loadpatents
name:-0.012917041778564
name:-0.0087778568267822
name:-0.0027039051055908
Shen; Leo Patent Filings

Shen; Leo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shen; Leo.The latest application filed is for "laser array beam combination device".

Company Profile
2.8.10
  • Shen; Leo - Shanghai CN
  • Shen; Leo - Shen Zhen CN
  • SHEN; Leo - Shen Zhen City CN
  • Shen; Leo - Guang Dong Province CN
  • Shen; Leo - Hsinchu TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Laser array beam combination device
Grant 10,666,015 - Zhang , et al.
2020-05-26
Brake device and linear actuator employing the brake device
Grant 10,371,223 - De Bernardi , et al.
2019-08-06
Laser Array Beam Combination Device
App 20190214785 - ZHANG; Shaofeng ;   et al.
2019-07-11
Toy structure kit with a connector and accessories
Grant 9,914,068 - Wood , et al. March 13, 2
2018-03-13
Toy Structure Kit With A Connector And Accessories
App 20170304740 - WOOD; Ethan K. ;   et al.
2017-10-26
Toy figures with expandable articulating joints
Grant 9,636,595 - Shen , et al. May 2, 2
2017-05-02
Toy Figures With Expandable Articulating Joints
App 20170087477 - SHEN; Leo ;   et al.
2017-03-30
Brake device and linear actuator employing the brake device
App 20170058980 - De Bernardi; Alberto ;   et al.
2017-03-02
Grappling apparatus and method of operation
Grant 9,533,233 - Rucker , et al. January 3, 2
2017-01-03
Building Set
App 20150038047 - Shen; Leo ;   et al.
2015-02-05
Grappling Apparatus and Method of Operation
App 20130237123 - Rucker; J. Austin ;   et al.
2013-09-12
High thermal conducting circuit substrate and manufacturing process thereof
Grant 7,540,969 - Ho , et al. June 2, 2
2009-06-02
High Thermal Conducting Circuit Substrate And Manufacturing Process Thereof
App 20080257590 - Ho; Chung W. ;   et al.
2008-10-23
High Thermal Conducting Circuit Substrate And Manufacturing Process Thereof
App 20070126093 - HO; CHUNG W. ;   et al.
2007-06-07
Printed wiring board and method of fabricating the same
Grant 7,223,687 - Ho , et al. May 29, 2
2007-05-29

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