Seo; Youn Soo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Seo; Youn Soo.The latest application filed is for "inductor and method of manufacturing the same".

Company Profile

4.7.11

Seo; Youn Soo - Suwon-Si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Inductor and method of manufacturing the same Grant 11,087,916 - Cho , et al. August 10, 2	2021-08-10
Coil component and method for manufacturing the same Grant 10,586,648 - Lee , et al.	2020-03-10
Coil component and method for manufacturing the same Grant 10,529,476 - Park , et al. J	2020-01-07
Inductor And Method Of Manufacturing The Same App 20190295763 - CHO; Seok Young ; et al.	2019-09-26
Thin film type inductor and method of manufacturing the same Grant 10,304,620 - Lee , et al.	2019-05-28
Inductor Device And Method Of Manufacturing The Same App 20190139696 - KIM; In-Seok ; et al.	2019-05-09
Coil electronic component and manufacturing method thereof Grant 10,102,964 - Kim , et al. October 16, 2	2018-10-16
Coil Component And Method For Manufacturing The Same App 20180268988 - LEE; Sang Jae ; et al.	2018-09-20
Coil Component And Method For Manufacturing The Same App 20180158584 - PARK; Ho Sik ; et al.	2018-06-07
Chip electronic component and manufacturing method thereof Grant 9,966,178 - Seo , et al. May 8, 2	2018-05-08
Inductor Device And Method Of Manufacturing The Same App 20160293320 - Kim; In-Seok ; et al.	2016-10-06
Inductor And Method Of Manufacturing The Same App 20160276094 - Lee; Yong-Sam ; et al.	2016-09-22
Chip Electronic Component And Manufacturing Method Thereof App 20160247624 - SEO; Youn-Soo ; et al.	2016-08-25
Coil Electronic Component And Manufacturing Method Thereof App 20160240296 - KIM; Jin-Soo ; et al.	2016-08-18
Printed circuit board using paste bump and manufacturing method thereof Grant 7,973,248 - Mok , et al. July 5, 2	2011-07-05
Printed circuit board using paste bump and manufacturing method thereof App 20090064497 - Mok; Jee-Soo ; et al.	2009-03-12
Printed circuit board using paste bump and manufacturing method thereof App 20080283288 - Mok; Jee-Soo ; et al.	2008-11-20
Printed circuit board using paste bump and manufacturing method thereof App 20070107934 - Mok; Jee-Soo ; et al.	2007-05-17

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