| Patent | Date |
|---|
Packaged Semiconductor Device Including Liquid-Cooled Lid and Methods of Forming the Same
App 20220310482 - Hsiao; Sheng-Tsung ; et al. | 2022-09-29 |
Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor device
Grant 11,456,256 - Tung , et al. September 27, 2 | 2022-09-27 |
Bonding method of package components and bonding apparatus
Grant 11,443,981 - Hsiao , et al. September 13, 2 | 2022-09-13 |
Bonding with Pre-Deoxide Process and Apparatus for Performing the Same
App 20220285310 - Yu; Chen-Hua ; et al. | 2022-09-08 |
Semiconductor Device And Manufacturing Method Thereof
App 20220262705 - Wu; Chung-Jung ; et al. | 2022-08-18 |
Packaged semiconductor device including liquid-cooled lid and methods of forming the same
Grant 11,410,910 - Hsiao , et al. August 9, 2 | 2022-08-09 |
Bonded Semiconductor Devices and Methods of Forming The Same
App 20220246574 - Yu; Chen-Hua ; et al. | 2022-08-04 |
Semiconductor device and manufacturing method thereof
Grant 11,387,164 - Wu , et al. July 12, 2 | 2022-07-12 |
Semiconductor device and manufacturing method thereof
Grant 11,342,242 - Wu , et al. May 24, 2 | 2022-05-24 |
Bonding with pre-deoxide process and apparatus for performing the same
Grant 11,342,302 - Yu , et al. May 24, 2 | 2022-05-24 |
Bonded semiconductor devices and methods of forming the same
Grant 11,315,900 - Yu , et al. April 26, 2 | 2022-04-26 |
Packaged Semiconductor Device Including Liquid-Cooled Lid and Methods of Forming the Same
App 20220037231 - Hsiao; Sheng-Tsung ; et al. | 2022-02-03 |
Method Of Forming Semiconductor Package With Composite Thermal Interface Material Structure
App 20210384103 - SHAO; Tung-Liang ; et al. | 2021-12-09 |
Semiconductr Device, Stacked Semiconductor Device And Manufacturing Method Of Semiconductor Device
App 20210375766 - Tung; Chih-Hang ; et al. | 2021-12-02 |
Package Structure
App 20210375724 - SHAO; Tung-Liang ; et al. | 2021-12-02 |
Chip Package Structure With Redistribution Layer Having Bonding Portion
App 20210335750 - TUNG; Chih-Hang ; et al. | 2021-10-28 |
Semiconductor package with composite thermal interface material structure and method of forming the same
Grant 11,107,747 - Shao , et al. August 31, 2 | 2021-08-31 |
Package structure and method for forming the same
Grant 11,101,195 - Shao , et al. August 24, 2 | 2021-08-24 |
Semiconductor Device And Fabricating Method Thereof
App 20210225788 - HUANG; CHANG-PIN ; et al. | 2021-07-22 |
Chip package structure and method for forming the same
Grant 11,056,459 - Tung , et al. July 6, 2 | 2021-07-06 |
Bump structure and fabricating method thereof
Grant 10,985,121 - Huang , et al. April 20, 2 | 2021-04-20 |
Semiconductor Component With Cooling Structure
App 20210098336 - Shao; Tung-Liang ; et al. | 2021-04-01 |
Semiconductor Device And Manufacturing Method Thereof
App 20210082849 - SHAO; TUNG-LIANG ; et al. | 2021-03-18 |
Semiconductor Device And Manufacturing Method Thereof
App 20210066164 - Wu; Chung-Jung ; et al. | 2021-03-04 |
Bonding Method Of Package Components And Bonding Apparatus
App 20210050251 - Hsiao; Yi-Li ; et al. | 2021-02-18 |
Package with solder regions aligned to recesses
Grant 10,879,198 - Yang , et al. December 29, 2 | 2020-12-29 |
Semiconductor device and manufacturing method thereof
Grant 10,854,564 - Shao , et al. December 1, 2 | 2020-12-01 |
Semiconductor structure along with multiple chips bonded through microbump and manufacturing method thereof
Grant 10,854,580 - Lin , et al. December 1, 2 | 2020-12-01 |
Bonded Semiconductor Devices and Methods of Forming The Same
App 20200365550 - Yu; Chen-Hua ; et al. | 2020-11-19 |
Hollow metal pillar packaging scheme
Grant 10,825,804 - Huang , et al. November 3, 2 | 2020-11-03 |
