Shen; Guo Qiang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shen; Guo Qiang.The latest application filed is for "integrated circuit packaging system with leadframe and method of manufacture thereof".

Company Profile

0.7.5

Shen; Guo Qiang - Shanghai CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated circuit package system with window opening Grant 8,901,439 - Chin , et al. December 2, 2	2014-12-02
Integrated circuit packaging system with leadframe and method of manufacture thereof Grant 8,581,382 - Shen , et al. November 12, 2	2013-11-12
Integrated circuit packaging system with package-on-package and method of manufacture thereof Grant 8,207,015 - Shen , et al. June 26, 2	2012-06-26
Integrated Circuit Packaging System With Leadframe And Method Of Manufacture Thereof App 20110309530 - Shen; Guo Qiang ; et al.	2011-12-22
Integrated Circuit Packaging System With Package-on-package And Method Of Manufacture Thereof App 20110266664 - Shen; Guo Qiang ; et al.	2011-11-03
Pick-up heads and systems for die bonding and related applications Grant 8,037,918 - Wang , et al. October 18, 2	2011-10-18
Integrated circuit package system with support structure for die overhang Grant 7,989,941 - Chin , et al. August 2, 2	2011-08-02
Integrated Circuit Package System With Support Structure For Die Overhang App 20090236751 - Chin; Chee Keong ; et al.	2009-09-24
Pick-up heads and systems for die bonding and related applications App 20080128081 - Wang; Ya Ping ; et al.	2008-06-05
Integrated Circuit Package System With Window Opening App 20080041964 - Chin; Chee Keong ; et al.	2008-02-21

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