Seok; Seung-Dae
Patent Applications and Registrations
Patent applications and USPTO patent grants for Seok; Seung-Dae.The latest application filed is for "bonding stage and bonding apparatus comprising the same".
- Seok; Seung-Dae - Yongin-si KR
- Seok; Seung Dae - Suwon-si KR
- SEOK; Seung Dae - Yingin-si KR
- Seok; Seung Dae - Seongnam-si KR
| Patent | Date |
|---|---|
| Bonding stage and bonding apparatus comprising the same Grant 10,058,952 - Seok , et al. August 28, 2 | 2018-08-28 |
| Bonding Stage and Bonding Apparatus Comprising the Same App 20170136570 - Seok; Seung Dae ; et al. | 2017-05-18 |
| Bonding head and die bonding apparatus having the same Grant 9,620,476 - Lee , et al. April 11, 2 | 2017-04-11 |
| Semiconductor manufacturing apparatuses comprising bonding heads Grant 9,508,577 - Lee , et al. November 29, 2 | 2016-11-29 |
| Apparatus for bonding semiconductor chips Grant 9,431,365 - Seok , et al. August 30, 2 | 2016-08-30 |
| Apparatus For Bonding Semiconductor Chips App 20160079199 - SEOK; Seung-dae ; et al. | 2016-03-17 |
| Semiconductor Manufacturing Apparatuses And Methods Thereof App 20150155210 - LEE; Byung Joon ; et al. | 2015-06-04 |
| Bonding Head And Die Bonding Apparatus Having The Same App 20150129135 - LEE; Hang Lim ; et al. | 2015-05-14 |
| Chip Bonding Apparatus App 20130248114 - SEOK; Seung Dae ; et al. | 2013-09-26 |
| Chip Bonding Apparatus And Chip Bonding Method Using The Same App 20130139380 - LEE; Byung Joon ; et al. | 2013-06-06 |
| Wafer bonding apparatus App 20100071847 - Shin; Jae Bong ; et al. | 2010-03-25 |
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