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Patent applications and USPTO patent grants for SHANGHAI KAIHONG TECHNOLOGY CO., LTD.The latest application filed is for "thin quad flat package with no leads (qfn) fabrication methods".
Patent | Date |
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Thin Quad Flat Package With No Leads (qfn) Fabrication Methods App 20110281398 - Tan; Xiaochun ;   et al. | 2011-11-17 |
Thin quad flat package with no leads (QFN) fabrication methods Grant 8,008,128 - Tan , et al. August 30, 2 | 2011-08-30 |
Semiconductor power device Grant 7,834,433 - Xiaochun , et al. November 16, 2 | 2010-11-16 |
Thin Quad Flat Package with No Leads (QFN) Fabrication Methods App 20100178733 - Tan; Xiaochun ;   et al. | 2010-07-15 |
Chip scale package fabrication methods Grant 7,745,261 - Tan , et al. June 29, 2 | 2010-06-29 |
Thin quad flat package with no leads (QFN) fabrication methods Grant 7,713,784 - Tan , et al. May 11, 2 | 2010-05-11 |
Chip scale package (CSP) assembly apparatus and method Grant 7,682,874 - Xiaochun , et al. March 23, 2 | 2010-03-23 |
Thin Quad Flat Package With No Leads (qfn) Fabrication Methods App 20090233401 - Tan; Xiaochun ;   et al. | 2009-09-17 |
Chip Scale Package Fabrication Methods App 20090215227 - Tan; Xiaochun ;   et al. | 2009-08-27 |
Wire bonded chip scale package fabrication methods Grant 7,517,726 - Tan , et al. April 14, 2 | 2009-04-14 |
Quad flat no-lead (QFN) chip package assembly apparatus and method Grant 7,402,459 - Xiaochun , et al. July 22, 2 | 2008-07-22 |
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