Shen; Hui-Wen
Patent Applications and Registrations
Patent applications and USPTO patent grants for Shen; Hui-Wen.The latest application filed is for "3dic structure and method for hybrid bonding semiconductor wafers".
- Shen; Hui-Wen - Kaohsiung TW
- Shen; Hui-Wen - Kaohsiung City TW
| Patent | Date |
|---|---|
| 3DIC structure and method for hybrid bonding semiconductor wafers Grant 9,887,182 - Chen , et al. February 6, 2 | 2018-02-06 |
| 3DIC Structure and Method for Hybrid Bonding Semiconductor Wafers App 20170309603 - Chen; Ju-Shi ; et al. | 2017-10-26 |
| 3DIC structure and method for hybrid bonding semiconductor wafers Grant 9,666,566 - Chen , et al. May 30, 2 | 2017-05-30 |
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