loadpatents
name:-0.022097110748291
name:-0.067231893539429
name:-0.00061798095703125
Shan; Hongching Patent Filings

Shan; Hongching

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shan; Hongching.The latest application filed is for "slotted electrostatic shield modification for improved etch and cvd process uniformity".

Company Profile
0.33.8
  • Shan; Hongching - Cupertino CA US
  • Shan; Hongching - San Jose CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Slotted electrostatic shield modification for improved etch and CVD process uniformity
Grant 8,413,604 - George , et al. April 9, 2
2013-04-09
Slotted electrostatic shield modification for improved etch and CVD process uniformity
Grant 7,232,767 - George , et al. June 19, 2
2007-06-19
Slotted Electrostatic Shield Modification for Improved Etch and CVD Process Uniformity
App 20070113979 - George; Rene ;   et al.
2007-05-24
Ashable layers for reducing critical dimensions of integrated circuit features
Grant 7,105,442 - Shan , et al. September 12, 2
2006-09-12
Slotted electrostatic shield modification for improved etch and CVD process uniformity
App 20040244691 - George, Rene ;   et al.
2004-12-09
Distributed inductively-coupled plasma source and circuit for coupling induction coils to RF power supply
Grant 6,825,618 - Pu , et al. November 30, 2
2004-11-30
Dielectric etch chamber with expanded process window
Grant 6,797,639 - Carducci , et al. September 28, 2
2004-09-28
Dielectric etch chamber with expanded process window
Grant 6,716,302 - Carducci , et al. April 6, 2
2004-04-06
Shield or ring surrounding semiconductor workpiece in plasma chamber
Grant 6,689,249 - Ke , et al. February 10, 2
2004-02-10
Gas flow division in a wafer processing system having multiple chambers
App 20030230239 - Shan, Hongching
2003-12-18
Distributed inductively-coupled plasma source and circuit for coupling induction coils to RF power supply
App 20030192644 - Pu, Bryan Y. ;   et al.
2003-10-16
Highly selective oxide etch process using hexafluorobutadiene
Grant 6,613,691 - Hung , et al. September 2, 2
2003-09-02
Distributed inductively-coupled plasma source and circuit for coupling induction coils to RF power supply
Grant 6,568,346 - Pu , et al. May 27, 2
2003-05-27
Dielectric etch chamber with expanded process window
App 20030037880 - Carducci, James D. ;   et al.
2003-02-27
Plasma reactor cooled ceiling with an array of thermally isolated plasma heated mini-gas distribution plates
Grant 6,432,259 - Noorbakhsh , et al. August 13, 2
2002-08-13
Etch method using a dielectric etch chamber with expanded process window
Grant 6,403,491 - Liu , et al. June 11, 2
2002-06-11
Shield or ring surrounding semiconductor workpiece in plasma chamber
App 20020066531 - Ke, Kuang-Han ;   et al.
2002-06-06
High selectivity etch using an external plasma discharge
Grant 6,387,288 - Bjorkman , et al. May 14, 2
2002-05-14
Distributed inductively-coupled plasma source and circuit for coupling induction coils to RF power supply
App 20010054383 - Pu, Bryan Y. ;   et al.
2001-12-27
Shield or ring surrounding semiconductor workpiece in plasma chamber
Grant 6,284,093 - Ke , et al. September 4, 2
2001-09-04
Adjusting DC bias voltage in plasma chamber
App 20010014540 - Shan, Hongching ;   et al.
2001-08-16
Distributed inductively-coupled plasma source
Grant 6,273,022 - Pu , et al. August 14, 2
2001-08-14
Adjusting DC bias voltage in plasma chamber
Grant 6,221,782 - Shan , et al. April 24, 2
2001-04-24
Plasma reactor having a helicon wave high density plasma source
Grant 6,189,484 - Yin , et al. February 20, 2
2001-02-20
Magnetically-enhanced plasma chamber with non-uniform magnetic field
Grant 6,113,731 - Shan , et al. September 5, 2
2000-09-05
Thin film processing plasma reactor chamber with radially upward sloping ceiling for promoting radially outward diffusion
Grant 6,076,482 - Ding , et al. June 20, 2
2000-06-20
High selectivity etch using an external plasma discharge
Grant 6,074,514 - Bjorkman , et al. June 13, 2
2000-06-13
Shallow magnetic fields for generating circulating electrons to enhance plasma processing
Grant 6,022,446 - Shan , et al. February 8, 2
2000-02-08
Diagnostic pedestal assembly for a semiconductor wafer processing system
Grant 5,989,349 - Ke , et al. November 23, 1
1999-11-23
Distributed microwave plasma reactor for semiconductor processing
Grant 5,948,168 - Shan , et al. September 7, 1
1999-09-07
Broad-band adjustable power ratio phase-inverting plasma reactor
Grant 5,865,937 - Shan , et al. February 2, 1
1999-02-02
Method for etching dielectric layers with high selectivity and low microloading
Grant 5,843,847 - Pu , et al. December 1, 1
1998-12-01
Method for etching dielectric using fluorohydrocarbon gas, NH.sub.3 -generating gas, and carbon-oxygen gas
Grant 5,814,563 - Ding , et al. September 29, 1
1998-09-29
Apparatus for improving wafer and chuck edge protection
Grant 5,740,009 - Pu , et al. April 14, 1
1998-04-14
Distributed microwave plasma reactor for semiconductor processing
Grant 5,702,530 - Shan , et al. December 30, 1
1997-12-30
Plasma reactor with programmable reactant gas distribution
Grant 5,683,517 - Shan November 4, 1
1997-11-04
Method and apparatus for producing plasma uniformity in a magnetic field-enhanced plasma reactor
Grant 5,674,321 - Pu , et al. October 7, 1
1997-10-07
Adjustable dc bias control in a plasma reactor
Grant 5,605,637 - Shan , et al. February 25, 1
1997-02-25
Self-cleaning polymer-free top electrode for parallel electrode etch operation
Grant 5,585,012 - Wu , et al. December 17, 1
1996-12-17
Process for plasma etching of vias
Grant 5,514,247 - Shan , et al. May 7, 1
1996-05-07

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