Seok; Seungdae
Patent Applications and Registrations
Patent applications and USPTO patent grants for Seok; Seungdae.The latest application filed is for "semiconductor substrate alignment device and a semiconductor substrate bonding system using the same".
- Seok; Seungdae - Seongnam-si KR
- Seok; SeungDae - Yongin-si KR
| Patent | Date |
|---|---|
| Wafer to wafer bonding apparatuses Grant 11,443,965 - Lim , et al. September 13, 2 | 2022-09-13 |
| Semiconductor Substrate Alignment Device And A Semiconductor Substrate Bonding System Using The Same App 20220068688 - JO; Gwanghee ; et al. | 2022-03-03 |
| Wafer To Wafer Bonding Apparatus, Wafer To Wafer Bonding System, And Wafer To Wafer Bonding Method App 20210143030 - Lim; Kyeongbin ; et al. | 2021-05-13 |
| Wafer To Wafer Bonding Methods And Wafer To Wafer Bonding Apparatuses App 20210005475 - LIM; Kyeongbin ; et al. | 2021-01-07 |
| Bonding apparatus Grant 10,784,130 - Lee , et al. Sept | 2020-09-22 |
| Bonding Apparatus App 20180174871 - LEE; Joong-Ha ; et al. | 2018-06-21 |
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