Seto; Hideaki
Patent Applications and Registrations
Patent applications and USPTO patent grants for Seto; Hideaki.The latest application filed is for "substrate laser marking".
- Seto; Hideaki - Tsukuba-Shi JP
- Seto; Hideaki - Tsukuba JP
- Seto; Hideaki - Kuzatsu JP
- Seto; Hideaki - Kusatsu JP
| Patent | Date |
|---|---|
| Substrate Laser Marking App 20080135981 - Yamamoto; Haruhiko ; et al. | 2008-06-12 |
| Substrate laser marking Grant 7,371,659 - Yamamoto , et al. May 13, 2 | 2008-05-13 |
| Wafer chucking apparatus for spin processor Grant 7,201,176 - Kuroki , et al. April 10, 2 | 2007-04-10 |
| Wafer chucking apparatus and method for spin processor Grant 7,056,392 - Kuroki , et al. June 6, 2 | 2006-06-06 |
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