Sheasley; David

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sheasley; David.The latest application filed is for "bonding dissimilar materials with adhesive paste".

Company Profile

2.14.13

Sheasley; David - Rochester MI

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Bonding Dissimilar Materials with Adhesive Paste App 20190218435 - Bradley; Renee ; et al.	2019-07-18
Bonding dissimilar materials with adhesive paste Grant 10,240,075 - Bradley , et al.	2019-03-26
Method For Formation And Application Of Adhesive App 20180148620 - Synnestvedt; Blake ; et al.	2018-05-31
Method for formation and application of adhesive Grant 9,879,162 - Synnestvedt , et al. January 30, 2	2018-01-30
Bonding Dissimilar Materials with Adhesive Paste App 20160108297 - Bradley; Renee ; et al.	2016-04-21
Method For Formation And Application Of Adhesive App 20140238575 - Synnestvedt; Blake ; et al.	2014-08-28
Structural mounting insert having a non-conductive isolator Grant 8,808,478 - Nitsche , et al. August 19, 2	2014-08-19
Handling layer and adhesive parts formed therewith Grant 8,741,094 - Sheasley , et al. June 3, 2	2014-06-03
Method of forming a toughened adhesive material Grant 8,702,889 - Sheasley , et al. April 22, 2	2014-04-22
Structural Mounting Insert Having A Non-conductive Isolator App 20130255855 - Nitsche; Olaf ; et al.	2013-10-03
Structural mounting insert having a non-conductive isolator Grant 8,459,675 - Nitsche , et al. June 11, 2	2013-06-11
Handling Layer And Adhesive Parts Formed Therewith App 20120111488 - Sheasley; David ; et al.	2012-05-10
Handling layer and adhesive parts formed therewith Grant 8,105,460 - Sheasley , et al. January 31, 2	2012-01-31
Structural Mounting Insert Having A Non-conductive Isolator App 20110278802 - Nitsche; Olaf ; et al.	2011-11-17
Structural mounting insert having a non-conductive isolator Grant 7,984,919 - Nitsche , et al. July 26, 2	2011-07-26
Toughened activatable material for sealing, baffling or reinforcing and method of forming same Grant 7,892,396 - Sheasley February 22, 2	2011-02-22
Structural Mounting Insert Having A Non-conductive Isolator App 20100289242 - Nitsche; Olaf ; et al.	2010-11-18
Toughened Adhesive Material App 20080308212 - Sheasley; David ; et al.	2008-12-18
Activatable material for sealing, baffling or reinforcing and method of forming same Grant 7,438,782 - Sheasley , et al. October 21, 2	2008-10-21
Handling Layer And Adhesive Parts Formed Therewith App 20080060742 - Sheasley; David ; et al.	2008-03-13
Toughened Activatable Material For Sealing, Baffling Or Reinforcing And Method Of Forming Same App 20080029200 - Sheasley; David	2008-02-07
Activatable Material For Sealing, Baffling Or Reinforcing And Method Of Forming Same App 20070284036 - Sheasley; David ; et al.	2007-12-13
Method of applying activatable material to a member Grant 7,180,027 - Hable , et al. February 20, 2	2007-02-20
Method of applying activatable material to a member App 20050217785 - Hable, Christopher ; et al.	2005-10-06

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