nei-Hu Dist. Taipei TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Light-emitting diode die packages and methods for producing Grant 8,939,613 - Shen January 27, 2	2015-01-27
Illumination Apparatuses App 20140183570 - SHEN; YU-NUNG	2014-07-03
Light-emitting diode illumination apparatuses Grant 8,684,564 - Shen , et al. April 1, 2	2014-04-01
Light emitting diode package and method for fabricating the same Grant 8,669,569 - Shen , et al. March 11, 2	2014-03-11
Light-emitting diode die packages and illumination apparatuses using same Grant 8,624,489 - Shen January 7, 2	2014-01-07
Light-emitting diode die packages and illumination apparatuses using same Grant 8,581,490 - Shen November 12, 2	2013-11-12
Light-emitting diode die packages and methods for producing same Grant 8,563,963 - Shen , et al. October 22, 2	2013-10-22
Light emitting diode device and method for fabricating the same Grant 8,541,793 - Shen , et al. September 24, 2	2013-09-24
Light-emitting diode chip package body and method for manufacturing same Grant 8,487,339 - Shen July 16, 2	2013-07-16
Light-emitting Diode Die Packages And Methods For Producing Same App 20130170186 - SHEN; YU-NUNG	2013-07-04
Light-emitting diode die package and method for producing same Grant 8,405,114 - Shen March 26, 2	2013-03-26
Light-emitting diode die package and method for producing same Grant 8,405,099 - Shen March 26, 2	2013-03-26
Light source package having a six sided light emitting die supported by electrodes Grant 8,337,048 - Shen December 25, 2	2012-12-25
Light-emitting Diode Die Packages And Illumination Apparatuses Using Same App 20120267648 - SHEN; YU-NUNG	2012-10-25
Light-emitting Diode Die Packages And Illumination Apparatuses Using Same App 20120267675 - SHEN; YU-NUNG	2012-10-25
Light-emitting Diode Die Packages And Illumination Apparatuses Using Same App 20120267649 - SHEN; YU-NUNG	2012-10-25
Light-emitting Diode Die Packages And Illumination Apparatuses Using Same App 20120261709 - SHEN; YU-NUNG	2012-10-18
Method for driving LED Grant 8,253,345 - Shen August 28, 2	2012-08-28
Light-emitting diode die package and method for producing same Grant 8,242,517 - Shen August 14, 2	2012-08-14
Light-emitting diode die packages and illumination apparatuses using same Grant 8,242,690 - Shen August 14, 2	2012-08-14
Light Source Package App 20120170272 - SHEN; YU-NUNG	2012-07-05
Light Emitting Device App 20120161168 - Shen; Yu-Nung	2012-06-28
Light-emitting Diode Die Package And Method For Producing Same App 20120161189 - SHEN; YU-NUNG	2012-06-28
Light-emitting Diode Die Package And Method For Producing Same App 20120161169 - SHEN; YU-NUNG	2012-06-28
Light Emitting Device App 20120161173 - Shen; Yu-Nung	2012-06-28
Light Emitting Device App 20120153315 - Shen; Yu-Nung	2012-06-21
Semiconductor Package And Method For Making The Same App 20120068358 - Shen; Yu-Nung	2012-03-22
Semiconductor Package And Method For Making The Same App 20120061831 - Shen; Yu-Nung	2012-03-15
Light Emitting Diode Package And Method For Fabricating The Same App 20120018760 - SHEN; Yu-Nung ; et al.	2012-01-26
Light Emitting Diode Device And Method For Fabricating The Same App 20120018748 - Shen; Yu-Nung ; et al.	2012-01-26
Semiconductor package and method for making the same Grant 8,076,775 - Shen December 13, 2	2011-12-13
Light-Emitting Diode Chip Package Body and Method for Manufacturing Same App 20110291155 - Shen; Yu-Nung	2011-12-01
Light-emitting diode chip package body and method for manufacturing same Grant 8,017,968 - Shen September 13, 2	2011-09-13
Light-emitting diode chip package body and packaging method thereof Grant 7,989,817 - Shen August 2, 2	2011-08-02
