| Patent | Date |
|---|
Process For Electroless Copper Deposition On A Ruthenium Seed
App 20120315756 - Weidman; Timothy W. ; et al. | 2012-12-13 |
Electroless deposition process on a silicon contact
Grant 8,308,858 - Stewart , et al. November 13, 2 | 2012-11-13 |
Copper wiring module control
Grant 8,005,634 - Shanmugasundram , et al. August 23, 2 | 2011-08-23 |
Adhesion and minimizing oxidation on electroless CO alloy films for integration with low K inter-metal dielectric and etch stop
Grant 7,910,476 - Fang , et al. March 22, 2 | 2011-03-22 |
Apparatus for electroless deposition of metals onto semiconductor substrates
Grant 7,827,930 - Lubomirsky , et al. November 9, 2 | 2010-11-09 |
Electroless Deposition Process On A Silicon Contact
App 20100107927 - Stewart; Michael P. ; et al. | 2010-05-06 |
Electroless deposition process on a silicon contact
Grant 7,659,203 - Stewart , et al. February 9, 2 | 2010-02-09 |
Apparatus for electroless deposition of metals onto semiconductor substrates
Grant 7,654,221 - Lubomirsky , et al. February 2, 2 | 2010-02-02 |
Process for electroless copper deposition
Grant 7,651,934 - Lubomirsky , et al. January 26, 2 | 2010-01-26 |
Raman spectroscopy as integrated chemical metrology
Grant 7,542,132 - Fang , et al. June 2, 2 | 2009-06-02 |
Apparatus and method of detecting the electroless deposition endpoint
Grant 7,534,298 - Shanmugasundram , et al. May 19, 2 | 2009-05-19 |
Contact metallization scheme using a barrier layer over a silicide layer
Grant 7,514,353 - Weidman , et al. April 7, 2 | 2009-04-07 |
Adhesion And Minimizing Oxidation On Electroless Co Alloy Films For Integration With Low K Inter-metal Dielectric And Etch Stop
App 20090029544 - Fang; Hongbin ; et al. | 2009-01-29 |
Slim cell platform plumbing
Grant 7,473,339 - D'Ambra , et al. January 6, 2 | 2009-01-06 |
Selective Electroless Deposition For Solar Cells
App 20080121276 - Lopatin; Sergey ; et al. | 2008-05-29 |
Apparatus for electroless deposition
Grant 7,341,633 - Lubomirsky , et al. March 11, 2 | 2008-03-11 |
Raman Spectroscopy As Integrated Chemical Metrology
App 20080024762 - FANG; HONGBIN ; et al. | 2008-01-31 |
Apparatus for electroless deposition of metals onto semiconductor substrates
Grant 7,323,058 - Lubomirsky , et al. January 29, 2 | 2008-01-29 |
Wafer cleaning solution for cobalt electroless application
Grant 7,273,813 - Emami , et al. September 25, 2 | 2007-09-25 |
Pretreatment for electroless deposition
Grant 7,256,111 - Lopatin , et al. August 14, 2 | 2007-08-14 |
Feedback controlled polishing processes
Grant 7,247,080 - Bennett , et al. July 24, 2 | 2007-07-24 |
Copper Wiring Module Control
App 20070122921 - Shanmugasundram; Arulkumar ; et al. | 2007-05-31 |
Multi-chemistry plating system
Grant 7,223,323 - Yang , et al. May 29, 2 | 2007-05-29 |
Integrated Electroless Deposition System
App 20070111519 - Lubomirsky; Dmitry ; et al. | 2007-05-17 |
Adhesion and minimizing oxidation on electroless CO alloy films for integration with low K inter-metal dielectric and etch stop
App 20070099417 - Fang; Hongbin ; et al. | 2007-05-03 |
Apparatus and method for atomic layer cleaning and polishing
App 20070095367 - Wang; Yaxin ; et al. | 2007-05-03 |
Process for electroless copper deposition
App 20070099422 - Wijekoon; Kapila ; et al. | 2007-05-03 |
Method for forming CoWRe alloys by electroless deposition
Grant 7,205,233 - Lopatin , et al. April 17, 2 | 2007-04-17 |
Method And Apparatus For Forming Device Features In An Integrated Electroless Deposition System
App 20070071888 - Shanmugasundram; Arulkumar ; et al. | 2007-03-29 |
Process for electroless copper deposition
App 20070004201 - Lubomirsky; Dmitry ; et al. | 2007-01-04 |
Electroless deposition process on a silicon contact
App 20060264043 - Stewart; Michael P. ; et al. | 2006-11-23 |
