| Patent | Date |
|---|
Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips
Grant 9,601,475 - Brunnbauer , et al. March 21, 2 | 2017-03-21 |
Workpiece With Semiconductor Chips, Semiconductor Device And Method For Producing A Workpiece With Semiconductor Chips
App 20160163682 - Brunnbauer; Markus ; et al. | 2016-06-09 |
Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips
Grant 9,293,423 - Brunnbauer , et al. March 22, 2 | 2016-03-22 |
Semiconductor device
Grant 9,093,322 - Meyer , et al. July 28, 2 | 2015-07-28 |
Semiconductor Device
App 20140357075 - Meyer; Thorsten ; et al. | 2014-12-04 |
Workpiece With Semiconductor Chips, Semiconductor Device And Method For Producing A Workpiece With Semiconductor Chips
App 20140332937 - Brunnbauer; Markus ; et al. | 2014-11-13 |
Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips
Grant 8,779,563 - Brunnbauer , et al. July 15, 2 | 2014-07-15 |
Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads
Grant 8,741,690 - Meyer , et al. June 3, 2 | 2014-06-03 |
Workpiece with Semiconductor Chips, Semiconductor Device and Method for Producing a Workpiece with Semiconductor Chips
App 20130228904 - Brunnbauer; Markus ; et al. | 2013-09-05 |
Structure for electrostatic discharge in embedded wafer level packages
Grant 8,309,454 - Brunnbauer , et al. November 13, 2 | 2012-11-13 |
Semiconductor package and multichip arrangement having a polymer layer and an encapsulant
Grant 8,258,633 - Sezi , et al. September 4, 2 | 2012-09-04 |
Packaged Semiconductor Device with Encapsulant Embedding Semiconductor Chip that Includes Contact Pads
App 20120208319 - Meyer; Thorsten ; et al. | 2012-08-16 |
Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads
Grant 8,183,696 - Meyer , et al. May 22, 2 | 2012-05-22 |
Stacked semiconductor chips
Grant 8,076,784 - Brunnbauer , et al. December 13, 2 | 2011-12-13 |
Semiconductor Package and Manufacturing Method
App 20110241222 - Sezi; Recai ; et al. | 2011-10-06 |
Electronic Device and Manufacturing Method
App 20110241218 - Meyer; Thorsten ; et al. | 2011-10-06 |
Semiconductor device including a copolymer layer
Grant 7,952,200 - Meyer , et al. May 31, 2 | 2011-05-31 |
Stacked Semiconductor Chips
App 20110024918 - Brunnbauer; Markus ; et al. | 2011-02-03 |
Stacked semiconductor chips
Grant 7,867,878 - Brunnbauer , et al. January 11, 2 | 2011-01-11 |
NOR and NAND memory arrangement of resistive memory elements
Grant 7,746,683 - Hoffmann , et al. June 29, 2 | 2010-06-29 |
Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips
Grant 7,687,895 - Brunnbauer , et al. March 30, 2 | 2010-03-30 |
Semiconductor Device Including A Copolymer Layer
App 20100013091 - Meyer; Thorsten ; et al. | 2010-01-21 |
Semiconductor Device
App 20090294961 - Meyer; Thorsten ; et al. | 2009-12-03 |
Stacked Semiconductor Chips
App 20090079089 - Brunnbauer; Markus ; et al. | 2009-03-26 |
Semiconductor Device
App 20090014871 - Meyer; Thorsten ; et al. | 2009-01-15 |
Method for the metalization of an insulator and/or a dielectric
Grant 7,476,412 - Lowack , et al. January 13, 2 | 2009-01-13 |
Workpiece with Semiconductor Chips, Semiconductor Device and Method for Producing a Workpiece with Semiconductor Chips
App 20080265383 - Brunnbauer; Markus ; et al. | 2008-10-30 |
Semiconductor Arrangement Having a Resistive Memory
App 20080191197 - Walter; Andreas ; et al. | 2008-08-14 |
Integrated Circuit Having Resistive Memory
App 20080142774 - Walter; Andreas ; et al. | 2008-06-19 |
NOR and NAND Memory Arrangement of Resistive Memory Elements
App 20070242496 - Hoffmann; Kurt ; et al. | 2007-10-18 |
Method for producing a porous coating
Grant 7,273,821 - Sezi September 25, 2 | 2007-09-25 |
Semiconductor arrangement with non-volatile memories
App 20070194301 - Sezi; Recai ; et al. | 2007-08-23 |
