Sharma; Nirmal

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sharma; Nirmal.The latest application filed is for "methods and apparatus for passive attachment of components for integrated circuits".

Company Profile

2.14.17

Sharma; Nirmal - Fremont CA
SHARMA; NIRMAL - Carlsbad CA
Sharma; Nirmal - Shrewsbury MA
Sharma; Nirmal - Fremon CA
Sharma; Nirmal - Sunnyvale CA
Sharma; Nirmal - Hyderabad IN
Sharma; Nirmal - Vikasnagar IN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods And Apparatus For Passive Attachment Of Components For Integrated Circuits App 20200355525 - Taylor; William P. ; et al.	2020-11-12
Wafer Dicing Methods App 20180233410 - JAMES; JOHN ; et al.	2018-08-16
Sensor and method of providing a sensor Grant 9,228,860 - Sharma , et al. January 5, 2	2016-01-05
Methods and Apparatus for Passive Attachment of Components for Integrated Circuits App 20150285874 - Taylor; William P. ; et al.	2015-10-08
Methods and apparatus for flip-chip-on-lead semiconductor package Grant 8,785,250 - Sharma , et al. July 22, 2	2014-07-22
Magnetic Field Sensors and Methods for Fabricating the Magnetic Field Sensors App 20130267043 - Ararao; Virgil ; et al.	2013-10-10
Magnetic Field Sensors and Methods for Fabricating the Magnetic Field Sensors App 20130264667 - Ararao; Virgil ; et al.	2013-10-10
Magnetic field sensors and methods for fabricating the magnetic field sensors Grant 8,486,755 - Ararao , et al. July 16, 2	2013-07-16
Magnetic field sensors and methods for fabricating the magnetic field sensors Grant 8,461,677 - Ararao , et al. June 11, 2	2013-06-11
Rapid and homogenous heat treatment of large metallic sample using high power microwaves Grant 8,344,301 - Singh , et al. January 1, 2	2013-01-01
Methods And Apparatus For Passive Attachment Of Components For Integrated Circuits App 20120086090 - Sharma; Nirmal ; et al.	2012-04-12
Methods for multi-stage molding of integrated circuit package Grant 8,143,169 - Engel , et al. March 27, 2	2012-03-27
Magnetic Field Sensors and Methods for Fabricating the Magnetic Field Sensors App 20120013333 - Ararao; Virgil ; et al.	2012-01-19
Methods For Multi-stage Molding Of Integrated Circuit Package App 20100330708 - Engel; Raymond W. ; et al.	2010-12-30
Methods and apparatus for multi-stage molding of integrated circuit package Grant 7,816,772 - Engel , et al. October 19, 2	2010-10-19
Rapid and homogenous heat treatment of large metallic sample using high power microwaves App 20100163554 - Singh; Kulvir ; et al.	2010-07-01
Magnetic Field Sensors and Methods for Fabricating the Magnetic Field Sensors App 20100141249 - Ararao; Virgil ; et al.	2010-06-10
Methods And Apparatus For Multi-stage Molding Of Integrated Circuit Package App 20080237818 - Engel; Raymond W. ; et al.	2008-10-02
Methods And Apparatus For Flip-chip-on-lead Semiconductor Package App 20080230879 - Sharma; Nirmal ; et al.	2008-09-25
Methods and apparatus for Flip-Chip-On-Lead semiconductor package Grant 7,361,531 - Sharma , et al. April 22, 2	2008-04-22
Methods And Apparatus For Passive Attachment Of Components For Integrated Circuits App 20080013298 - Sharma; Nirmal ; et al.	2008-01-17
Integrated Current Sensor App 20070279053 - Taylor; William P. ; et al.	2007-12-06
Methods and apparatus for Flip-Chip-On-Lead semiconductor package App 20070099348 - Sharma; Nirmal ; et al.	2007-05-03
Current Sensor App 20060219436 - Taylor; WilliamP ; et al.	2006-10-05
Current sensor Grant 6,995,315 - Sharma , et al. February 7, 2	2006-02-07
Current sensor App 20050248336 - Sharma, Nirmal ; et al.	2005-11-10
Matched impedance bonding technique in high-speed integrated circuits Grant 6,646,343 - Sharma , et al. November 11, 2	2003-11-11

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