Light emitting diode with phosphor material and reflective layer and method for making same Grant 7,960,741 - Shen June 14, 2	2011-06-14
Light-emitting diode chip package body and packaging method thereof Grant 7,943,403 - Shen May 17, 2	2011-05-17
Light-emitting device with a long lifespan Grant 7,926,986 - Shen April 19, 2	2011-04-19
Light-Emitting Diode Illumination Apparatuses App 20110074296 - SHEN; Yu-Nung ; et al.	2011-03-31
Heat Dissipating Device and Module Using Same App 20110073159 - SHEN; Yu-Nung ; et al.	2011-03-31
Light-emitting diode chip package body and packaging method thereof Grant 7,897,984 - Shen March 1, 2	2011-03-01
Light-Emitting Diode Die Packages and Methods for Producing Same App 20110012138 - SHEN; Yu-Nung ; et al.	2011-01-20
LED package structure and method of packaging the same Grant 7,858,416 - Shen December 28, 2	2010-12-28
Light-emitting diode chip package body and packaging method thereof Grant 7,838,895 - Shen November 23, 2	2010-11-23
Light-emitting Diode Die Package And Method For Producing Same App 20100200870 - Shen; Yu-Nung	2010-08-12
Light-emitting Diode Die Packages And Illumination Apparatuses Using Same App 20100141132 - SHEN; YU-NUNG	2010-06-10
Light-emitting Device With A Long Lifespan App 20100133973 - Shen; Yu-Nung	2010-06-03
Light-emitting Device With A Long Lifespan App 20100135001 - Shen; Yu-Nung	2010-06-03
Light Source Package App 20100109551 - Shen; Yu-Nung	2010-05-06
Light-emitting device with a long lifespan Grant 7,682,053 - Shen March 23, 2	2010-03-23
Heat dissipating device Grant 7,672,130 - Shen March 2, 2	2010-03-02
LED Package Structure and Method of Packaging the Same App 20090321756 - SHEN; Yu-Nung	2009-12-31
LED package structure and method of packaging the same Grant 7,635,876 - Shen December 22, 2	2009-12-22
Light-Emitting Diode Chip Package Body and Method for Manufacturing Same App 20090283788 - Shen; Yu-Nung	2009-11-19
Light-emitting diode chip package body and packaging method thereof Grant 7,576,366 - Shen August 18, 2	2009-08-18
Semiconductor Package And Method For Making The Same App 20090194863 - Shen; Yu-Nung	2009-08-06
Backlight Module App 20090122513 - SHEN; Yu-Nung	2009-05-14
Backlight module Grant 7,520,627 - Shen April 21, 2	2009-04-21
Heat dissipating device App 20090059527 - Shen; Yu-Nung	2009-03-05
Led package and method for producing the same Grant 7,482,637 - Shen January 27, 2	2009-01-27
Method for Driving an LED App 20090015169 - Shen; Yu-Nung	2009-01-15
Method for Driving LED App 20090015170 - Shen; Yu-Nung	2009-01-15
LED package and method for producing the same Grant 7,456,437 - Shen November 25, 2	2008-11-25
Light-emitting diode chip package body and packaging method thereof Grant 7,427,805 - Shen September 23, 2	2008-09-23
Light Emitting Diode And Method For Making The Same App 20080210967 - Shen; Yu-Nung	2008-09-04
Light Emitting Device App 20080197365 - Shen; Yu-Nung	2008-08-21
Low profile stacked semiconductor chip package Grant 7,411,285 - Shen August 12, 2	2008-08-12
Lighting device Grant 7,408,370 - Shen August 5, 2	2008-08-05
Light-emitting diode chip package body and packaging method thereof App 20080173888 - Shen; Yu-Nung	2008-07-24
LED package and method for producing the same Grant 7,399,996 - Shen July 15, 2	2008-07-15
Light-emitting Device With A Long Lifespan App 20080158856 - Shen; Yu-Nung	2008-07-03
Method for making a circuit plate Grant 7,383,630 - Shen June 10, 2	2008-06-10
Light-emitting diode chip package body and packaging method thereof App 20080111149 - Shen; Yu-Nung	2008-05-15
Light-emitting diode chip package body and packaging method thereof App 20080105893 - Shen; Yu-Nung	2008-05-08
Light-emitting diode chip package body and packaging method thereof App 20080105892 - Shen; Yu-Nung	2008-05-08
