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Patent applications and USPTO patent grants for Seppala; Bryan R..The latest application filed is for "mems sensor with integrated asic packaging".
Patent | Date |
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Mems Sensor With Integrated Asic Packaging App 20110227173 - Seppala; Bryan R. ;   et al. | 2011-09-22 |
System and method for sealing a MEMS device Grant 7,736,946 - Seppala , et al. June 15, 2 | 2010-06-15 |
Automated Preform Attach For Vacuum Packaging App 20090014499 - Seppala; Bryan R. ;   et al. | 2009-01-15 |
System And Method For Sealing A Mems Device App 20080188035 - Seppala; Bryan R. ;   et al. | 2008-08-07 |
Process for manufacturing a semiconductor device bump electrode using a rapid thermal anneal Grant 5,665,639 - Seppala , et al. September 9, 1 | 1997-09-09 |
Compliant pin Grant 4,586,778 - Walter , et al. May 6, 1 | 1986-05-06 |
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