Sharma; Laxminarayan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Sharma; Laxminarayan.The latest application filed is for "conductive clip connection arrangements for semiconductor packages".
- Sharma; Laxminarayan - San Diego CA
- Sharma; Laxminarayan - Austin TX
| Patent | Date |
|---|---|
| Conductive clip connection arrangements for semiconductor packages Grant 10,490,489 - Molin , et al. Nov | 2019-11-26 |
| Conductive Clip Connection Arrangements For Semiconductor Packages App 20190080989 - Molin; Stuart B. ; et al. | 2019-03-14 |
| Conductive clip connection arrangements for semiconductor packages Grant 10,128,170 - Molin , et al. November 13, 2 | 2018-11-13 |
| Conductive Clip Connection Arrangements For Semiconductor Packages App 20180197808 - Molin; Stuart B. ; et al. | 2018-07-12 |
| Die stacking system and method Grant 9,159,694 - Sanchez , et al. October 13, 2 | 2015-10-13 |
| Integrated Circuit Packaging with Split Paddle App 20110115063 - SHARMA; Laxminarayan ; et al. | 2011-05-19 |
| Die Stacking System and Method App 20110079905 - Sanchez; Henry ; et al. | 2011-04-07 |
| Die stacking system and method Grant 7,872,356 - Sanchez , et al. January 18, 2 | 2011-01-18 |
| Integrated circuit packaging Grant 7,602,050 - Sharma , et al. October 13, 2 | 2009-10-13 |
| Die stacking system and method App 20080283993 - Sanchez; Henry ; et al. | 2008-11-20 |
| Integrated circuit packaging App 20070096268 - Sharma; Laxminarayan ; et al. | 2007-05-03 |
| Semiconductor device having plated contacts and method thereof Grant 5,990,547 - Sharma , et al. November 23, 1 | 1999-11-23 |
| Semiconductor device having multiple overlapping rows of bond pads with conductive interconnects and method of pad placement Grant 5,962,926 - Torres , et al. October 5, 1 | 1999-10-05 |
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