Bonded semiconductor devices and methods of forming the same
Grant 10,734,348 - Yu , et al. | 2020-08-04 |
Bonded Semiconductor Devices And Methods Of Forming The Same
App 20200098720 - Yu; Chen-Hua ; et al. | 2020-03-26 |
Package Structure And Method For Forming The Same
App 20200091039 - SHAO; Tung-Liang ; et al. | 2020-03-19 |
Semiconductor Package With Composite Thermal Interface Material Structure And Method Of Forming The Same
App 20200091034 - SHAO; Tung-Liang ; et al. | 2020-03-19 |
Chip Package Structure And Method For Forming The Same
App 20200058614 - TUNG; Chih-Hang ; et al. | 2020-02-20 |
Semiconductor Structure And Manufacturing Method Thereof
App 20190393197 - LIN; WEI-HENG ; et al. | 2019-12-26 |
Hollow Metal Pillar Packaging Scheme
App 20190341377 - Huang; Chang-Pin ; et al. | 2019-11-07 |
Semiconductor structure including plurality of chips along with air gap and manufacturing method thereof
Grant 10,468,385 - Lin , et al. No | 2019-11-05 |
Bonding with Pre-Deoxide Process and Apparatus for Performing the Same
App 20190326251 - Yu; Chen-Hua ; et al. | 2019-10-24 |
Hollow metal pillar packaging scheme
Grant 10,354,986 - Huang , et al. July 16, 2 | 2019-07-16 |
Package with Solder Regions Aligned to Recesses
App 20190214356 - Yang; Ching-Jung ; et al. | 2019-07-11 |
Semiconductor Structure Including Plurality Of Chips Along With Air Gap And Manufacturing Method Thereof
App 20190164937 - LIN; WEI-HENG ; et al. | 2019-05-30 |
Semiconductor Device And Fabricating Method Thereof
App 20190115312 - HUANG; CHANG-PIN ; et al. | 2019-04-18 |
Package with solder regions aligned to recesses
Grant 10,262,958 - Yang , et al. | 2019-04-16 |
Immersion interconnections for semiconductor devices and methods of manufacture thereof
Grant 10,229,901 - Shao , et al. | 2019-03-12 |
Semiconductor device and fabricating method thereof
Grant 10,163,828 - Huang , et al. Dec | 2018-12-25 |
Semiconductor structure and manufacturing method thereof
Grant 10,153,218 - Chen , et al. Dec | 2018-12-11 |
Semiconductor device and method of manufacturing the same
Grant 10,141,291 - Shao , et al. Nov | 2018-11-27 |
Semiconductor Device And Manufacturing Method Thereof
App 20180331059 - SHAO; TUNG-LIANG ; et al. | 2018-11-15 |
Multi-strike process for bonding packages and the packages thereof
Grant 10,068,868 - Shao , et al. September 4, 2 | 2018-09-04 |
Package with Solder Regions Aligned to Recesses
App 20180226370 - Yang; Ching-Jung ; et al. | 2018-08-09 |
Semiconductor device and manufacturing method thereof
Grant 10,032,737 - Shao , et al. July 24, 2 | 2018-07-24 |
Semiconductor packages and methods of forming the same
Grant 9,997,467 - Shao , et al. June 12, 2 | 2018-06-12 |
Semiconductor Structure And Manufacturing Method Thereof
App 20180151472 - CHEN; TSUNG-YU ; et al. | 2018-05-31 |
Package with solder regions aligned to recesses
Grant 9,947,630 - Yang , et al. April 17, 2 | 2018-04-17 |
Semiconductor Packages and Methods of Forming the Same
App 20180053730 - Shao; Tung-Liang ; et al. | 2018-02-22 |
Thinning process using metal-assisted chemical etching
Grant 9,893,046 - Yang , et al. February 13, 2 | 2018-02-13 |
Hollow Metal Pillar Packaging Scheme
App 20180040599 - Huang; Chang-Pin ; et al. | 2018-02-08 |
Thinning Process Using Metal-assisted Chemical Etching
App 20180012880 - YANG; Su-Chun ; et al. | 2018-01-11 |
Semiconductor Devices And Methods Of Manufacture Thereof
App 20170373050 - Shao; Tung-Liang ; et al. | 2017-12-28 |
System and Method for Immersion Bonding
App 20170330855 - Tung; Chih-Hang ; et al. | 2017-11-16 |
Hollow metal pillar packaging scheme
Grant 9,812,434 - Huang , et al. November 7, 2 | 2017-11-07 |
