Serizawa; Tooru

Patent Applications and Registrations

Patent applications and USPTO patent grants for Serizawa; Tooru.The latest application filed is for "separator for flat-type polymer electrolyte fuel cells".

Company Profile

0.8.11

Serizawa; Tooru - Tokyo-to JP
SERIZAWA; Tooru - Tokyo JP
Serizawa; Tooru - Shinjuku-ku JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Substrate for suspension, and production process thereof Grant 8,339,743 - Miura , et al. December 25, 2	2012-12-25
Separator For Flat-type Polymer Electrolyte Fuel Cells App 20120003567 - SERIZAWA; Tooru ; et al.	2012-01-05
Substrate For Suspension, And Production Process Thereof App 20120000698 - MIURA; Yoichi ; et al.	2012-01-05
Substrate for suspension, and production process thereof Grant 8,040,635 - Miura , et al. October 18, 2	2011-10-18
Separator for flat-type polymer electrolyte fuel cells Grant 8,039,168 - Serizawa , et al. October 18, 2	2011-10-18
Separator for fuel cells Grant 7,919,212 - Yagi , et al. April 5, 2	2011-04-05
Method for fabricating wiring board provided with passive element, and wiring board provided with passive element Grant 7,679,925 - Fukuoka , et al. March 16, 2	2010-03-16
Substrate For Suspension, And Production Process Thereof App 20090190263 - Miura; Yoichi ; et al.	2009-07-30
Separator For Flat-type Polymer Electrolyte Fuel Cells App 20090155663 - Serizawa; Tooru ; et al.	2009-06-18
Separator for Polymer Electrolyte Type Fuel Cell and Process for Producing the Same App 20080113253 - Yagi; Hiroshi ; et al.	2008-05-15
Separator For Polymer Electrolyte Type Fuel Cells And Its Fabrication Process App 20080090108 - Uchida; Yasuhiro ; et al.	2008-04-17
Separator For Fuel Cells App 20070238005 - Yagi; Hiroshi ; et al.	2007-10-11
Method for fabricating wiring board provided with passive element, and wiring board provided with passive element App 20060254050 - Fukuoka; Yoshitaka ; et al.	2006-11-16
Method for fabricating wiring board provided with passive element Grant 7,100,276 - Fukuoka , et al. September 5, 2	2006-09-05
Method for fabricating wiring board provided with passive element, and wiring board provided with passive element App 20050126820 - Fukuoka, Yoshitaka ; et al.	2005-06-16
Magnetic head suspension with both protected wiring and unprotected wiring, in addition to terminals Grant 6,894,875 - Serizawa , et al. May 17, 2	2005-05-17
Wiring board provided with passive element and cone shaped bumps Grant 6,872,893 - Fukuoka , et al. March 29, 2	2005-03-29
Method for fabricating wiring board provided wiht passive element, and wiring board provided with passive element App 20020179329 - Fukuoka, Yoshitaka ; et al.	2002-12-05
Magnetic head suspension and method of fabricating the same App 20020181157 - Serizawa, Tooru ; et al.	2002-12-05

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