loadpatents
Patent applications and USPTO patent grants for Seol; Yong Jin.The latest application filed is for "semiconductor package".
Patent | Date |
---|---|
Semiconductor package integrating active and passive components with electromagnetic shielding Grant 10,825,775 - Kang , et al. November 3, 2 | 2020-11-03 |
Fan-out semiconductor package Grant 10,541,221 - Seol , et al. Ja | 2020-01-21 |
Semiconductor Package App 20190371731 - KANG; Myung Sam ;   et al. | 2019-12-05 |
Fan-out semiconductor package module Grant 10,340,245 - Seol , et al. | 2019-07-02 |
Fan-out Semiconductor Package App 20190198429 - KANG; Myung Sam ;   et al. | 2019-06-27 |
Fan-out Semiconductor Package App 20190164926 - Seol; Yong Jin ;   et al. | 2019-05-30 |
Fan-out semiconductor package Grant 10,229,865 - Seol , et al. | 2019-03-12 |
Fan-out semiconductor package module Grant 10192844 - | 2019-01-29 |
Fan-out Semiconductor Package Module App 20180158791 - SEOL; Yong Jin ;   et al. | 2018-06-07 |
Fan-out semiconductor package module Grant 9,991,219 - Seol , et al. June 5, 2 | 2018-06-05 |
Fan-out Semiconductor Package Module App 20180061801 - SEOL; Yong Jin ;   et al. | 2018-03-01 |
Fan-out semiconductor package and method of manufacturing same Grant 9,899,331 - Lee , et al. February 20, 2 | 2018-02-20 |
Fan-out Semiconductor Package Module App 20170373035 - SEOL; Yong Jin ;   et al. | 2017-12-28 |
Fan-out Semiconductor Package App 20170373029 - SEOL; Yong Jin ;   et al. | 2017-12-28 |
Fan-out Semiconductor Package And Method Of Manufacturing Same App 20170287825 - LEE; Yong Koon ;   et al. | 2017-10-05 |
Fan-out Semiconductor Package And Method Of Manufacturing Same App 20170287839 - LEE; Yong Koon ;   et al. | 2017-10-05 |
Cable, And Input Apparatus Including The Same, And Computer Apparatus App 20140062811 - SEOL; Yong Jin | 2014-03-06 |
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