Serizawa; Koji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Serizawa; Koji.The latest application filed is for "mounting substrate suitable for use to install surface mount components".

Company Profile

0.10.7

Serizawa; Koji - Fujisawa JP
Serizawa; Koji - Yokohama JP
Serizawa; Koji - Shonandai-Fujsawa JP
Serizawa; Koji - Zama JP
Serizawa; Koji - Shonandai-Fujisawa JP
Serizawa; Koji - Aizuwakamatsu JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic component with varying rigidity leads using Pb-free solder Grant 7,911,062 - Nakatsuka , et al. March 22, 2	2011-03-22
Mounting Substrate Suitable for Use to Install Surface Mount Components App 20080261001 - Nakatsuka; Tetsuya ; et al.	2008-10-23
Mounting Structure App 20080062665 - NAKATSUKA; TETSUYA ; et al.	2008-03-13
Electronic Component With Lead Using Pb-free Solder App 20070210139 - NAKATSUKA; Tetsuya ; et al.	2007-09-13
Semiconductor device having solder bumps reliably reflow solderable Grant 7,145,236 - Miura , et al. December 5, 2	2006-12-05
Electronic device Grant 6,774,490 - Soga , et al. August 10, 2	2004-08-10
Electron device and semiconductor device App 20030186072 - Soga, Tasao ; et al.	2003-10-02
Electron device and semiconductor device Grant 6,555,052 - Soga , et al. April 29, 2	2003-04-29
Semiconductor device having solder bumps reliably reflow solderable App 20030030149 - Miura, Kazuma ; et al.	2003-02-13
Semiconductor module having solder bumps and solder portions with different materials and compositions and circuit substrate Grant 6,486,411 - Miura , et al. November 26, 2	2002-11-26
Electron device and semiconductor device App 20020066583 - Soga, Tasao ; et al.	2002-06-06
Semiconductor module and circuit substrate App 20010050181 - Miura, Kazuma ; et al.	2001-12-13
Method and apparatus of manufacturing an electronic circuit board Grant 6,204,490 - Soga , et al. March 20, 2	2001-03-20
Film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof Grant 5,804,872 - Miyano , et al. September 8, 1	1998-09-08
Flexible cable structure for magnetic disk drives Grant 5,760,997 - Koyanagi , et al. June 2, 1	1998-06-02
Film carrier tape and laminated multi-chip semiconductor device incorporating the same Grant 5,631,497 - Miyano , et al. May 20, 1	1997-05-20
Electronic circuit packages Grant 4,326,238 - Takeda , et al. April 20, 1	1982-04-20

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