| Patent | Date |
|---|
Processing system for forming layers
Grant 11,414,740 - Lerner , et al. August 16, 2 | 2022-08-16 |
Apparatus and method for controlling a flow process material to a deposition chamber
Grant 11,393,703 - Lerner , et al. July 19, 2 | 2022-07-19 |
Low Resistance And High Reliability Metallization Module
App 20220108917 - Shaviv; Roey ; et al. | 2022-04-07 |
Methods And Apparatus For Forming Dual Metal Interconnects
App 20210320064 - PARIKH; SUKETU A. ; et al. | 2021-10-14 |
Enhanced plating bath and additive chemistries for cobalt plating
Grant 11,118,278 - Emesh , et al. September 14, 2 | 2021-09-14 |
Methods and apparatus for forming dual metal interconnects
Grant 11,075,165 - Parikh , et al. July 27, 2 | 2021-07-27 |
Magnetized substrate carrier apparatus with shadow mask for deposition
Grant 11,056,277 - Diehl , et al. July 6, 2 | 2021-07-06 |
Substrate carrier having hard mask
Grant 11,047,039 - Lerner , et al. June 29, 2 | 2021-06-29 |
Methods and apparatus for hybrid feature metallization
Grant 11,024,537 - Shaviv , et al. June 1, 2 | 2021-06-01 |
Methods and apparatus for filling a feature disposed in a substrate
Grant 10,950,500 - Shaviv , et al. March 16, 2 | 2021-03-16 |
Vapor Delivery Methods And Apparatus
App 20210069745 - LERNER; Alexander N. ; et al. | 2021-03-11 |
Methods And Apparatus For Hybrid Feature Metallization
App 20210043506 - Shaviv; Roey ; et al. | 2021-02-11 |
Evaporator Chamber For Forming Films On Substrates
App 20210025048 - LERNER; Alexander N. ; et al. | 2021-01-28 |
Methods And Apparatus For Forming Dual Metal Interconnects
App 20210020569 - PARIKH; SUKETU A. ; et al. | 2021-01-21 |
Processing System For Forming Layers
App 20200385851 - LERNER; Alexander N. ; et al. | 2020-12-10 |
Methods And Systems For Forming Films On Substrates
App 20200378000 - Lerner; Alexander N. ; et al. | 2020-12-03 |
Alignment Module With A Cleaning Chamber
App 20200373134 - LERNER; Alexander N. ; et al. | 2020-11-26 |
System And Method For Aligning A Mask With A Substrate
App 20200373183 - LERNER; Alexander N. ; et al. | 2020-11-26 |
Selective cobalt removal for bottom up gapfill
Grant 10,770,346 - Wang , et al. Sep | 2020-09-08 |
Methods And Apparatus For Filling A Feature Disposed In A Substrate
App 20200251340 - Kind Code | 2020-08-06 |
Apparatus And Methods For Asymmetric Deposition Of Metal On High Aspect Ratio Nanostructures
App 20200219720 - SHEU; BEN-LI ; et al. | 2020-07-09 |
Magnetized Substrate Carrier Apparatus With Shadow Mask For Deposition
App 20200211769 - DIEHL; DANIEL LEE ; et al. | 2020-07-02 |
Methods for asymmetric deposition of metal on high aspect ratio nanostructures
Grant 10,636,655 - Sheu , et al. | 2020-04-28 |
Co or Ni and Cu integration for small and large features in integrated circuits
Grant 10,622,252 - Shaviv , et al. | 2020-04-14 |
Segmented Showerhead For Uniform Delivery Of Multiple Precursors
App 20200087790 - LERNER; ALEXANDER ; et al. | 2020-03-19 |
Enhanced Plating Bath And Additive Chemistries For Cobalt Plating
App 20200048784 - EMESH; Ismail ; et al. | 2020-02-13 |
Showerhead For Providing Multiple Materials To A Process Chamber
App 20200048767 - KOTHNUR; PRASHANTH ; et al. | 2020-02-13 |
Apparatus And Method For Controlling A Flow Process Material To A Deposition Chamber
App 20190382890 - LERNER; ALEXANDER ; et al. | 2019-12-19 |
Enhanced plating bath and additive chemistries for cobalt plating
Grant 10,487,410 - Emesh , et al. Nov | 2019-11-26 |
Apparatus And Methods For Asymmetric Deposition Of Metal On High Aspect Ratio Nanostructures
App 20190287791 - SHEU; BEN-LI ; et al. | 2019-09-19 |
Substrate Carrier Having Hard Mask
App 20190211442 - LERNER; ALEXANDER ; et al. | 2019-07-11 |
Methods Of Etching A Tungsten Layer
App 20190198392 - MULLICK; AMRITA B. ; et al. | 2019-06-27 |
Selective Cobalt Removal For Bottom Up Gapfill
App 20190122923 - Wang; Xikun ; et al. | 2019-04-25 |
