Sethuraman; Anantha

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sethuraman; Anantha.The latest application filed is for "methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool".

Company Profile

0.11.10

Sethuraman; Anantha - Palo Alto CA US
Sethuraman; Anantha - Wilmington DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool Grant 8,831,767 - Lehman , et al. September 9, 2	2014-09-09
Methods And Systems For Monitoring A Parameter Of A Measurement Device During Polishing, Damage To A Specimen During Polishing, Or A Characteristic Of A Polishing Pad Or Tool App 20110313558 - Lehman; Kurt ; et al.	2011-12-22
Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool Grant 8,010,222 - Lehman , et al. August 30, 2	2011-08-30
Methods And Systems For Monitoring A Parameter Of A Measurement Device During Polishing, Damage To A Specimen During Polishing, Or A Characteristic Of A Polishing Pad Or Tool App 20080207089 - Lehman; Kurt ; et al.	2008-08-28
Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool Grant 7,332,438 - Lehman , et al. February 19, 2	2008-02-19
Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device Grant 7,175,503 - Lehman , et al. February 13, 2	2007-02-13
Methods and systems for detecting a presence of blobs on a specimen during a polishing process App 20060148383 - Lehman; Kurt ; et al.	2006-07-06
Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool App 20060131273 - Lehman; Kurt ; et al.	2006-06-22
Methods and systems for detecting a presence of blobs on a specimen during a polishing process Grant 7,052,369 - Lehman , et al. May 30, 2	2006-05-30
Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool Grant 7,030,018 - Lehman , et al. April 18, 2	2006-04-18
Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing Grant 6,935,922 - Lehman , et al. August 30, 2	2005-08-30
Systems and methods for characterizing a polishing process Grant 6,884,146 - Lehman , et al. April 26, 2	2005-04-26
Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing pad Grant 6,866,559 - Lehman , et al. March 15, 2	2005-03-15
Methods and systems for detecting a presence of blobs on a specimen during a polishing process App 20030190864 - Lehman, Kurt ; et al.	2003-10-09
Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing App 20030181132 - Lehman, Kurt ; et al.	2003-09-25
Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device App 20030181138 - Lehman, Kurt ; et al.	2003-09-25
Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool App 20030180973 - Lehman, Kurt ; et al.	2003-09-25
Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing pad App 20030181139 - Lehman, Kurt ; et al.	2003-09-25
Systems and methods for characterizing a polishing process App 20030181131 - Lehman, Kurt ; et al.	2003-09-25
Polishing slurries comprising two abrasive components and methods for their use Grant 5,693,239 - Wang , et al. December 2, 1	1997-12-02

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