Shahbazi; Samson
Patent Applications and Registrations
Patent applications and USPTO patent grants for Shahbazi; Samson.The latest application filed is for "dielectric tape compositions".
- Shahbazi; Samson - Roslyn PA
- Shahbazi; Samson - Rosslyn PA
- Shahbazi; Samson - Yonkers NY
| Patent | Date |
|---|---|
| Silver sintering preparation and the use thereof for the connecting of electronic components Grant 10,910,340 - Chew , et al. February 2, 2 | 2021-02-02 |
| Dielectric glass composition Grant 10,074,456 - Sgriccia , et al. September 11, 2 | 2018-09-11 |
| Dielectric tape compositions Grant 10,039,180 - Shahbazi , et al. July 31, 2 | 2018-07-31 |
| Solderable conductive polymer thick film composition Grant 9,986,650 - Shahbazi , et al. May 29, 2 | 2018-05-29 |
| Platinum containing conductive paste Grant 9,892,816 - Shahbazi , et al. February 13, 2 | 2018-02-13 |
| Dielectric Tape Compositions App 20170303387 - SHAHBAZI; Samson ; et al. | 2017-10-19 |
| Dielectric Glass Composition App 20150348672 - SGRICCIA; Matthew ; et al. | 2015-12-03 |
| Low firing temperature copper composition Grant 9,183,967 - Shahbazi , et al. November 10, 2 | 2015-11-10 |
| Solderable Conductive Polymer Thick Film Composition App 20150257279 - Shahbazi; Samson ; et al. | 2015-09-10 |
| Soldering Method For Polymer Thick Film Compositions App 20150231740 - Grabey; Steven ; et al. | 2015-08-20 |
| Platinum Containing Conductive Paste App 20150004359 - Shahbazi; Samson ; et al. | 2015-01-01 |
| Organic Vehicle For Dispersion Of Glass Composition And Method Of Dispersion App 20140224417 - Shahbazi; Samson ; et al. | 2014-08-14 |
| Low Firing Temperature Copper Composition App 20140178573 - SHAHBAZI; Samson ; et al. | 2014-06-26 |
| Low resistance resistor compositions Grant 4,600,602 - Martin , et al. July 15, 1 | 1986-07-15 |
| Solderable conductive compositions that are capable of being soldered by non silver-bearing solder and that can be bonded directly to substrates and which are flexible Grant 4,595,605 - Martin , et al. June 17, 1 | 1986-06-17 |
| Conductive compositions that are directly solderable and flexible and that can be bonded directly to substrates Grant 4,595,604 - Martin , et al. June 17, 1 | 1986-06-17 |
| Solderable conductive compositions having high adhesive strength Grant 4,595,606 - St. John , et al. June 17, 1 | 1986-06-17 |
| Solderable conductor Grant 4,564,563 - Martin , et al. January 14, 1 | 1986-01-14 |
| Fast curing solderable conductor Grant 4,535,012 - Martin , et al. August 13, 1 | 1985-08-13 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 