Method for Forming Memory Layers
App 20070164276 - Engl; Reimund ; et al. | 2007-07-19 |
Poly-o-hydroxyamide, polybenzoxazole from the poly-o-hydroxyamide, electronic component including a polybenzoxazole, and processes for producing the same
Grant 7,244,803 - Sezi , et al. July 17, 2 | 2007-07-17 |
Memory cell, method for the production thereof and use of a composition therefor
Grant 7,238,964 - Walter , et al. July 3, 2 | 2007-07-03 |
Resistive memory for low-voltage applications
Grant 7,211,856 - Sezi , et al. May 1, 2 | 2007-05-01 |
Material and cell structure for storage applications
App 20060237716 - Sezi; Recai ; et al. | 2006-10-26 |
Bis-o-nitrophenols derivatives and poly-o-hydroxyamides, polybenzoxazoles, materials, and microelectronic devices made therefrom
Grant 7,125,814 - Sezi October 24, 2 | 2006-10-24 |
Methods for producing a dielectric, dielectric having self-generating pores, monomer for porous dielectrics, process for preparing poly-o-hydroxyamides, process for preparing ploybenzoxazoles, and processes for producing an electronic component
App 20060214139 - Sezi; Recai ; et al. | 2006-09-28 |
Methods for producing a dielectric, dielectric having self-generating pores, monomer for porous dielectrics, process for preparing poly-o-hydroxyamides, process for preparing polybenzoxazoles, and processes for producing an electronic component
Grant 7,108,807 - Sezi , et al. September 19, 2 | 2006-09-19 |
Polybenzoxazoles from poly-o-hydroxyamide, novel poly-o-hydroxyamides, preparation processes therefor, and their application in microelectronics
Grant 7,070,904 - Sezi July 4, 2 | 2006-07-04 |
Coating material for electronic components
Grant 7,064,176 - Halik , et al. June 20, 2 | 2006-06-20 |
Use of polybenzoxazoles (PBOS) for adhesion
Grant 7,052,936 - Walter , et al. May 30, 2 | 2006-05-30 |
Wiring process
Grant 7,028,399 - Lowack , et al. April 18, 2 | 2006-04-18 |
Microelectronic process and structure
Grant 7,022,582 - Sezi April 4, 2 | 2006-04-04 |
Layer assembly and method for producing a layer assembly
App 20060014374 - Barth; Hans-Joachim ; et al. | 2006-01-19 |
Dicarboxylic acids for dielectrics having barrier effect against copper diffusion
App 20050203269 - Walter, Andreas ; et al. | 2005-09-15 |
Resistive memory for low-voltage applications
App 20050186737 - Sezi, Recai ; et al. | 2005-08-25 |
Memory cell, method for the production thereof and use of a composition therefor
App 20050179033 - Walter, Andreas ; et al. | 2005-08-18 |
Component having at least two mutually adjacent insulating layers and corresponding production method
Grant 6,905,726 - Lowack , et al. June 14, 2 | 2005-06-14 |
Poly-o-hydroxyamides, Polybenzoxazoles, Processes For Producing Poly-o-hydroxyamides, Processes For Producing Polybenzoxazoles, Dielectrics Including A Polybenzoxazole, Electronic Components Including The Dielectrics, And Processes For Manufacturing The Electronic Components
Grant 6,900,284 - Lowack , et al. May 31, 2 | 2005-05-31 |
Photosensitive formulation for buffer coatings, film containing the photosensitive formulation, and method for fabricating electronics with the photosensitive formulation
Grant 6,884,567 - Sezi April 26, 2 | 2005-04-26 |
Bis-o-aminophenol derivatives, poly-o-hydroxyamides, and polybenzoxazoles, usable in photosensitive compositions, dielectrics, buffer coatings, and microelectronics
Grant 6,866,980 - Sezi March 15, 2 | 2005-03-15 |
Bis-o-aminophenols and processes for producing bis-o-aminophenols
Grant 6,861,560 - Walter , et al. March 1, 2 | 2005-03-01 |
Composition and process for the production of a porous layer using the composition
Grant 6,861,479 - Sezi March 1, 2 | 2005-03-01 |
Antireflective, layer-forming composition, layer configuration containing the antireflective layer, and process for producing the antireflective layer
