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name:-0.0059950351715088
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Seto; Yoshiki Patent Filings

Seto; Yoshiki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Seto; Yoshiki.The latest application filed is for "method for producing particles".

Company Profile
3.5.7
  • Seto; Yoshiki - Shizuoka JP
  • SETO; Yoshiki - Tokyo JP
  • Seto; Yoshiki - Hiratsuka JP
  • Seto, Yoshiki - Hiratsuka-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method for producing particles
Grant 10,772,836 - Onoue , et al. Sept
2020-09-15
Method For Producing Particles
App 20190076361 - ONOUE; Satomi ;   et al.
2019-03-14
Method And Apparatus For Manufacturing Lead Wire For Solar Cell
App 20180240930 - SETO; Yoshiki ;   et al.
2018-08-23
Method and apparatus for manufacturing lead wire for solar cell
Grant 9,991,410 - Seto , et al. June 5, 2
2018-06-05
Method And Apparatus For Manufacturing Lead Wire For Solar Cell
App 20140357015 - Seto; Yoshiki ;   et al.
2014-12-04
Method Of Annealing Copper Wire For Interconnector
App 20140224387 - Seto; Yoshiki ;   et al.
2014-08-14
Flanged parts producing method, and heat-treating device and heat treating method therefor
Grant 7,147,731 - Tanaka , et al. December 12, 2
2006-12-12
Liquid phase diffusion bonding method for dissimilar metal sheets and liquid phase diffusion bonding apparatus for the same
Grant 7,119,309 - Matsuoka , et al. October 10, 2
2006-10-10
Liquid phase diffusion bonding method for dissimilar metal sheets and liquid phase diffusion bonding apparatus for the same
App 20050178819 - Matsuoka, Takashi ;   et al.
2005-08-18
Flanged parts producing method, and heat-treating device and heat treating method therefor
App 20040169321 - Tanaka, Yoshimasa ;   et al.
2004-09-02
Constrained hardening method and apparatus for deformed bar workpieces
Grant 6,328,829 - Kato , et al. December 11, 2
2001-12-11

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