Shao, Wenbo
USPTO Trademark & Patent Filings
Trademark applications and grants for Shao, Wenbo. Shao, Wenbo has 1 trademark applications. The latest application filed is for "LUCKYGYM"
- Company Aliases
- Shao, Wenbo
- wenbo shao
- Shao; Wenbo - New Canaan CT
- Shao; Wenbo - Stamford CT
- Shao; Wenbo - Milford CT
- Shao; Wenbo - Millford CT
| Entity Type | INDIVIDUAL |
| Address | Hubin Rd, Binhu Dist Rm 2702, Bldg 13, Jinyu Blue Bay Wuxi Jiangsu CHINA 214000 |
Trademarks Patents
| Patent Application | Date |
|---|---|
| Method and Wet Chemical Compositions for Diffusion Barrier Formation 20220259724 - 17/665871 Hurtubise; Richard W. ; et al. | 2022-08-18 |
| Composition and Method for Fabrication of Nickel Interconnects 20220064811 - 17/416703 Yakobson; Eric ; et al. | 2022-03-03 |
| COPPER FILLING OF THROUGH SILICON VIAS 20190003068 - 13/699910 Richardson; Thomas B. ; et al. | 2019-01-03 |
| Process for Filling Vias in the Microelectronics 20160254156 - 15/148738 Richardson; Thomas B. ; et al. | 2016-09-01 |
| PROCESS FOR FILLING VIAS IN THE MICROELECTRONICS 20140120722 - 13/981974 Richardson; Thomas B. ; et al. | 2014-05-01 |
| Process for filling vias in the microelectronics 10,541,140 - 13/981,974 Richardson , et al. Ja | 2020-01-21 |
| Process for filling vias in the microelectronics 10,541,140 - 13/981,974 Richardson , et al. Ja | 2020-01-21 |
| Copper filling of through silicon vias 10,221,496 - 13/699,910 Richardson , et al. | 2019-03-05 |
| Copper filling of through silicon vias 10,221,496 - 13/699,910 Richardson , et al. | 2019-03-05 |
| Process for filling vias in the microelectronics 10,103,029 - 15/148,738 Richardson , et al. October 16, 2 | 2018-10-16 |
Mark Image Registration | Serial | Trademark Application Date |
|---|---|
"LUCKYGYM" 98666326 |
LUCKYGYM 2024-07-25 |
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