Grant 6,835,456 - Walter , et al. December 28, 2 | 2004-12-28 |
Polybenzoxazole precursors, photoresist solution, polybenzoxazole, and process for preparing a polybenzoxazole precursor
Grant 6,824,949 - Haussmann , et al. November 30, 2 | 2004-11-30 |
Phenyl-linked oxazole cyanates as dielectrics having good adhesive and filling properties
Grant 6,824,642 - Walter , et al. November 30, 2 | 2004-11-30 |
Poly-o-hydroxamide, Polybenzoxazole, And Electronic Component Including A Dielectric Having A Barrier Effect Against Copper Diffusion, And Processes For Preparing Poly-o-hydroxyamides, Polybenzoxazoles, And Electronic Components
Grant 6,806,344 - Sezi , et al. October 19, 2 | 2004-10-19 |
Adhesively bonded chip-and wafer stacks
Grant 6,787,244 - Sezi , et al. September 7, 2 | 2004-09-07 |
Coating material for electronic components
App 20040138406 - Halik, Marcus ; et al. | 2004-07-15 |
Microelectronic process and structure
App 20040126957 - Sezi, Recai | 2004-07-01 |
Poly-o-hydroxyamide, polybenzoxazole from the poly-o-hydroxyamide, electronic component including a polybenzoxazole, and processes for producing the same
App 20040082756 - Sezi, Recai ; et al. | 2004-04-29 |
Poly-o-hydroxyamide, polybenzoxazole, and electronic component including a dielectric having a barrier effect against copper diffusion, and processes for preparing poly-o-hydroxyamides, polybenzoxazoles, and electronic components
App 20040063895 - Sezi, Recai ; et al. | 2004-04-01 |
Method of producing an adhesive bond
App 20040060635 - Diepers, Heinrich ; et al. | 2004-04-01 |
Bis-o-aminophenols and processes for producing bis-o-aminophenols
App 20040049081 - Walter, Andreas ; et al. | 2004-03-11 |
Methods for producing a dielectric, dielectric having self-generating pores, monomer for porous dielectrics, process for preparing poly-o-hydroxyamides, process for preparing polybenzoxazoles, and processes for producing an electronic component
App 20040028821 - Sezi, Recai ; et al. | 2004-02-12 |
Component Having At Least Two Mutually Adjacent Insulating Layers And Corresponding Production Method
App 20030207095 - Lowack, Klaus ; et al. | 2003-11-06 |
Metallizing method for dielectrics
Grant 6,635,410 - Haussmann , et al. October 21, 2 | 2003-10-21 |
Poly-o-hydroxyamides, polybenzoxazoles, processes for producing poly-o-hydroxyamides, processes for producing polybenzoxazoles, dielectrics including a polybenzoxazole, electronic components including the dielectrics, and processes for manufacturing the electronic components
App 20030176623 - Lowack, Klaus ; et al. | 2003-09-18 |
Adhesively bonded chip-and wafer stacks
App 20030150557 - Sezi, Recai ; et al. | 2003-08-14 |
Use of polybenzoxazoles (PBOS) for adhesion
App 20030149207 - Walter, Andreas ; et al. | 2003-08-07 |
Process for producing structured protective and insulating layers
Grant 6,599,687 - Gunther , et al. July 29, 2 | 2003-07-29 |
Polybenzoxazoles from poly-o-hydroxyamide, novel poly-o-hydroxyamides, preparation processes therefor, and their application in microelectronics
App 20030134226 - Sezi, Recai | 2003-07-17 |
Bis-o-aminophenol derivatives, poly-o-hydroxyamides, and polybenzoxazoles, usable in photosensitive compositions, dielectrics, buffer coatings, and microelectronics
App 20030104311 - Sezi, Recai | 2003-06-05 |
Photosensitive formulation for buffer coatings, film containing the photosensitive formulation, and method for fabricating electronics with the photosensitive formulation
App 20030099904 - Sezi, Recai | 2003-05-29 |
Bis-o-nitrophenols derivatives and poly-o-hydroxyamides, polybenzoxazoles, materials, and microelectronic devices made therefrom
App 20030100698 - Sezi, Recai | 2003-05-29 |
