Seo; Yeong Uk

Patent Applications and Registrations

Patent applications and USPTO patent grants for Seo; Yeong Uk.The latest application filed is for "method for manufacturing electrical interconnection structure".

Company Profile

0.13.16

Seo; Yeong Uk - Seoul KR
SEO; Yeong Uk - Bundang-gu Seongnam-si
Seo; Yeong Uk - Gyeonggi-do KR
Seo; Yeong Uk - Incheon KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Printed circuit board having buried circuit pattern and method for manufacturing the same Grant 9,888,569 - Lee , et al. February 6, 2	2018-02-06
Method For Manufacturing Electrical Interconnection Structure App 20180013251 - SEO; Yeong Uk ; et al.	2018-01-11
Matable Electrical Interconnection Structure And Electrical Device Having The Same App 20180013219 - YOON; Chong Kwang ; et al.	2018-01-11
Printed circuit board and the method for manufacturing the same Grant 9,642,246 - Nam , et al. May 2, 2	2017-05-02
Method and device of manufacturing printed circuit board having a solid component Grant 9,585,258 - Seo , et al. February 28, 2	2017-02-28
Printed circuit board and method of manufacturing the same Grant 9,549,465 - Yoo , et al. January 17, 2	2017-01-17
Printed circuit board and manufacturing method thereof Grant 9,532,462 - Seo , et al. December 27, 2	2016-12-27
Method for manufacturing a printed circuit board Grant 9,491,866 - Lee , et al. November 8, 2	2016-11-08
Printed circuit board and method of manufacturing the same Grant 9,433,107 - Seo , et al. August 30, 2	2016-08-30
Method of manufacturing an embedded printed circuit board Grant 9,265,161 - Ahn , et al. February 16, 2	2016-02-16
Printed Circuit Board And The Method For Manufacturing The Same App 20150257262 - Lee; Sang Myung ; et al.	2015-09-10
The Printed Circuit Board And The Method For Manufacturing The Same App 20150041184 - Nam; Myoung Hwa ; et al.	2015-02-12
Printed Circuit Board And Method Of Manufacturing The Same App 20140360761 - Seo; Hyun Seok ; et al.	2014-12-11
Method and Device of Manufacturing Printed Circuit Board App 20140345913 - Seo; Yeong Uk ; et al.	2014-11-27
Printed Circuit Board And Method Of Manufacturing The Same App 20140332255 - Yoo; Chang Woo ; et al.	2014-11-13
Structure for multi-row lead frame and semiconductor package capable of minimizing an under-cut Grant 8,659,131 - Kim , et al. February 25, 2	2014-02-25
Printed Circuit Board And The Method For Manufacturing The Same App 20130192881 - Lee; Sang Myung ; et al.	2013-08-01
Printed Circuit Board and Manufacturing Method Thereof App 20130112463 - Seo; Yeong Uk ; et al.	2013-05-09
Printed Circuit Board and Method of Manufacturing the Same App 20130062106 - Kim; Jin Su ; et al.	2013-03-14
Printed Circuit Board And Manufacturing Method Thereof App 20120255764 - Kim; Jin Su ; et al.	2012-10-11
Structure and Manufacture Method For Multi-Row Lead Frame and Semiconductor Package App 20110227208 - Kim; Ji Yun ; et al.	2011-09-22
Embedded Printed Circuit Board, Multi-layer Printed Circuit Board And Manufacturing Method Thereof App 20110127070 - Ahn; Chi Hee ; et al.	2011-06-02

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