Selective cobalt removal for bottom up gapfill
Grant 10,163,696 - Wang , et al. Dec | 2018-12-25 |
Methods And Apparatus For Filling A Feature Disposed In A Substrate
App 20180323103 - Shaviv; Roey ; et al. | 2018-11-08 |
Electroplating apparatus with membrane tube shield
Grant 10,081,881 - McHugh , et al. September 25, 2 | 2018-09-25 |
Methods for producing interconnects in semiconductor devices
Grant 10,062,607 - Emesh , et al. August 28, 2 | 2018-08-28 |
Methods Of Electrochemical Deposition For Void-free Gap Fill
App 20180171502 - Aksu; Serdar ; et al. | 2018-06-21 |
Methods of electrochemical deposition for void-free gap fill
Grant 10,000,860 - Aksu , et al. June 19, 2 | 2018-06-19 |
Selective Cobalt Removal For Bottom Up Gapfill
App 20180138085 - Wang; Xikun ; et al. | 2018-05-17 |
Co Or Ni And Cu Integration For Small And Large Features In Integrated Circuits
App 20180122696 - Shaviv; Roey ; et al. | 2018-05-03 |
Method for electrochemically depositing metal on a reactive metal film
Grant 9,840,788 - Shaviv , et al. December 12, 2 | 2017-12-12 |
Method for electrochemically depositing metal on a reactive metal film
Grant 9,828,687 - Shaviv , et al. November 28, 2 | 2017-11-28 |
Co or Ni and Cu integration for small and large features in integrated circuits
Grant 9,805,976 - Shaviv , et al. October 31, 2 | 2017-10-31 |
Systems and methods for electrochemical deposition on a workpiece including removing contamination from seed layer surface prior to ECD
Grant 9,768,060 - Shaviv , et al. September 19, 2 | 2017-09-19 |
Forming cobalt interconnections on a substrate
Grant 9,758,896 - Shaviv , et al. September 12, 2 | 2017-09-12 |
Enhanced Plating Bath And Additive Chemistries For Cobalt Plating
App 20170247806 - EMESH; Ismail ; et al. | 2017-08-31 |
Co Or Ni And Cu Integration For Small And Large Features In Integrated Circuits
App 20170200642 - Shaviv; Roey ; et al. | 2017-07-13 |
Electrochemical plating methods
Grant 9,704,717 - Lam , et al. July 11, 2 | 2017-07-11 |
Method for forming interconnects
Grant 9,691,660 - Shaviv June 27, 2 | 2017-06-27 |
Forming Cobalt Interconnections On A Substrate
App 20170159199 - Shaviv; Roey ; et al. | 2017-06-08 |
Photoresist strip processes for improved device integrity
Grant 9,613,825 - Shaviv , et al. April 4, 2 | 2017-04-04 |
Methods For Producing Interconnects In Semiconductor Devices
App 20170047249 - Emesh; Ismail T. ; et al. | 2017-02-16 |
Electroplating Apparatus With Membrane Tube Shield
App 20170009368 - McHugh; Paul R. ; et al. | 2017-01-12 |
Method For Forming Interconnects
App 20160372369 - Shaviv; Roey | 2016-12-22 |
Electrochemical plating methods
Grant 9,496,145 - Lam , et al. November 15, 2 | 2016-11-15 |
Methods For Forming Cobalt Interconnects
App 20160309596 - Shaviv; Roey ; et al. | 2016-10-20 |
Electroplating apparatus with membrane tube shield
Grant 9,469,911 - McHugh , et al. October 18, 2 | 2016-10-18 |
Methods for producing interconnects in semiconductor devices
Grant 9,425,092 - Emesh , et al. August 23, 2 | 2016-08-23 |
Stand Alone Anneal System For Semiconductor Wafers
App 20160240405 - Francischetti; Vincent Steffan ; et al. | 2016-08-18 |
Forming Cobalt Interconnections On A Substrate
App 20160237587 - Shaviv; Roey ; et al. | 2016-08-18 |
Electroplating Apparatus With Membrane Tube Shield
App 20160208402 - McHugh; Paul R. ; et al. | 2016-07-21 |
Method for forming interconnects
Grant 9,378,976 - Shaviv June 28, 2 | 2016-06-28 |
Systems And Methods For Removing Contamination From Seed Layer Surface
App 20160126134 - Shaviv; Roey ; et al. | 2016-05-05 |
Systems And Methods For Electrochemical Deposition On A Workpiece Including Removing Contamination From Seed Layer Surface Prior To Ecd
App 20160126104 - Shaviv; Roey ; et al. | 2016-05-05 |
Electrochemical Plating Methods
App 20150357195 - Lam; John W. ; et al. | 2015-12-10 |