Capacitor in post-passivation structures and methods of forming the same
Grant 9,786,591 - Tsai , et al. October 10, 2 | 2017-10-10 |
Hollow Metal Pillar Packaging Scheme
App 20170271316 - Huang; Chang-Pin ; et al. | 2017-09-21 |
Multi-Strike Process for Bonding
App 20170194278 - Shao; Tung-Liang ; et al. | 2017-07-06 |
Hollow metal pillar packaging scheme
Grant 9,679,883 - Huang , et al. June 13, 2 | 2017-06-13 |
Metal insulator metal capacitor and method for making the same
Grant 9,673,270 - Lai , et al. June 6, 2 | 2017-06-06 |
Semiconductor Device And Method Of Manufacturing The Same
App 20170154881 - SHAO; TUNG-LIANG ; et al. | 2017-06-01 |
Package with Solder Regions Aligned to Recesses
App 20170141054 - Yang; Ching-Jung ; et al. | 2017-05-18 |
Multi-strike process for bonding
Grant 9,576,929 - Shao , et al. February 21, 2 | 2017-02-21 |
Capacitor in Post-Passivation Structures and Methods of Forming the Same
App 20170040256 - Tsai; Hao-Yi ; et al. | 2017-02-09 |
Package with solder regions aligned to recesses
Grant 9,559,044 - Yang , et al. January 31, 2 | 2017-01-31 |
Thermally enhanced structure for multi-chip device
Grant 9,530,715 - Yu , et al. December 27, 2 | 2016-12-27 |
Semiconductor Device And Manufacturing Method Thereof
App 20160372434 - SHAO; TUNG-LIANG ; et al. | 2016-12-22 |
Capacitor in post-passivation structures and methods of forming the same
Grant 9,490,203 - Tsai , et al. November 8, 2 | 2016-11-08 |
Semiconductor device and manufacturing method thereof
Grant 9,484,318 - Shao , et al. November 1, 2 | 2016-11-01 |
Seal ring structure with metal-insulator-metal capacitor
Grant 9,449,927 - Chen , et al. September 20, 2 | 2016-09-20 |
Capacitor in Post-Passivation Structures and Methods of Forming the Same
App 20160247757 - Tsai; Hao-Yi ; et al. | 2016-08-25 |
Hollow Metal Pillar Packaging Scheme
App 20160225751 - Huang; Chang-Pin ; et al. | 2016-08-04 |
Capacitor in post-passivation structures and methods of forming the same
Grant 9,355,954 - Tsai , et al. May 31, 2 | 2016-05-31 |
Hollow metal pillar packaging scheme
Grant 9,343,417 - Huang , et al. May 17, 2 | 2016-05-17 |
Self-alignment structure for wafer level chip scale package
Grant 9,318,456 - Lai , et al. April 19, 2 | 2016-04-19 |
Metal Insulator Metal Capacitor and Method for Making the Same
App 20160020269 - Yang; Ching-Jung ; et al. | 2016-01-21 |
Thermally Enhanced Structure for Multi-Chip Device
App 20150380337 - Yu; Chen-Hua ; et al. | 2015-12-31 |
Capacitor in Post-Passivation Structures and Methods of Forming the Same
App 20150380351 - Tsai; Hao-Yi ; et al. | 2015-12-31 |
Metal insulator metal capacitor and method for making the same
Grant 9,153,504 - Lai , et al. October 6, 2 | 2015-10-06 |
Capacitor in post-passivation structures and methods of forming the same
Grant 9,136,318 - Tsai , et al. September 15, 2 | 2015-09-15 |
Thermally enhanced structure for multi-chip device
Grant 9,136,143 - Yu , et al. September 15, 2 | 2015-09-15 |
Semiconductor Device And Manufacturing Method Thereof
App 20150235977 - SHAO; TUNG-LIANG ; et al. | 2015-08-20 |
Self-alignment Structure For Wafer Level Chip Scale Package
App 20150228599 - LAI; Yu-Chia ; et al. | 2015-08-13 |
Self-alignment structure for wafer level chip scale package
Grant 9,048,149 - Lai , et al. June 2, 2 | 2015-06-02 |
Semiconductor Device And Fabricating Method Thereof
App 20150137350 - HUANG; CHANG-PIN ; et al. | 2015-05-21 |
Metal Insulator Metal Capacitor and Method for Making the Same
App 20150102459 - Lai; Yu-Chia ; et al. | 2015-04-16 |
Hollow Metal Pillar Packaging Scheme
App 20150076689 - Huang; Chang-Pin ; et al. | 2015-03-19 |
Reducing delamination between an underfill and a buffer layer in a bond structure
