loadpatents
Patent applications and USPTO patent grants for SHAH; Shirish.The latest application filed is for "system and method for determining placement of photovoltaic strips using displacement sensors".
Patent | Date |
---|---|
System And Method For Determining Placement Of Photovoltaic Strips Using Displacement Sensors App 20130206208 - SHAH; Shirish ;   et al. | 2013-08-15 |
Refractoy composition for glass melting furnaces Grant 8,505,335 - Connors, Sr. , et al. August 13, 2 | 2013-08-13 |
AZS refractory composition Grant 8,505,336 - Connors, Sr. , et al. August 13, 2 | 2013-08-13 |
System and method for determining placement of photovoltaic strips using displacement sensors Grant 8,361,259 - Shah , et al. January 29, 2 | 2013-01-29 |
System And Method For Determining Placement Of Photovoltaic Strips Using Displacement Sensors App 20120067397 - Shah; Shirish ;   et al. | 2012-03-22 |
System and method for increasing yield from semiconductor wafer electroplating Grant 7,641,776 - Nagar , et al. January 5, 2 | 2010-01-05 |
Solder Replacement By Conductive Tape Material App 20090266403 - Shah; Shirish ;   et al. | 2009-10-29 |
Refractory casting method Grant 7,562,694 - Connors, Jr. , et al. July 21, 2 | 2009-07-21 |
Method And Material For Coupling Solar Concentrators And Photovoltaic Devices App 20090151770 - GIBSON; KEVIN R. ;   et al. | 2009-06-18 |
Molding composition and method of use Grant 7,500,511 - Connors , et al. March 10, 2 | 2009-03-10 |
Refractory composition for glass melting furnaces App 20080314084 - Connors, SR.; Charles W. ;   et al. | 2008-12-25 |
AZS refractory composition App 20080314085 - Connors, SR.; Charles W. ;   et al. | 2008-12-25 |
System and method for increasing yield from semiconductor wafer electroplating App 20060201802 - Nagar; Mohan ;   et al. | 2006-09-14 |
Method of protecting fuses in an integrated circuit die App 20060128072 - Rajagopalan; Sarathy ;   et al. | 2006-06-15 |
Flip chip underfilling App 20060099736 - Nagar; Mohan R. ;   et al. | 2006-05-11 |
Refractory casting method App 20060070715 - Connors; Charles W. JR. ;   et al. | 2006-04-06 |
Molding composition and method of use App 20050061471 - Connors, George ;   et al. | 2005-03-24 |
Novel solution for low cost, speedy probe cards App 20040239350 - Nagar, Mohan R. ;   et al. | 2004-12-02 |
Method of balanced coefficient of thermal expansion for flip chip ball grid array Grant 6,806,119 - Nagarajan , et al. October 19, 2 | 2004-10-19 |
Method of balanced coefficient of thermal expansion for flip chip ball grid array App 20040121519 - Nagarajan, Kumar ;   et al. | 2004-06-24 |
Underfill gap enhancement App 20040070073 - Shah, Shirish ;   et al. | 2004-04-15 |
Balanced coefficient of thermal expansion for flip chip ball grid array Grant 6,639,321 - Nagarajan , et al. October 28, 2 | 2003-10-28 |
Method and apparatus for cleaning and removing flux from an electronic component package Grant 6,395,097 - Maheshwari , et al. May 28, 2 | 2002-05-28 |
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