In-situ silicidation metallization process
App 20060251801 - Weidman; Timothy W. ; et al. | 2006-11-09 |
Contact metallization scheme using a barrier layer over a silicide layer
App 20060251800 - Weidman; Timothy W. ; et al. | 2006-11-09 |
Electroless deposition processes and compositions for forming interconnects
App 20060252252 - Zhu; Zhize ; et al. | 2006-11-09 |
Electroless deposition process on a silicide contact
App 20060246217 - Weidman; Timothy W. ; et al. | 2006-11-02 |
Integrated equipment set for forming a low K dielectric interconnect on a substrate
App 20060246683 - Pan; Judon Tony ; et al. | 2006-11-02 |
Process for electroless copper deposition on a ruthenium seed
App 20060246699 - Weidman; Timothy W. ; et al. | 2006-11-02 |
Wafer cleaning solution for cobalt electroless application
App 20060174912 - Emami; Ramin ; et al. | 2006-08-10 |
Feedback controlled polishing processes
Grant 7,024,268 - Bennett , et al. April 4, 2 | 2006-04-04 |
Patterned wafer thickness detection system
App 20060062897 - Gu; Yuping ; et al. | 2006-03-23 |
Integrated electroless deposition system
App 20060033678 - Lubomirsky; Dmitry ; et al. | 2006-02-16 |
Method and apparatus for electroless capping with vapor drying
App 20060003570 - Shanmugasundram; Arulkumar ; et al. | 2006-01-05 |
Apparatus for electroless deposition of metals onto semiconductor substrates
App 20050263066 - Lubomirsky, Dmitry ; et al. | 2005-12-01 |
Apparatus for electroless deposition of metals onto semiconductor substrates
App 20050260345 - Lubomirsky, Dmitry ; et al. | 2005-11-24 |
Method and apparatus for selectively changing thin film composition during electroless deposition in a single chamber
App 20050181226 - Weidman, Timothy W. ; et al. | 2005-08-18 |
Electroless palladium nitrate activation prior to cobalt-alloy deposition
App 20050170650 - Fang, Hongbin ; et al. | 2005-08-04 |
Pretreatment for electroless deposition
App 20050164497 - Lopatin, Sergey ; et al. | 2005-07-28 |
Apparatus for electroless deposition of metals onto semiconductor substrates
App 20050160990 - Lubomirsky, Dmitry ; et al. | 2005-07-28 |
Electroless cobalt alloy deposition process
App 20050161338 - Fang, Hongbin ; et al. | 2005-07-28 |
Method and tool of chemical doping CoW alloys with Re for increasing barrier properties of electroless capping layers for IC Cu interconnects
App 20050101130 - Lopatin, Sergey ; et al. | 2005-05-12 |
Method of polishing and cleaning substrates
Grant 6,887,124 - Pinson, II , et al. May 3, 2 | 2005-05-03 |
Apparatus and method of detecting the electroless deposition endpoint
App 20050088647 - Shanmugasundram, Arulkumar ; et al. | 2005-04-28 |
Apparatus for electroless deposition
App 20050081785 - Lubomirsky, Dmitry ; et al. | 2005-04-21 |
Heterogeneous activation layers formed by ionic and electroless reactions used for IC interconnect capping layers
App 20050085031 - Lopatin, Sergey D. ; et al. | 2005-04-21 |
Slim cell platform plumbing
App 20040206623 - D'Ambra, Allen L. ; et al. | 2004-10-21 |
Multi-chemistry plating system
App 20040016637 - Yang, Michael X. ; et al. | 2004-01-29 |
Integrated equipment set for forming a low K dielectric interconnect on a substrate
App 20040007325 - Pan, Judon Tony ; et al. | 2004-01-15 |
Copper wiring module control
App 20030199112 - Shanmugasundram, Arulkumar ; et al. | 2003-10-23 |
Run-to-run control over semiconductor processing tool based upon mirror image target
Grant 6,625,513 - Lymberopoulos , et al. September 23, 2 | 2003-09-23 |
Method of polishing and cleaning substrates
App 20020164929 - Pinson, Jay D. II ; et al. | 2002-11-07 |
Buffer station on CMP system
Grant 6,244,931 - Pinson , et al. June 12, 2 | 2001-06-12 |
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