Grant 8,963,328 - Yang , et al. February 24, 2 | 2015-02-24 |
Capacitor in Post-Passivation Structures and Methods of Forming the Same
App 20150017778 - Tsai; Hao-Yi ; et al. | 2015-01-15 |
Self-alignment Structure for Wafer Level Chip Scale Package
App 20150014846 - Lai; Yu-Chia ; et al. | 2015-01-15 |
Package with Solder Regions Aligned to Recesses
App 20140374899 - Yang; Ching-Jung ; et al. | 2014-12-25 |
Capacitor in Post-Passivation structures and methods of forming the same
Grant 8,884,400 - Tsai , et al. November 11, 2 | 2014-11-11 |
Capacitor in Post-Passivation Structures and Methods of Forming the Same
App 20140183693 - Tsai; Hao-Yi ; et al. | 2014-07-03 |
Multi-chip wafer level package
Grant 8,754,514 - Yu , et al. June 17, 2 | 2014-06-17 |
Seal Ring Structure with Metal-Insulator-Metal Capacitor
App 20140145307 - Chen; Hsien-Wei ; et al. | 2014-05-29 |
Methods for forming through vias
Grant 8,685,798 - Shao , et al. April 1, 2 | 2014-04-01 |
Reducing Delamination Between an Underfill and a Buffer Layer in a Bond Structure
App 20140087522 - Yang; Ching-Jung ; et al. | 2014-03-27 |
Measurement of electrical and mechanical characteristics of low-K dielectric in a semiconductor device
Grant 8,618,827 - Shao , et al. December 31, 2 | 2013-12-31 |
Measurement of electrical and mechanical characteristics of low-K dielectric in a semiconductor device
Grant 08618827 - | 2013-12-31 |
Reducing delamination between an underfill and a buffer layer in a bond structure
Grant 8,610,267 - Yang , et al. December 17, 2 | 2013-12-17 |
Thermally Enhanced Structure for Multi-Chip Device
App 20130277840 - Yu; Chen-Hua ; et al. | 2013-10-24 |
Methods for Forming Through Vias
App 20130273698 - Shao; Tung-Liang ; et al. | 2013-10-17 |
Thermally enhanced structure for multi-chip device
Grant 8,531,032 - Yu , et al. September 10, 2 | 2013-09-10 |
Apparatus and methods for forming through vias
Grant 8,476,770 - Shao , et al. July 2, 2 | 2013-07-02 |
Thermally Enhanced Structure for Multi-Chip Device
App 20130056871 - Yu; Chen-Hua ; et al. | 2013-03-07 |
Multi-Chip Wafer Level Package
App 20130037950 - Yu; Chun Hui ; et al. | 2013-02-14 |
Apparatus and Methods for Forming Through Vias
App 20130009319 - Shao; Tung-Liang ; et al. | 2013-01-10 |
Light emitting diode apparatus
Grant 8,227,822 - Hung , et al. July 24, 2 | 2012-07-24 |
Measurement Of Electrical And Mechanical Characteristics Of Low-k Dielectric In A Semiconductor Device
App 20120092033 - Shao; Tung-Liang ; et al. | 2012-04-19 |
Reducing Delamination Between an Underfill and a Buffer layer in a Bond Structure
App 20120018875 - Yang; Ching-Jung ; et al. | 2012-01-26 |
Backlight module having replaceable lamp module
Grant 7,911,556 - Yang , et al. March 22, 2 | 2011-03-22 |
Backlight module
Grant 7,821,595 - Ke , et al. October 26, 2 | 2010-10-26 |
Backlight Module
App 20100238371 - Ke; Therm-Hoo ; et al. | 2010-09-23 |
Backlight module
Grant 7,782,418 - Ke , et al. August 24, 2 | 2010-08-24 |
Light Emitting Diode Apparatus
App 20100163898 - HUNG; CHUN CHANG ; et al. | 2010-07-01 |
Backlight Module Having Replaceable Lamp Module
App 20100118517 - Yang; Chi-chun ; et al. | 2010-05-13 |
Replaceable lamp module for liquid crystal display
Grant 7,581,866 - Shao , et al. September 1, 2 | 2009-09-01 |
Backlight Module
App 20090009679 - Ke; Therm-Hoo ; et al. | 2009-01-08 |
Backlight Module Having Replacement Lamp Module
App 20080019151 - Yang; Chi-chun ; et al. | 2008-01-24 |
Replaceable Lamp Module For Liquid Crystal Display
App 20080013340 - Shao; Tung-liang ; et al. | 2008-01-17 |
Method for forming bumps
App 20020137325 - Shao, Tung-Liang | 2002-09-26 |
Wafer-level packaging
Grant 6,387,795 - Shao May 14, 2 | 2002-05-14 |
| 