Shanaman, Richard Handly III
Patent Applications and Registrations
Patent applications and USPTO patent grants for Shanaman, Richard Handly III.The latest application filed is for "heat sink formed of multiple metal layers on backside of integrated circuit die".
- Shanaman, Richard Handly III - Richland PA
| Patent | Date |
|---|---|
| Heat sink formed of multiple metal layers on backside of integrated circuit die App 20050287952 - Ryan, Vivian ; et al. | 2005-12-29 |
| Semiconductor packaging techniques for use with non-ceramic packages App 20050191793 - Brennan, John McKenna ; et al. | 2005-09-01 |
| Semiconductor device with improved thermal characteristics App 20050184385 - Brennan, John McKenna ; et al. | 2005-08-25 |
| Semiconductor deivce configured for reducing post-fabrication damage App 20050173024 - Brennan, John M. ; et al. | 2005-08-11 |
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