Shah; Milind P.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shah; Milind P..The latest application filed is for "anchoring a trace on a substrate to reduce peeling of the trace".

Company Profile

0.12.12

Shah; Milind P. - San Diego CA
Shah; Milind P - San Diego CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Surface finish on trace for a thermal compression flip chip (TCFC) Grant 9,269,681 - Jomaa , et al. February 23, 2	2016-02-23
Radio frequency package on package circuit Grant 9,131,634 - Hadjichristos , et al. September 8, 2	2015-09-08
Microelectromechanical systems embedded in a substrate Grant 8,847,375 - Shah , et al. September 30, 2	2014-09-30
Barrier layer on bump and non-wettable coating on trace Grant 8,802,556 - Bchir , et al. August 12, 2	2014-08-12
Anchoring A Trace On A Substrate To Reduce Peeling Of The Trace App 20140175658 - Kim; Chin-Kwan ; et al.	2014-06-26
Package Having Thermal Compression Flip Chip (tcfc) And Chip With Reflow Bonding On Lead App 20140159238 - Aldrete; Manuel ; et al.	2014-06-12
Process for improving package warpage and connection reliability through use of a backside mold configuration (BSMC) Grant 8,742,603 - Bchir , et al. June 3, 2	2014-06-03
Surface Finish On Trace For A Thermal Compression Flip Chip (tcfc) App 20140138831 - Jomaa; Houssam W. ; et al.	2014-05-22
Barrier Layer On Bump And Non-wettable Coating On Trace App 20140131857 - Bchir; Omar J. ; et al.	2014-05-15
Selective seed layer treatment for feature plating Grant 8,703,602 - Bchir , et al. April 22, 2	2014-04-22
Thermal vias in an integrated circuit package with an embedded die Grant 8,633,597 - Sweeney , et al. January 21, 2	2014-01-21
Radio Frequency Package On Package Circuit App 20130122833 - Hadjichristos; Aristotele ; et al.	2013-05-16
Selective Seed Layer Treatment for Feature Plating App 20120139112 - Bchir; Omar J. ; et al.	2012-06-07
Method and Apparatus for Improving Substrate Warpage App 20120090883 - Bchir; Omar J. ; et al.	2012-04-19
Electronic Package and Method of Making an Electronic Package App 20120080787 - Shah; Milind P. ; et al.	2012-04-05
Three dimensional inductor and transformer design methodology of glass technology Grant 8,093,982 - Kim , et al. January 10, 2	2012-01-10
Process For Improving Package Warpage and Connection Reliability Through Use Of A Backside Mold Configuration (BSMC) App 20110285026 - Bchir; Omar J. ; et al.	2011-11-24
Three Dimensional Inductor and Transformer Design Methodology of Glass Technology App 20110234357 - Kim; Jonghae ; et al.	2011-09-29
Thermal Vias In An Integrated Circuit Package With An Embedded Die App 20110210438 - Sweeney; Fifin ; et al.	2011-09-01
Microelectromechanical Systems Embedded in a Substrate App 20110180926 - Shah; Milind P. ; et al.	2011-07-28

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