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Embedded Copper Structure For Microelectronics Package
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Methods of creating exposed cavities in molded electronic devices
Grant 11,304,302 - Shangguan , et al. April 12, 2 | 2022-04-12 |
Methods, devices, and systems for electronic device molding and encapsulation
Grant 11,289,393 - Liu , et al. March 29, 2 | 2022-03-29 |
Embedded copper structure for microelectronics package
Grant 11,270,974 - Yang , et al. March 8, 2 | 2022-03-08 |
Devices, Systems, And Methods For Stacked Die Packages
App 20220045034 - Yang; Cheng ; et al. | 2022-02-10 |
Electronics Bending Fixture Design
App 20220018746 - Liu; Weifeng ; et al. | 2022-01-20 |
Electronic Encapsulation Through Stencil Printing
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Control of Thermal Interface Material in Multi-Chip Package
App 20210305124 - YANG; Cheng ; et al. | 2021-09-30 |
Electronics encapsulation through hotmelt lamination
Grant 11,064,613 - Liu , et al. July 13, 2 | 2021-07-13 |
Methods, Devices, And Systems For Electronic Device Molding And Encapsulation
App 20210193543 - Liu; Weifeng ; et al. | 2021-06-24 |
Stress Relief Encapsulation For Flexible Hybrid Electronics
App 20210176857 - Liu; Weifeng ; et al. | 2021-06-10 |
Stress relief encapsulation for flexible hybrid electronics
Grant 10,999,926 - Liu , et al. May 4, 2 | 2021-05-04 |
Embedded Copper Structure For Microelectronics Package
App 20210125958 - Yang; Cheng ; et al. | 2021-04-29 |
Methods Of Creating Exposed Cavities In Molded Electronic Devices
App 20210100106 - Shangguan; Dongkai ; et al. | 2021-04-01 |
Solder Electronic Components To Printed Conductive Ink
App 20210076496 - Liu; Weifeng ; et al. | 2021-03-11 |
System in package with double side mounted board
Grant 10,896,877 - Yang , et al. January 19, 2 | 2021-01-19 |
Stress Relief Encapsulation For Flexible Hybrid Electronics
App 20200404780 - Liu; Weifeng ; et al. | 2020-12-24 |
Electronics Encapsulation Through Hotmelt Lamination
App 20200344891 - Liu; Weifeng ; et al. | 2020-10-29 |
Connection of multilayer printed conductive ink through filled microvias
Grant 10,653,010 - Liu , et al. | 2020-05-12 |
Method of manufacturing fan out wafer level package
Grant 9,773,684 - Wang , et al. September 26, 2 | 2017-09-26 |
Wafer level camera module with molded housing and method of manufacturing
Grant 9,419,032 - Singh , et al. August 16, 2 | 2016-08-16 |
Method Of Manufacturing Fan Out Wafer Level Package
App 20160218020 - WANG; Hongjie ; et al. | 2016-07-28 |
Method For Mounting Protective Covers Over Image Capture Devices And Devices Manufactured Thereby
App 20140047711 - Tam; Samuel Waising ; et al. | 2014-02-20 |
Integrated lens and chip assembly for a digital camera
Grant 8,477,239 - Kale , et al. July 2, 2 | 2013-07-02 |
Camera module with premolded lens housing and method of manufacture
Grant 8,092,102 - Shangguan , et al. January 10, 2 | 2012-01-10 |
Camera Module with Premolded Lens Housing and Method of Manufacture
App 20110299848 - Shangguan; Dongkai ; et al. | 2011-12-08 |
Integrated lens and chip assembly for a digital camera
App 20110115974 - Kale; Vidyadhar Sitaram ; et al. | 2011-05-19 |
Wafer level camera module with molded housing and method of manufacturing
App 20110037886 - Singh; Harpuneet ; et al. | 2011-02-17 |
Integrated lens and chip assembly for a digital camera
Grant 7,872,686 - Kale , et al. January 18, 2 | 2011-01-18 |
Wafer based camera module and method of manufacture
Grant 7,796,187 - Shangguan , et al. September 14, 2 | 2010-09-14 |
External adjustment mechanism for a camera lens and electronic imager
Grant 7,684,689 - Shangguan , et al. March 23, 2 | 2010-03-23 |
Folded package camera module and method of manufacture
App 20080170141 - Tam; Samuel Waising ; et al. | 2008-07-17 |
Camera module with premolded lens housing and method of manufacture
App 20070278394 - Shangguan; Dongkai ; et al. | 2007-12-06 |
Method for mounting protective covers over image capture devices and devices manufactured thereby
App 20070236591 - Tam; Samuel Waising ; et al. | 2007-10-11 |
External adjustment mechanism for a camera lens and electronic imager
App 20070058964 - Shangguan; Dongkai ; et al. | 2007-03-15 |
Wafer based camera module and method of manufacture
App 20060132644 - Shangguan; Dongkai ; et al. | 2006-06-22 |
Integrated lens and chip assembly for a digital camera
App 20050185088 - Kale, Vidyadhar Sitaram ; et al. | 2005-08-25 |
Lead-free electrical solder and method of manufacturing
Grant 6,360,939 - Paruchuri , et al. March 26, 2 | 2002-03-26 |
Method of forming interconnections on electronic modules
Grant 6,250,541 - Shangguan , et al. June 26, 2 | 2001-06-26 |
Method of forming interconnections on electronic modules
Grant 6,082,610 - Shangguan , et al. July 4, 2 | 2000-07-04 |
Metallic adhesive for forming electronic interconnects at low temperatures
Grant 6,027,575 - Paruchuri , et al. February 22, 2 | 2000-02-22 |
Flip chip interconnections on electronic modules
Grant 6,011,313 - Shangguan , et al. January 4, 2 | 2000-01-04 |
Soldering process with minimal thermal impact on substrate
Grant 5,996,222 - Shangguan , et al. December 7, 1 | 1999-12-07 |
Low-temperature solder compositions
Grant 5,871,690 - Achari , et al. February 16, 1 | 1999-02-16 |
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