Shearer; Ronald M.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Shearer; Ronald M..The latest application filed is for "power electronic module having improved heat dissipation capability".
- Shearer; Ronald M. - Kokomo IN
| Patent | Date |
|---|---|
| Multi-layer electrically isolated thermal conduction structure for a circuit board assembly Grant 7,808,788 - Gertiser , et al. October 5, 2 | 2010-10-05 |
| Power electronic module having improved heat dissipation capability App 20090091889 - Oman; Todd P. ; et al. | 2009-04-09 |
| Multi-layer electrically isolated thermal conduction structure for a circuit board assembly App 20090002950 - Gertiser; Kevin M. ; et al. | 2009-01-01 |
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