Method For Electrochemically Depositing Metal On A Reactive Metal Film
App 20150348837 - Shaviv; Roey ; et al. | 2015-12-03 |
Method For Electrochemically Depositing Metal On A Reactive Metal Film
App 20150348826 - Shaviv; Roey ; et al. | 2015-12-03 |
Method For Electrochemically Depositing Metal On A Reactive Metal Film
App 20150345045 - Shaviv; Roey ; et al. | 2015-12-03 |
Methods For Depositing Metal On A Reactive Metal Film
App 20150348836 - Shaviv; Roey ; et al. | 2015-12-03 |
Super Conformal Plating
App 20150322587 - Pabelico; Chris ; et al. | 2015-11-12 |
Super Conformal Metal Plating From Complexed Electrolytes
App 20150325477 - Shaviv; Roey ; et al. | 2015-11-12 |
Method For Forming Interconnects
App 20150287675 - Shaviv; Roey | 2015-10-08 |
Electrochemical Plating Methods
App 20150270133 - Lam; John W. ; et al. | 2015-09-24 |
Conformal films on semiconductor substrates
Grant 9,117,884 - Shaviv , et al. August 25, 2 | 2015-08-25 |
Methods of forming tensile tungsten films and compressive tungsten films
Grant 9,034,760 - Chen , et al. May 19, 2 | 2015-05-19 |
Methods For Producing Interconnects In Semiconductor Devices
App 20140287577 - Emesh; Ismail T. ; et al. | 2014-09-25 |
Metal And Silicon Containing Capping Layers For Interconnects
App 20140216336 - Yu; Jengyi ; et al. | 2014-08-07 |
Metal and silicon containing capping layers for interconnects
Grant 8,753,978 - Yu , et al. June 17, 2 | 2014-06-17 |
Electrochemical Deposition On A Workpiece Having High Sheet Resistance
App 20140103534 - Emesh; Ismail T. ; et al. | 2014-04-17 |
Enhancing Adhesion Of Cap Layer Films
App 20140094038 - Haverkamp; Jason Dirk ; et al. | 2014-04-03 |
Methods Of Forming Tensile Tungsten Films And Compressive Tungsten Films
App 20140011358 - Chen; Feng ; et al. | 2014-01-09 |
Metal And Silicon Containing Capping Layers For Interconnects
App 20130143401 - Yu; Jengyi ; et al. | 2013-06-06 |
Photoresist Strip Processes For Improved Device Integrity
App 20130048014 - Shaviv; Roey ; et al. | 2013-02-28 |
Conformal films on semiconductor substrates
Grant 8,298,933 - Shaviv , et al. October 30, 2 | 2012-10-30 |
Methods Of Controlling Tungsten Film Properties
App 20120199887 - Chan; Lana ; et al. | 2012-08-09 |
Diffusion barrier layers
Grant 8,053,861 - Mountsier , et al. November 8, 2 | 2011-11-08 |
Protection of Cu damascene interconnects by formation of a self-aligned buffer layer
Grant 8,030,777 - van Schravendijk , et al. October 4, 2 | 2011-10-04 |
Protective self-aligned buffer layers for damascene interconnects
Grant 8,021,486 - Yu , et al. September 20, 2 | 2011-09-20 |
PVD-based metallization methods for fabrication of interconnections in semiconductor devices
Grant 7,964,504 - Shaviv , et al. June 21, 2 | 2011-06-21 |
Diffusion Barrier Layers
App 20100187693 - Mountsier; Thomas W. ; et al. | 2010-07-29 |
PVD-based metallization methods for fabrication of interconnections in semiconductor devices
Grant 7,745,332 - Shaviv , et al. June 29, 2 | 2010-06-29 |
Protective self-aligned buffer layers for damascene interconnects
Grant 7,704,873 - Yu , et al. April 27, 2 | 2010-04-27 |
Methods for fabricating semiconductor structures with backside stress layers
Grant 7,670,931 - Shaviv March 2, 2 | 2010-03-02 |
Conformal Films on Semiconductor Substrates
App 20100009533 - Shaviv; Roey ; et al. | 2010-01-14 |
Protective self-aligned buffer layers for damascene interconnects
Grant 7,576,006 - Yu , et al. August 18, 2 | 2009-08-18 |
Methods for Fabricating Semiconductor Structures With Backside Stress Layers
App 20080286918 - Shaviv; Roey | 2008-11-20 |
Protection of Cu damascene interconnects by formation of a self-aligned buffer layer
Grant 7,396,759 - van Schravendijk , et al. July 8, 2 | 2008-07-08 |
Transparent inter-metal dielectric stack for CMOS image sensors
App 20050003659 - Markowitz, Leah ; et al. | 2005-01-06 |
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