Photosensitive formulation for buffer coatings, film including the formulation, and method for manufacturing electronics using the formulation
App 20030087190 - Sezi, Recai | 2003-05-08 |
Phenyl-linked oxazole cyanates as dielectrics having good adhesive and filling properties
App 20030060573 - Walter, Andreas ; et al. | 2003-03-27 |
Photo-cross-linkable polymers, method of producing a cross-linked polymer, cross-linked polymer, and cross-linked polymer coating
App 20030027885 - Halik, Marcus ; et al. | 2003-02-06 |
Composition and process for the production of a porous layer using the composition
App 20020198277 - Sezi, Recai | 2002-12-26 |
Antireflective, layer-forming composition, layer configuration containing the antireflective layer, and process for producing the antireflective layer
App 20020198294 - Walter, Andreas ; et al. | 2002-12-26 |
Wiring process
App 20020184756 - Lowack, Klaus ; et al. | 2002-12-12 |
Metallizing method for dielectrics
App 20020172892 - Haussmann, Joerg ; et al. | 2002-11-21 |
Method for the metalization of an insulator and/or a dielectric
App 20020142092 - Lowack, Klaus ; et al. | 2002-10-03 |
Method for producing a porous coating
App 20020132061 - Sezi, Recai | 2002-09-19 |
Polybenzoxazole precursors, photoresist solution, polybenzoxazole, and process for preparing a polybenzoxazole precursor
App 20020086968 - Haussmann, Jorg ; et al. | 2002-07-04 |
Bis-o-aminophenols and o-aminophenolcarboxylic acids and process for preparing the same
App 20020010370 - Haussmann, J?ouml;rg ; et al. | 2002-01-24 |
O-aminophenolcarboxylic acid and o-aminothiophenolcarboxylic acid
App 20010056203 - Sezi, Recai ; et al. | 2001-12-27 |
Process for metallizing at least one insulating layer of a component
App 20010036721 - Dallner, Claus ; et al. | 2001-11-01 |
UV-hardenable and thermally hardenable epoxy resins for underfilling electrical and electronic components
Grant 6,037,043 - Lehner , et al. March 14, 2 | 2000-03-14 |
Preparation of poly-o-hydroxyamides and poly o-mercaptoamides
Grant 5,973,202 - Sezi , et al. October 26, 1 | 1999-10-26 |
Preparation of poly-o-hydroxyamides and poly o-mercaptoamides
Grant 5,922,825 - Sezi , et al. July 13, 1 | 1999-07-13 |
Photolithographic pattern generation
Grant 5,851,733 - Sezi , et al. December 22, 1 | 1998-12-22 |
Preparation of poly-O-hydroxyamides and poly O-mercaptoamides
Grant 5,807,969 - Sezi , et al. September 15, 1 | 1998-09-15 |
Preparation of poly-O-hydroxyamides and poly O-mercaptoamides
Grant 5,783,654 - Sezi , et al. July 21, 1 | 1998-07-21 |
Preparation of poly-o-hydroxyamides and poly-o-mercaptoamides
Grant 5,760,162 - Sezi , et al. June 2, 1 | 1998-06-02 |
Dry-developable positive resist
Grant 5,733,706 - Sezi , et al. March 31, 1 | 1998-03-31 |
Preparation of poly-o-hydroxyamides and poly o-mercaptoamides
Grant 5,726,279 - Sezi , et al. March 10, 1 | 1998-03-10 |
Mixed polymers
Grant 5,703,186 - Sezi , et al. December 30, 1 | 1997-12-30 |
Production of photolithographic structures
Grant 5,384,220 - Sezi , et al. January 24, 1 | 1995-01-24 |
Method for the production of a bottom resist
Grant 5,368,901 - Leuschner , et al. November 29, 1 | 1994-11-29 |
Method for producing a resist structure
Grant 5,262,283 - Sezi , et al. * November 16, 1 | 1993-11-16 |
Photostructuring process
Grant 5,250,375 - Sebald , et al. October 5, 1 | 1993-10-05 |
Method for dimensionally accurate structure transfer in bilayer technique wherein a treating step with a bulging agent is employed after development
Grant 5,234,793 - Sebald , et al. August 10, 1 | 1993-08-10 |
Etch-resistant deep ultraviolet resist process having an aromatic treating step after development
Grant 5,173,393 - Sezi , et al. December 22, 1 | 1992-12-22 |
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