| Patent | Date |
|---|
Semiconductor Package
App 20200135631 - SEO; Young Kwan ; et al. | 2020-04-30 |
Semiconductor Package
App 20200118985 - CHAE; Seung Hun ; et al. | 2020-04-16 |
Organic silver complexes, their preparation methods and their methods for forming thin layers
Grant 9,914,743 - Chung , et al. March 13, 2 | 2018-03-13 |
Resin composition, printed circuit board using the composition, and method of manufacturing the same
Grant 9,733,565 - Seo , et al. August 15, 2 | 2017-08-15 |
Organic Silver Complexes, Their Preparation Methods and Their Methods for Forming Thin Layers
App 20160194339 - Chung; Kwang-Choon ; et al. | 2016-07-07 |
Etching solutions
Grant 9,365,935 - Chung , et al. June 14, 2 | 2016-06-14 |
Resin Composition, Printed Circuit Board Using The Composition, And Method Of Manufacturing The Same
App 20150050585 - SEO; Young Kwan ; et al. | 2015-02-19 |
Resin Composition, Printed Circuit Board Using The Composition, And Method Of Manufacturing The Same
App 20150050473 - SEO; Young Kwan ; et al. | 2015-02-19 |
Conductive Polymer Composition And Conductive Film Using The Same
App 20140370297 - Kim; Jun Young ; et al. | 2014-12-18 |
Surface modified silica by alkyl sulfonated tetrazole compound, preparing method thereof, and resin composition containing the same
Grant 8,900,697 - Seo , et al. December 2, 2 | 2014-12-02 |
Etching Solutions
App 20140263185 - Chung; Kwang Choon ; et al. | 2014-09-18 |
Etching Solutions
Grant 8,821,753 - Chung , et al. September 2, 2 | 2014-09-02 |
Surface Modified Silica By Alkyl Sulfonated Tetrazole Compound, Preparing Method Thereof, And Resin Composition Containing The Same
App 20140187677 - Seo; Young Kwan ; et al. | 2014-07-03 |
Resin Composition For Printed Circuit Board, Insulating Film, Prepreg, And Printed Circuit Board
App 20140186593 - Seo; Young Kwan ; et al. | 2014-07-03 |
Organic Silver Complexes, Their Preparation Methods and Their Methods for Forming Thin Layers
App 20140179944 - Chung; Kwang-Choon ; et al. | 2014-06-26 |
Organic silver complexes, their preparation methods and their methods for forming thin layers
Grant 8,679,242 - Chung , et al. March 25, 2 | 2014-03-25 |
Alkyl Sulfonated Tetrazole Compound, Preparing Method Thereof, And Epoxy Resin Containing The Same, And Substrate Produced Therefrom
App 20130209760 - SEO; Young Kwan ; et al. | 2013-08-15 |
Resin Substrate And Method Of Manufacturing The Same
App 20130157011 - Cho; Sung Nam ; et al. | 2013-06-20 |
Build-up Printed Circuit Board And Method Of Manufacturing The Same
App 20130133926 - Kim; Tae Hoon ; et al. | 2013-05-30 |
Etching Solutions
App 20130126478 - CHUNG; Kwang-Choon ; et al. | 2013-05-23 |
Compositions for forming reflecting layer having organic silver complexes, and method for preparing reflecting layer using same
Grant 8,445,578 - Chung , et al. May 21, 2 | 2013-05-21 |
Epoxy Resin Composition For Forming Printed Circuit Board, Printed Circuit Board Manufactured Therefrom, And Method For Manufacturing The Printed Circuit Board
App 20130118787 - Kim; Tae Hoon ; et al. | 2013-05-16 |
Inkjet ink composition
Grant 8,389,601 - Kim , et al. March 5, 2 | 2013-03-05 |
Etching solutions
Grant 8,366,958 - Chung , et al. February 5, 2 | 2013-02-05 |
Organic Silver Complexes, Their Preparation Methods and Their Methods for Forming Thin Layers
App 20130022761 - Chung; Kwang-Choon ; et al. | 2013-01-24 |
Organic silver complexes, their preparation methods and their methods for forming thin layers
Grant 8,226,755 - Chung , et al. July 24, 2 | 2012-07-24 |
Antibacterial composition containing organic silver complexes, antibacterial treatment methods using the same and antibacterial formed article
Grant 8,211,453 - Chung , et al. July 3, 2 | 2012-07-03 |
Metal ink composition and method for forming the metal line using the same, and conductive pattern formed by using the metal ink composition
App 20110318541 - Kim; Tae Hoon ; et al. | 2011-12-29 |
Metal ink composition and method for forming the metal line using the same, and conductive pattern formed by using the metal ink composition
App 20110315436 - Kim; Tae Hoon ; et al. | 2011-12-29 |
Ink composition, metal thin film prepared using the same and method of preparing the same
App 20110236646 - Seo; Young Kwan ; et al. | 2011-09-29 |
Organic metal complexes for forming metal thin layer, ink including the same and method for forming metal thin layer using the same
App 20110151117 - Seo; Young Kwan ; et al. | 2011-06-23 |
Conductive inks and manufacturing method thereof
Grant 7,955,528 - Chung , et al. June 7, 2 | 2011-06-07 |
Substitutional electroless gold plating solution and method for forming gold plating layer using the same
App 20110129607 - LEE; Kwi Jong ; et al. | 2011-06-02 |
Inkjet Ink Composition
App 20110040014 - Kim; Tae-Hoon ; et al. | 2011-02-17 |
Metal Circuit Wiring Having Organic Resin For Adhesive Layers And Method Of Manufacturing The Same
App 20110030999 - LEE; Young-Il ; et al. | 2011-02-10 |
Conductive Inks and Manufacturing Method Thereof
App 20100247798 - Chung; Kwang-Choon ; et al. | 2010-09-30 |
Conductive inks and manufacturing method thereof
Grant 7,691,294 - Chung , et al. April 6, 2 | 2010-04-06 |
Antibacterial Composition Containing Organic Silver Complexes, Antibacterial Treatment Methods Using the Same and Antibacterial Formed Article
App 20090324739 - Chung; Kwang-Choon ; et al. | 2009-12-31 |
Compositions for Forming Reflecting Layer Having Organic Silver Complexes, and Method for Preparing Reflecting Layer Using Same
App 20090220696 - Chung; Kwang-Choon ; et al. | 2009-09-03 |
Organic Silver Complexes, Their Preparation Methods and Their Methods for Forming Thin Layers
App 20090120800 - Chung; Kwang-Choon ; et al. | 2009-05-14 |
Etching Solutions
App 20080277381 - Chung; Kwang-Choon ; et al. | 2008-11-13 |
Conductive Inks and Manufacturing Method Thereof
App 20080206488 - Chung; Kwang-Choon ; et al. | 2008-08-28 |
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