Method for making a circuit plate App 20080105972 - Shen; Yu-Nung	2008-05-08
Light-emitting diode chip package body and packaging method thereof App 20080108158 - Shen; Yu-Nung	2008-05-08
Light Source Device For A Projector App 20080055911 - Shen; Yu-Nung	2008-03-06
Light-emitting diode chip package body and packaging method thereof Grant 7,339,198 - Shen March 4, 2	2008-03-04
LED package and method for producing the same Grant 7,307,287 - Shen December 11, 2	2007-12-11
Heat-Dissipating Device with Tapered Fins App 20070258214 - Shen; Yu-Nung	2007-11-08
Led package and method for producing the same App 20070249075 - Shen; Yu-Nung	2007-10-25
LED package and method for producing the same App 20070243646 - Shen; Yu-Nung	2007-10-18
LED package and method for producing the same App 20070241358 - Shen; Yu-Nung	2007-10-18
LED package and method for producing the same App 20070241359 - Shen; Yu-Nung	2007-10-18
LED package and method for producing the same App 20070243647 - Shen; Yu-Nung	2007-10-18
Apparatus for reading a data storage medium Grant 7,236,432 - Shen June 26, 2	2007-06-26
Wafer level package, wafer level packaging procedure for making wafer level package Grant 7,215,017 - Shen May 8, 2	2007-05-08
Conductive bump for semiconductor device and method for making the same Grant 7,180,184 - Shen February 20, 2	2007-02-20
Semiconductor device with a multi-level interconnect structure and method for making the same Grant 7,176,573 - Shen February 13, 2	2007-02-13
Low profile stacked semiconductor chip package App 20070001294 - Shen; Yu-Nung	2007-01-04
Lighting device App 20070001709 - Shen; Yu-Nung	2007-01-04
LED package structure and method of packaging the same App 20060243999 - Shen; Yu-Nung	2006-11-02
Semiconductor package and method for making the same Grant 7,084,499 - Shen August 1, 2	2006-08-01
Compact integrated circuit package Grant 7,053,473 - Shen May 30, 2	2006-05-30
LED package and method for producing the same App 20060057751 - Shen; Yu-Nung	2006-03-16
Method for making a circuit plate App 20060000635 - Shen; Yu-Nung	2006-01-05
LED package and method for producing the same App 20050269585 - Shen, Yu-Nung	2005-12-08
Semiconductor package and method of fabricating same Grant 6,921,715 - Shen July 26, 2	2005-07-26
Light-emitting diode chip package body and packaging method thereof App 20050156184 - Shen, Yu-Nung	2005-07-21
Light-emitting diode chip package body and packaging method thereof App 20050077529 - Shen, Yu-Nung	2005-04-14
Optical compact disk and portable optical compact disk drive adopted for the optical compact disk App 20040246825 - Shen, Yu-Nung	2004-12-09
Semiconductor package and method of fabricating same App 20040219712 - Shen, Yu-Nung	2004-11-04
Wafer level package, wafer level packaging procedure for making wafer level package App 20040217473 - Shen, Yu-Nung	2004-11-04
Method for forming conductive bump and device formed with such a conductive bump App 20040219774 - Shen, Yu-Nung	2004-11-04
Apparatus for reading a data storage medium App 20040208089 - Shen, Yu-Nung	2004-10-21
Semiconductor device and method for making the same App 20040155359 - Shen, Yu-Nung	2004-08-12
Conductive bump for semiconductor device and method for making the same App 20040142552 - Shen, Yu-Nung	2004-07-22
Semiconductor device with a multi-level interconnect structure and method for making the same App 20040135257 - Shen, Yu-Nung	2004-07-15
Semiconductor package and method for making the same App 20040108595 - Shen, Yu-Nung	2004-06-10
Low-profile semiconductor device Grant 6,577,014 - Shen , et al. June 10, 2	2003-06-10

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