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name:-0.022718906402588
name:-0.016754865646362
name:-0.0014150142669678
Shalyt; Eugene Patent Filings

Shalyt; Eugene

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shalyt; Eugene.The latest application filed is for "selective monitoring of multiple silicon compounds".

Company Profile
1.17.20
  • Shalyt; Eugene - Washington Township NJ
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Analysis of silver ion and complexing agent in tin-silver electrodeposition solution
Grant 10,920,336 - Parekh , et al. February 16, 2
2021-02-16
Selective Monitoring Of Multiple Silicon Compounds
App 20200110053 - Shalyt; Eugene ;   et al.
2020-04-09
Control of additive turnover in an electrodeposition solution
Grant 10,590,560 - Shalyt
2020-03-17
Control Of Additive Turnover In An Electrodeposition Solution
App 20200063285 - Shalyt; Eugene
2020-02-27
Analysis Of Silver Ion And Complexing Agent In Tin-silver Electrodeposition Solution
App 20190345626 - Parekh; Vishal ;   et al.
2019-11-14
Analysis of silver ion and complexing agent in tin-silver electrodeposition solution
Grant 10,407,795 - Parekh , et al. Sept
2019-09-10
Measurement Of Total Accelerator In An Electrodeposition Solution
App 20180202060 - Pavlov; Michael ;   et al.
2018-07-19
Analysis Of Silver Ion And Complexing Agent In Tin-silver Electrodeposition Solution
App 20180135199 - Parekh; Vishal ;   et al.
2018-05-17
Palladium coating thickness measurement
Grant 9,593,931 - Tench , et al. March 14, 2
2017-03-14
Etchant product analysis in alkaline etchant solutions
Grant 9,274,079 - Shalyt , et al. March 1, 2
2016-03-01
Analysis Of Silicon Concentration In Phosphoric Acid Etchant Solutions
App 20160018358 - Shalyt; Eugene ;   et al.
2016-01-21
Etchant Product Analysis In Alkaline Etchant Solutions
App 20140206090 - Shalyt; Eugene ;   et al.
2014-07-24
Palladium Coating Thickness Measurement
App 20140061064 - Tench; D. Morgan ;   et al.
2014-03-06
Analysis of an auxiliary leveler additive in an acid copper plating bath
Grant 8,535,504 - Pavlov , et al. September 17, 2
2013-09-17
Chloride analysis in acid copper plating baths
Grant 8,142,640 - Pavlov , et al. March 27, 2
2012-03-27
Analysis of copper ion and complexing agent in copper plating baths
Grant 8,118,988 - Shalyt , et al. February 21, 2
2012-02-21
Boric acid replenishment in electroplating baths
App 20110272289 - Shalyt; Eugene ;   et al.
2011-11-10
Analysis of an auxiliary leveler additive in an acid copper plating bath
App 20110266154 - Pavlov; Michael ;   et al.
2011-11-03
Analysis of silicon concentration in phosphoric acid etchant solutions
Grant 8,008,087 - Shalyt , et al. August 30, 2
2011-08-30
Method and apparatus for determining the stability of an electroless plating bath
Grant 7,932,094 - Shalyt , et al. April 26, 2
2011-04-26
Detection of additive breakdown products in acid copper plating baths
Grant 7,879,222 - Shalyt , et al. February 1, 2
2011-02-01
Method and apparatus for determining the stability of an electroless plating bath
App 20100035356 - Shalyt; Eugene ;   et al.
2010-02-11
Fiber optic multiplexer
App 20090232448 - Barmash; Sunya ;   et al.
2009-09-17
Analysis of fluoride at low concentrations in acidic processing solutions
App 20090229995 - Shalyt; Eugene ;   et al.
2009-09-17
Analysis of copper ion and complexing agent in copper plating baths
App 20090194430 - Shalyt; Eugene ;   et al.
2009-08-06
Chloride analysis in acid copper plating baths
App 20090065362 - Pavlov; Michael ;   et al.
2009-03-12
Detection of additive breakdown products in acid copper plating baths
App 20090057151 - Shalyt; Eugene ;   et al.
2009-03-05
Detection of an unstable additive breakdown product in a plating bath
Grant 7,291,253 - Pavlov , et al. November 6, 2
2007-11-06
Efficient analysis of organic additives in an acid copper plating bath
Grant 7,186,326 - Shalyt , et al. March 6, 2
2007-03-06
Efficient analysis of organic additives in an acid copper plating bath
App 20050263399 - Shalyt, Eugene ;   et al.
2005-12-01
Detection of an unstable additive breakdown product in a plating bath
App 20050247577 - Pavlov, Michael ;   et al.
2005-11-10
Measurement of complexing agent concentration in an electroless plating bath
Grant 6,890,758 - Shalyt , et al. May 10, 2
2005-05-10
Measurement of complexing agent concentration in an electroless plating bath
App 20040253740 - Shalyt, Eugene ;   et al.
2004-12-16
Voltammetric measurement of halide ion concentration
Grant 6,673,226 - Kogan , et al. January 6, 2
2004-01-06

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