SHAH; Jitesh

Patent Applications and Registrations

Patent applications and USPTO patent grants for SHAH; Jitesh.The latest application filed is for "gas sensor".

Company Profile

0.10.12

SHAH; Jitesh - San Jose CA
Shah; Jitesh - Mountain View CA
Shah; Jitesh - Fremont CA
Shah; Jitesh - Freemont CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Gas Sensor App 20180196022 - KULKARNI; Srikanth ; et al.	2018-07-12
Methods and apparatus to enable runtime checksum verification of block device images Grant 9,984,255 - Shah , et al. May 29, 2	2018-05-29
Packaged integrated circuits having high-Q inductors therein and methods of forming same Grant 9,397,151 - Astrof , et al. July 19, 2	2016-07-19
Flip chip bump array with superior signal performance Grant 9,332,629 - Shah May 3, 2	2016-05-03
Methods And Apparatus To Enable Runtime Checksum Verification Of Block Device Images App 20160092701 - Shah; Jitesh ; et al.	2016-03-31
Test Assembly For Verifying Heat Spreader Grounding In A Production Test App 20130229201 - Shah; Jitesh ; et al.	2013-09-05
Utilizing A Jumper Chip In Packages With Long Bonding Wires App 20120286409 - Shah; Jitesh ; et al.	2012-11-15
Lead frame package Grant 8,294,249 - Pilling , et al. October 23, 2	2012-10-23
Flip Chip Bump Array With Superior Signal Performance App 20120104596 - Shah; Jitesh	2012-05-03
Package with improved connection of a decoupling capacitor Grant 8,120,162 - Shah February 21, 2	2012-02-21
Multi-package slot array Grant 7,968,989 - Kokozaki , et al. June 28, 2	2011-06-28
Lead Frame Package App 20100032818 - Pilling; David J. ; et al.	2010-02-11
Package substrate with inserted discrete capacitors Grant 7,656,007 - Shah February 2, 2	2010-02-02
Multi-Package Ball Grid Array App 20090321905 - Kokozaki; Camille ; et al.	2009-12-31
Package with improved connection of a decoupling capacitor App 20090085158 - Shah; Jitesh	2009-04-02
Package with passive component support assembly App 20090086453 - Shah; Jitesh	2009-04-02
Package substrate with inserted discrete capacitors App 20080099901 - Shah; Jitesh	2008-05-01
Package assembly pinout with superior crosstalk and timing performance App 20080079135 - Shah; Jitesh	2008-04-03
Method and apparatus with power and ground strips for connecting to decoupling capacitors Grant 7,329,958 - Shah February 12, 2	2008-02-12
Stacked paddle micro leadframe package Grant 7,166,905 - Shah January 23, 2	2007-01-23

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